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Research Papers: Flows in Complex Systems

Hydrodynamic Investigation of a Wafer Rinse Process Through Numerical Modeling and Flow Visualization Methods

[+] Author and Article Information
Chia-Yuan Chen

Department of Mechanical Engineering,
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: chiayuac@mail.ncku.edu.tw

Bivas Panigrahi

Department of Mechanical Engineering,
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: n18047068@mail.ncku.edu.tw

Kok-Shen Chong

Fab-14 Diffusion Engineering Department 1,
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: chongsam01@gmail.com

Wei-Hsien Li

Fab-14 Diffusion Engineering Department 1,
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: whli@tsmc.com

Yi-Li Liu

Fab-14 Diffusion Engineering Department 1,
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: ylliur@tsmc.com

Tsung-Yi Lu

Department of Mechanical Engineering,
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: n16051126@mail.ncku.edu.tw

1Corresponding author.

Contributed by the Fluids Engineering Division of ASME for publication in the JOURNAL OF FLUIDS ENGINEERING. Manuscript received August 11, 2017; final manuscript received January 30, 2018; published online April 10, 2018. Assoc. Editor: Hui Hu.

J. Fluids Eng 140(8), 081106 (Apr 10, 2018) (8 pages) Paper No: FE-17-1493; doi: 10.1115/1.4039368 History: Received August 11, 2017; Revised January 30, 2018

In the current semiconductor industrial scenario, wafers are rinsed in an overflow rinsing tank while being mounted on several lifters prior to most of its manufacturing processes. However, a major drawback of this overflow rinsing methodology is that some of the processing fluid stagnates due to the generated vortices in the regions between the side and middle lifters which entrap some of the flushed particles that further adhere and deteriorate the surface of the wafers. In this work, the hydrodynamics of the flow field inside the wafer rinsing tank with this original lifter orientation setup was studied and compared through numerical simulation and flow visualization using particle image velocimetry (PIV) method, and a strong agreement was found between them in terms of velocity calculation. A new lifter orientation setup was initiated and it was evidenced by the numerical simulation that with this new setup, the generated vortices which are situated opposite to the lifters tilting direction can be displaced significantly in terms of magnitude and distribution. This work presents a new wafer cleaning concept which shows its great potentials in improvement and implementation to the current in-line wafer batch fabrication process without modifying the original design of the rinsing tank.

