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Proceedings Papers

Acoustic Emission Detection of Circumferential UV-Mechanical Failure of Glass Epoxy Composites

Yilin Yuan, Gongtian Shen, Fei Xie, Junjiao Zhang, Pengcheng Gan, Yongna Shen, Kuan Su
Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A017, October 30–November 3, 2022
Paper No: IMECE2022-95365
DOI: https://doi.org/10.1115/IMECE2022-95365
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Topics: Acoustic emissions, Composite materials, Computerized tomography, Epoxy adhesives, Epoxy resins, Failure, Glass, Ultraviolet radiation
Proceedings Papers

Effect of Autoclave Cure Temperature, Pressure, and Time on the Glass Transition Temperature and the Degree of Cure of Epoxy Film Adhesive Joints

Sayed A. Nassar, Shraddha Jagatap, Nitesh Hirulkar
Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A031, October 30–November 3, 2022
Paper No: IMECE2022-94434
DOI: https://doi.org/10.1115/IMECE2022-94434
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Topics: Adhesive joints, Epoxy adhesives, Epoxy resins, Glass transition, Pressure, Temperature, Adhesives, Aluminum, Bond strength, Bonding
Proceedings Papers

Effect of Salt Spray Cyclic Corrosion on the Mechanical and Reversibility Performance of Mixed Material Joints With Modified Adhesive

Matthew Burczyk, Sayed A. Nassar
Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A032, October 30–November 3, 2022
Paper No: IMECE2022-94447
DOI: https://doi.org/10.1115/IMECE2022-94447
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Topics: Adhesives, Corrosion, Sprays, Particulate matter, Aluminum, Carbon, Cycles, Epoxy adhesives, Epoxy resins, Fibers
Proceedings Papers

Evaluation of Graded Recycled Glass/Epoxy Composite

Ahmed H. Hegazy, Mahmoud E. Abd El-Latief, Omar Khalaf, Mostafa Shazly
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A013, October 30–November 3, 2022
Paper No: IMECE2022-95733
DOI: https://doi.org/10.1115/IMECE2022-95733
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Topics: Bending strength, Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Fracture toughness, Glass, Glass reinforced plastics, Recycling, Particulate matter
Proceedings Papers

Novel Thermal Coating for High-Speed Airplanes

Abinash Satapathy, Lakshay Battu, Liam Watson, Nazanin Rajabi, Jungkyu Park
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A006, October 30–November 3, 2022
Paper No: IMECE2022-95482
DOI: https://doi.org/10.1115/IMECE2022-95482
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Topics: Aircraft, Carbon, Coating processes, Coatings, Heat, Carbon reinforced plastics, Carbon fibers, Weight (Mass), Epoxy resins, Testing
Proceedings Papers

Cellulose Nanofibers (CNF)/Carbon Fiber Composites With Enhanced Flexural Strength for Structural Applications

Siddharth Bhaganagar, Pias Kumar Biswas, Mangilal Agarwal, Hamid Dalir
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A014, October 30–November 3, 2022
Paper No: IMECE2022-95772
DOI: https://doi.org/10.1115/IMECE2022-95772
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Topics: Bending strength, Carbon fibers, Composite materials, Epoxy adhesives, Epoxy resins, Nanofibers
Proceedings Papers

Development of a Predictive Model and Optimization for the Kerf Properties and Delamination Length in AWJM of Kevlar Epoxy Composite

Puneet Kumar, Sachin Salunkhe, Ragavanantham Shanmugam, Basanta Kumar Bhuyan, Anil Kumar Dahiya, Yuvaraj N.
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A016, October 30–November 3, 2022
Paper No: IMECE2022-96214
DOI: https://doi.org/10.1115/IMECE2022-96214
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Topics: Composite materials, Delamination, Epoxy adhesives, Epoxy resins, Machining, Optimization, Response surface methodology, Water
Proceedings Papers

Investigation of the Acoustic Performance of Plantain ( Musa Paradisiacal ) Fibre Reinforced Epoxy Biocomposite

Patrick Imoisili, Emeka Nwanna, George Enebe, Tien-Chien Jen
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A009, October 30–November 3, 2022
Paper No: IMECE2022-94773
DOI: https://doi.org/10.1115/IMECE2022-94773
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Topics: Acoustics, Epoxy resins, Fibers, Sound absorption
Proceedings Papers

Statistical Analysis of Strain Rate Dependency of the Mechanical Properties of Unidirectional CFRE Materials

