0
TECHNICAL PAPERS

Micromachined Particle Filter With Low Power Dissipation

[+] Author and Article Information
Joon Mo Yang, Chih-Ming Ho

Mechanical and Aerospace Engineering Department, University of California, Los Angeles, Los Angeles, CA 90095

Xing Yang, Yu-Chong Tai

Electrical Engineering Department, California Institute of Technology, Pasadena, CA 91125

J. Fluids Eng 123(4), 899-908 (May 20, 2001) (10 pages) doi:10.1115/1.1399285 History: Received June 02, 2000; Revised May 20, 2001
Copyright © 2001 by ASME
Your Session has timed out. Please sign back in to continue.

References

Kittilsland,  G., Steme,  G., and Norden,  B., 1990, “A Submicron Particle Filter in Silicon,” Sens. Actuators A, 23, pp. 904–907.
van Rijn, C. J. M., and Elwenspoek, M. C., 1995, “Micro Filtration Membrane Sieve with Silicone Micro Machining for Industrial and Biomedical Application,” Proceedings of IEEE the Eighth Workshop on Micro Electro Mechanical Systems, Amsterdam, the Netherlands, pp. 83–87.
van Rijn,  C. J. M., van der Wekken,  M., Hijdam,  W., and Elwenpoek,  M. C., 1997, “Deflection and Maximum Load of Microfiltration Membrane Sieves Made with Silicon Micromachining,” J. Microelectromech. Syst., 6, pp. 48–54.
Yang,  X., Yang,  J. M., Tai,  Y.-C., and Ho,  C.-M., 1999, “Micromachined Membrane Particle Filters,” Sens. Actuators A, 73, pp. 184–191.
Chu,  W.-H., Chin,  R., Huen,  T., and Ferrari,  M., 1999, “Silicone Membrane Nanofilters from Sacrificial Oxide Removal,” J. Microelectromech. Syst., 8, pp. 34–42.
Tu,  J. K., Huen,  T., Szema,  R., and Ferrari,  M., 1999, “Filtration of Sub-100 nm Particles Using a Bulk-Micromachined, Direct-Bonded Silicon Filter,” Journal of Biomedical Microdevices, 1, pp. 113–119.
Ho, C.-M., Huang, P.-H., Yang, J. M., Lee, G.-B., and Tai, Y.-C., 1998, “Active Flow Control by Micro Systems,” FLOWCON, International Union of Theoretical and Applied Mechanics (IUTAM) Symposium of Mechanics of Passive and Active Flow Control, Gottingen, Germany, pp. 18–19.
Wieghardt,  K. E. G., 1953, “On the Resistance of Screens,” Aeronaut. Q., 4, pp. 186–192.
Derbunovich,  G. I., Zemskaya,  A. S., Repik,  Ye. U., and Sosedko,  Yu. P., 1984, “Hydraulic Drag of Perforated Plates,” Fluid Mech.-Sov. Res., 13, pp. 111–116.
Sampson,  R. A., 1891, “On Stokes’s Current Function,” Philos. Trans. R. Soc. London, Ser. A, 182, pp. 449–518.
Dagan,  Z., Weinbaum,  S., and Pfeffer,  R., 1982, “An Infinite Solution for the Creeping Motion Through an Orifice of Finite Length,” J. Fluid Mech., 115, pp. 505–523.
Tio,  K.-K., and Sadhal,  S. S., 1994, “Boundary Conditions for Stokes Flows Near a Porous Membrane,” Appl. Sci. Res., 52, pp. 1–20.
Hasegawa,  T., Suganuma,  M., and Watanabe,  H., 1997, “Anomaly of Excess Pressure Drops of the Flow Through Very Small Orifices,” Phys. Fluids, 9, pp. 1–3.
Ho,  C.-M., and Tai,  Y.-C., 1998, “Micro-Electro-Mechanical Systems (MEMS) and Fluid, Flows,” Annu. Rev. Fluid Mech., 30, pp. 579–612.
Harley,  J. C., Huang,  Y., Bau,  H. H., and Zemel,  J. N., 1995, “Gas Flow in Micro-Channels,” J. Fluid Mech., 284, pp. 257–274.
Ebert,  W. A., and Sparrow,  E. M., 1965, “Slip Flow in Rectangular and Annular Ducts,” ASME J. Basic Eng., 87, pp. 1018–1024.
Sreekanth, A. K., 1968, “Slip flow through long circular tubes,” Rarefied Gas Dynamics, Academic Press, pp. 667–680.
Donaldson,  J. R., and Schnabel,  R. B., 1987, “Computational Experience With Confidence Regions and Confidence Intervals for Nonlinear Least Squares,” Technometrics, 29, pp. 67–82.
Pelka,  J., Weiss,  M., Hoppe,  W., and Mewes,  D., 1989, “The Influence of Ion Scattering on Dry Etch Profiles,” J. Vac. Sci. Technol. B, 7, pp. 1483–1487.
Daubenspeck,  T. H., and Sukanek,  P. C., 1990, “Development of Chlorofluorocarbon/Oxygen Reactive Ion Etching Chemistry for Fine-Line Tungsten Patterning,” J. Vac. Sci. Technol. B, 8, pp. 586–595.
May,  P. W., Field,  D., and Klemperer,  D. F., 1993, “Simulation of Sidewall Profiles in Reactive Ion Etching,” J. Phys. D: Appl. Phys., 26, pp. 598–606.

Figures

Grahic Jump Location
Fabrication process for the membrane particle filters: (a) membrane (SiN) deposition (LPCVD), (b) KOH etching of Si wafer, (c) Hole patterning (RIE), (d) KOH etching of Si wafer, and (e) Parylene C deposition
Grahic Jump Location
Geometrical factors in the microfilter: (a) front and (b) side views
Grahic Jump Location
Photographs of the fabricated microfilters: (a) photograph of the entire microfilter, (b) filtering region with circular holes, (c) filtering region with hexagonal holes, and (d) filtering region with rectangular holes
Grahic Jump Location
Measured pressure drop as a function of the inlet velocity for various microfilters. Each line represents second-order fitting curve. For dimensions of each microfilter, see Table 1. (Uncertainties ΔP=±2 percent, Uncertainties Uin=±3.5 percent).
Grahic Jump Location
Calculation domain and boundary conditions for numerically predicting the pressure drop through the microfilter: (a) a 3-D domain, (b) a simplified axisymmetric domain 4, and (c) a magnified region around the hole
Grahic Jump Location
A nondimensionalized formula obtained from numerical calculations based on the calculation domain shown in Fig. 5. Some of the calculated results are shown as symbols: ○−d=12 μm, hexagonal, t=1 μm,β=45 percent,Δ−d=12 μm, circular, t=1 μm,β=45 percent,□−d=7.8 μm, hexagonal, t=3 μm,β=19 percent,x−d=8 μm, circular, t=3 μm,β=20 percent,⋄−d=4.8 μm, circular, t=3 μm,β=7 percent.
Grahic Jump Location
Comparison of the measured and the calculated pressure drop and the effect of slip boundary condition (α=1.0): (a) Filter I, (b) Filter II, and (c) Filter III. (Uncertainties ΔP=±2 percent, Uncertainties Uin=±3.5 percent).
Grahic Jump Location
A SEM picture of (a) a 1-μm-thick resolution grid, (b) a silicon nitride membrane, and (c) a Parylene coated membrane for measuring the thickness of the microfilter and the side-wall profile of the filtering hole
Grahic Jump Location
Images taken for measuring the hole size of the microfilter: (a) a SEM picture of one hole and (b) an image of the filtering holes from WYKO surface profiler
Grahic Jump Location
Probability density function (PDF) of the hole diameter obtained from the images using the WYKO surface profiler (davg=5.4 μm)
Grahic Jump Location
Comparison of the calculated pressure drop with 0.5 μm error in the measurement of the hole diameter for (a) Filter I, (b) Filter II, and (c) Filter III. (Uncertainties ΔP=±2 percent. Uncertainties Uin=±3.5 percent).
Grahic Jump Location
Side-wall profile of the filtering hole generated by the RIE process (a/b=0.5; dashed line is ideal case, solid line is real case)
Grahic Jump Location
Computational domain determined from the SEM picture shown in Fig. 8 for (a) a silicon nitride membrane and (b) a Parylene coated membrane
Grahic Jump Location
Comparison between the measured and the calculated pressure drop after the side-wall profile is taken into consideration for (a) Filter I, (b) Filter II, and (c) Filter III. (Uncertainties ΔP=±2 percent, Uncertainties Uin=±3.5 percent).
Grahic Jump Location
A nondimensionalized formula, which is established based on the geometry shown in Fig. 13 and a comparison with the measured pressure drop. (Uncertainties Kβ2/[3.5(t/d)+3]=±7.8 percent, Uncertainties Uind/βν=±3.9 percent).
Grahic Jump Location
Power required to sustain a desired flow rate as a function of the flow rate per unit area. See Table 1 for dimensions of each microfilter. Here, each line represents the curve fit of each data set. (Uncertainties Prequired=±6.4 percent, Uncertainties Uin=±3.5 percent).
Grahic Jump Location
Comparison of the power requirement with the same particle threshold (5 μm) but different opening factors. See Table 1 for dimensions of each microfilter. Here, each line represents the curve fit of each data set. (Uncertainties Prequired=±6.4 percent, Uncertainties Uin=±3.5 percent).

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In