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References

Zhang, F. , Busnaina, A. A. , Fury, M. A. , and Wang, S.-Q. , 2000, “The Removal of Deformed Submicron Particles From Silicon Wafers by Spin Rinse and Megasonics,” J. Electron. Mater., 29(2), pp. 199–204. [CrossRef]
Burdick, G. , Berman, N. , and Beaudoin, S. , 2001, “Describing Hydrodynamic Particle Removal From Surfaces Using the Particle Reynolds Number,” J. Nanopart. Res., 3(5–6), pp. 453–465. [CrossRef]
Okorn-Schmidt, H. F. , Holsteyns, F. , Lippert, A. , Mui, D. , Kawaguchi, M. , Lechner, C. , Frommhold, P. E. , Nowak, T. , Reuter, F. , and Piqué, M. B. , 2014, “Particle Cleaning Technologies to Meet Advanced Semiconductor Device Process Requirements,” ECS J. Solid State Sci. Technol., 3(1), pp. N3069–N3080. [CrossRef]
Karimi, P. , Kim, T. , Aceros, J. , Park, J. , and Busnaina, A. A. , 2010, “The Removal of Nanoparticles From Sub-Micron Trenches Using Megasonics,” Microelectron. Eng., 87(9), pp. 1665–1668. [CrossRef]
Chiang, C.-C. , Wu, B. , and Raghavan, S. , 2015, “Particle Deposition and Removal of Relevance to Wet Processing in Semiconductor Manufacturing,” Part. Sci. Technol., 33(5), pp. 546–553. [CrossRef]
Zhai, K. , He, Q. , Li, L. , and Ren, Y. , 2017, “Study on Chemical Mechanical Polishing of Silicon Wafer With Megasonic Vibration Assisted,” Ultrasonics, 80, pp. 9–14. [CrossRef] [PubMed]
Sohn, H.-S. , Hong, U. S. , Park, C.-G. , Lee, E.-K. , Lee, H.-J. , Brause, E. , and Park, J.-G. , 2007, “Removal of Backside Particles by a Single Wafer Megasonic System,” ECS Transactions, 11(2), pp. 95–100.
Vereecke, G. , Röhr, E. , and Heyns, M. , 1999, “Laser-Assisted Removal of Particles on Silicon Wafers,” J. Appl. Phys., 85(7), pp. 3837–3843. [CrossRef]
Tsai, C.-H. , and Peng, W.-S. , 2017, “Laser Cleaning Technique Using Laser-Induced Acoustic Streaming for Silicon Wafers,” J. Laser Micro/Nanoeng., 12(1), pp. 1–5. http://www.jlps.gr.jp/jlmn/upload/23d71ee7d3f3a4011cbab9223becf6d3.pdf
Estragnat, E. , Ng, D. , Kulkarni, M. , McMullen, D. , Bahten, K. , and Liang, H. , 2005, “Friction Forces in Post-CMP Cleaning Applications,” A2C2 Magazine, 8(1), pp. 14–78. https://www.cemag.us/article/2005/01/friction-forces-post-cmp-cleaning-applications
Kim, H. J. , Bohra, G. , Yang, H. , Ahn, S.-G. , Qin, L. , and Koli, D. , 2015, “Study of the Cross Contamination Effect on Post CMP In Situ Cleaning Process,” Microelectron. Eng., 136, pp. 36–41. [CrossRef]
Burdick, G. , Berman, N. , and Beaudoin, S. , 2005, “Hydrodynamic Particle Removal From Surfaces,” Thin Solid Films, 488(1–2), pp. 116–123. [CrossRef]
Reinhardt, K. , and Kern, W. , 2008, Handbook of Silicon Wafer Cleaning Technology, William Andrew, Norwich, NY.
Raccurt, O. , Tardif, F. , Kerber, L. , Lardin, T. , and Vareine, T. , 2003, “A Novel Tank for DI Water Reduction in MEMS Manufacturing,” J. Micromech. Microeng., 13(3), pp. 442–446. [CrossRef]
Hall, R. , Rosato, J. , Lindquist, P. , Jarvis, T. , Parry, T. , and Walters, R. , 1996, “Improving Rinse Efficiency With Automated Cleaning Tools,” Semicond. Int., 19(12), pp. 151–160.
Bay, S. T. , McConnell, C. F. , Thomas, H. K. , Izenson, M. G. , and Murthi, J. , 1995, “Computational Fluid Dynamic Modeling and Flow Visualization of an Enclosed Wet Processing System,” MRS Online Proc. Libr. Arch., 386, p. 35. [CrossRef]
Gomez, C. , Bennington, C. , and Taghipour, F. , 2010, “Investigation of the Flow Field in a Rectangular Vessel Equipped With a Side-Entering Agitator,” ASME J. Fluids Eng., 132(5), p. 051106. [CrossRef]
Ge, C.-Y. , Wang, J.-J. , Gu, X.-P. , and Feng, L.-F. , 2014, “CFD Simulation and PIV Measurement of the Flow Field Generated by Modified Pitched Blade Turbine Impellers,” Chem. Eng. Res. Des., 92(6), pp. 1027–1036. [CrossRef]
Chen, G. , Xiong, Q. , Morris, P. J. , Paterson, E. G. , Sergeev, A. , and Wang, Y. , 2014, “OpenFOAM for Computational Fluid Dynamics,” Not. AMS, 61(4), pp. 354–363.
Xiong, Q. , Aramideh, S. , Passalacqua, A. , and Kong, S.-C. , 2015, “Characterizing Effects of the Shape of Screw Conveyors in Gas–Solid Fluidized Beds Using Advanced Numerical Models,” ASME J. Heat Transfer, 137(6), p. 061008. [CrossRef]
Xiong, Q. , Aramideh, S. , Passalacqua, A. , and Kong, S.-C. , 2014, “BIOTC: An Open-Source CFD Code for Simulating Biomass Fast Pyrolysis,” Comput. Phys. Commun., 185(6), pp. 1739–1746. [CrossRef]
Park, J. , Derrandji-Aouat, A. , Wu, B. , Nishio, S. , and Jacquin, E. , 2008, “Uncertainty Analysis: Particle Imaging Velocimetry,” ITTC Recommended Procedures and Guidelines, International Towing Tank Conference (ITTC), Fukuoka, Japan, Sept. 14–20, pp. 1–12. https://ittc.info/media/1211/75-01-03-03.pdf
Xu, W. , Li, Q. , Wang, J. , and Jin, Y. , 2016, “Performance Evaluation of a New Cyclone Separator—Part II Simulation Results,” Sep. Purif. Technol., 160, pp. 112–116. [CrossRef]
Narasimha, M. , Brennan, M. , Holtham, P. , and Napier-Munn, T. , 2007, “A Comprehensive CFD Model of Dense Medium Cyclone Performance,” Miner. Eng., 20(4), pp. 414–426. [CrossRef]
Duan, L. , Wu, X. , Ji, Z. , Xiong, Z. , and Zhuang, J. , 2016, “The Flow Pattern and Entropy Generation in an Axial Inlet Cyclone With Reflux Cone and Gaps in the Vortex Finder,” Powder Technol., 303, pp. 192–202. [CrossRef]
Speziale, C. G. , and Thangam, S. , 1992, “Analysis of an RNG Based Turbulence Model for Separated Flows,” Int. J. Eng. Sci., 30(10), pp. 1379–1388. [CrossRef]
Launder, B. E. , and Spalding, D. B. , 1974, “The Numerical Computation of Turbulent Flows,” Comput. Methods Appl. Mech. Eng., 3(2), pp. 269–289. [CrossRef]
Chen, C.-Y. , Antón, R. , Hung, M.-Y. , Menon, P. , Finol, E. A. , and Pekkan, K. , 2014, “Effects of Intraluminal Thrombus on Patient-Specific Abdominal Aortic Aneurysm Hemodynamics Via Stereoscopic Particle Image Velocity and Computational Fluid Dynamics Modeling,” ASME J. Biomech. Eng., 136(3), p. 031001. [CrossRef]

Figures

Grahic Jump Location
Fig. 3

(a) Contours of velocity magnitude superimposed with streamlines at the midvertical plane of the sliced wafer rinsing tank with the original lifter setting. (b) Velocity profile at different axial locations (Z1 location; Z* = 0.25, Z2 location; Z* = 0.50, and Z3 location; Z* = 0.75) of the sliced wafer rinsing tank.

Grahic Jump Location
Fig. 2

(a) Geometry of the wafer rinsing tank and the sliced wafer rinsing tank. All dimensions are in millimeter. (b) Specific zones of interest and the generated grids in the computation domain. (c) The first, second, and third rows depict different orientation changes of side and middle lifters.

Grahic Jump Location
Fig. 4

(a) Velocity contour of the selected regions between the side and middle lifters obtained by PIV methodology and (b) comparison graph of the velocity magnitude obtained from the experiment and simulation. The correlation coefficient between PIV and CFD is 0.85 illustrating high degree of similarity between both the data sets. The error bar shows one standard deviation over three measurements along three axial locations highlighted in white dashed lines.

Grahic Jump Location
Fig. 5

Velocity contours of the sliced wafer rinsing tank superimposed with streamlines at the midvertical plane of the sliced wafer rinsing tank with modified side lifter setting. The side lifters tilted at an angle of (a) 30-deg, (b) 45-deg, (c) 60-deg, and (d) 90-deg, respectively.

Grahic Jump Location
Fig. 6

Velocity contours of the sliced wafer rinsing tank superimposed with streamlines at the midvertical plane of the sliced wafer rinsing tank with the modified middle lifter setting. The middle lifter is tilted at an angle of (a) 30-deg, (b) 45-deg, and (c) 60-deg, respectively, both in counterclockwise (left column) and clockwise direction (right column).

Grahic Jump Location
Fig. 1

Schematic representation of wafer rinsing tank along with 2D PIV configuration

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