Charbel Y. Seif, Ilige S. Hage, Re-Mi Hage, Ahmad M. R. Baydoun, Ramsey F. Hamade
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A008, October 30–November 3, 2022
Paper No: IMECE2022-94402
DOI: https://doi.org/10.1115/IMECE2022-94402
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Topics: Carbon fibers, Epoxy adhesives, Epoxy resins, Laminates, Mechanical properties, Statistical analysis, Composite materials, Density, Stiffness, Bending strength
Proceedings Papers

Implementation of ANN Modeling Techniques and Genetic Algorithm in the Diameter Prediction of MWCNTs/Epoxy Nanofibers for CFRP Structures

Pias Kumar Biswas, Pradnya Zende, Hamid Dalir, Mangilal Agarwal
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A047, October 30–November 3, 2022
Paper No: IMECE2022-90499
DOI: https://doi.org/10.1115/IMECE2022-90499
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Topics: Artificial neural networks, Carbon reinforced plastics, Epoxy resins, Genetic algorithms, Modeling, Multi-walled carbon nanotubes, Nanofibers
Proceedings Papers

Investigation on the Impact of Morphology and Arrangement of Graphene Nanoplatelet on Mechanical Behavior of Epoxy Nanocomposites

Olanrewaju Aluko
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A034, October 30–November 3, 2022
Paper No: IMECE2022-94845
DOI: https://doi.org/10.1115/IMECE2022-94845
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Topics: Engineering simulation, Epoxy adhesives, Epoxy resins, Graphene, Mechanical behavior, Micromechanics (Engineering), Nanocomposites, Simulation
Proceedings Papers

Characterization of 3D Printed Single Filament Carbon Fiber Epoxy Composite

Anirban Mondal, Mrinal Saha, Kuntal Maity, M. Cengiz Altan, Yingtao Liu
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A014, October 30–November 3, 2022
Paper No: IMECE2022-94861
DOI: https://doi.org/10.1115/IMECE2022-94861
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Topics: Additive manufacturing, Carbon fibers, Composite materials, Epoxy resins, Inks
Proceedings Papers

Exploring Alternative Methods for Simulating Lightning Mechanical Damage Effects on Carbon/Epoxy Laminates

Juhyeong Lee, Bin Yang, KunKun Fu
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A007, October 30–November 3, 2022
Paper No: IMECE2022-88057
DOI: https://doi.org/10.1115/IMECE2022-88057
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Topics: Carbon, Damage, Epoxy adhesives, Epoxy resins, Laminates, Lightning
Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997
Paper No: IMECE1997-0820
DOI: https://doi.org/10.1115/IMECE1997-0820
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Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)
Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997
Paper No: IMECE1997-0818
DOI: https://doi.org/10.1115/IMECE1997-0818
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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds
Proceedings Papers

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 33-54, November 16–21, 1997
Paper No: IMECE1997-0813
DOI: https://doi.org/10.1115/IMECE1997-0813
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Topics: Epoxy adhesives, Epoxy resins, Glass fibers, Stress, Fibers, Buckling, Delamination, Design, Metals, Optical fiber
Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997
Paper No: IMECE1997-0819
DOI: https://doi.org/10.1115/IMECE1997-0819
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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability
Proceedings Papers

Structural Integrity of Optical Fibers in Connectors

Wilton W. King, Bruce G. LeFevre, A. Guy Hardee
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 261-269, November 16–21, 1997
Paper No: IMECE1997-0825
DOI: https://doi.org/10.1115/IMECE1997-0825
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Topics: Epoxy adhesives, Epoxy resins, Fibers, Finite element analysis, Fracture (Materials), Fracture (Process), Optical fiber, Reliability, Stress analysis (Engineering), Structural analysis
Proceedings Papers

Microscopic Study on Heat Transfer and Thermophysical Properties of Composite Material

Osamu Nakabeppu, Masanobu Igeta, Kunio Hijikata
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 287-295, November 16–21, 1997
Paper No: IMECE1997-0854
DOI: https://doi.org/10.1115/IMECE1997-0854
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Topics: Composite materials, Heat transfer, Carbon reinforced plastics, Resolution (Optics), Atomic force microscopy, Microscale devices, Pressure, Temperature, Visualization, Atmospheric pressure
Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997
Paper No: IMECE1997-1109
DOI: https://doi.org/10.1115/IMECE1997-1109
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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding