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Proceedings Papers

Microstructural Effects on the Machining Performance of Dental Ceramics

D. T. Le, Lixun Qi, Guangming Zhang, Stanley J. Ng

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 245-251, November 16–21, 1997

Paper No: IMECE1997-1098

DOI: https://doi.org/10.1115/IMECE1997-1098

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Topics: Ceramics, Machining, Bending strength, Chemical properties, Cutting, Force measurement, Fracture (Materials), Fracture (Process), Fracture toughness, Microscale devices

Proceedings Papers

Characterization of Thin-Film Impact Microactuators

Roger L. Hipwell, Richard S. Muller, Albert P. Pisano

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 87-91, November 16–21, 1997

Paper No: IMECE1997-0944

DOI: https://doi.org/10.1115/IMECE1997-0944

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Topics: Microactuators, Thin films, Actuators, Design, Displacement, Impulse (Physics), Micromachining, Microscale devices, Momentum

Proceedings Papers

Microscopic Study on Heat Transfer and Thermophysical Properties of Composite Material

Osamu Nakabeppu, Masanobu Igeta, Kunio Hijikata

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 287-295, November 16–21, 1997

Paper No: IMECE1997-0854

DOI: https://doi.org/10.1115/IMECE1997-0854

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Topics: Composite materials, Heat transfer, Carbon reinforced plastics, Resolution (Optics), Atomic force microscopy, Microscale devices, Pressure, Temperature, Visualization, Atmospheric pressure

Proceedings Papers

Development of an Electromagnetically Actuated Mercury Microvalve

Douglas R. Adkins, C. Channy Wong

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 133-137, November 15–20, 1998

Paper No: IMECE1998-1233

DOI: https://doi.org/10.1115/IMECE1998-1233

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Topics: Contamination, Design, Drops, Electromagnetic force, Flow (Dynamics), Fluid handling, Gas flow, Microscale devices, Permanent magnets, Sealing (Process)

Proceedings Papers

Tribology on the Macro- to Nanoscales of MEMS Materials: A Review

Bharat Bhushan

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 265-266, November 15–20, 1998

Paper No: IMECE1998-1252

DOI: https://doi.org/10.1115/IMECE1998-1252

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Topics: Microelectromechanical systems, Tribology, Friction, Silicon, Polysilicon, Microscale devices, Crystals, Wear, Boundary lubrication, Nanoindentation

Proceedings Papers

Microactuation by Continuous Electrowetting Phenomenon and Silicon Deep RIE Process

Junghoon Lee, Chang-Jin “CJ” Kim

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 475-480, November 15–20, 1998

Paper No: IMECE1998-1287

DOI: https://doi.org/10.1115/IMECE1998-1287

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Topics: Reactive-ion etching, Silicon, Electrolytes, Liquid metals, Microchannels, Microelectromechanical systems, Microscale devices, Slug flows, Surface tension, Design

Proceedings Papers

Design, Testing, and Simulation of Microscale Gas Chromatography Columns

Mary L. Hudson, Richard Kottenstette, Carolyn M. Matzke, Greg C. Frye-Mason, Kim A. Shollenberger, Doug R. Adkins, C. Channy Wong

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 207-214, November 15–20, 1998

Paper No: IMECE1998-1244

DOI: https://doi.org/10.1115/IMECE1998-1244

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Topics: Design, Gas chromatography, Microscale devices, Simulation, Testing, Resolution (Optics), Chemistry, Dimensions, Etching, Plates (structures)

Proceedings Papers

Artificial Micropatterns of Cells on Biocompatible Surfaces

Albert Folch, Mehmet Toner

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 27-30, November 15–20, 1998

Paper No: IMECE1998-1219

DOI: https://doi.org/10.1115/IMECE1998-1219

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Topics: Biocompatibility, Silicon, Adhesion, Assaying, Biological tissues, Biosensors, Microfabrication, Microscale devices, Polymers, Self-assembly

Proceedings Papers

Numerical Simulation of Radiant Thermal Processing of Bilayer Microcantilevers

Haruna Tada, Ioannis N. Miaoulis, Peter Y. Wong

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 37-44, November 15–20, 1998

Paper No: IMECE1998-1221

DOI: https://doi.org/10.1115/IMECE1998-1221

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Topics: Computer simulation, Microcantilevers, Semiconductor wafers, Etching, Temperature gradient, Emissivity, Separation (Technology), Temperature, Thin films, Design

Proceedings Papers

Electro-Hydrodynamic Pumped Hydraulic Actuation

S. Kang, K. P. Hallinan, R. Kashani

Proc. ASME. IMECE98, Vibration and Noise Control, 193-200, November 15–20, 1998

Paper No: IMECE1998-0420

DOI: https://doi.org/10.1115/IMECE1998-0420

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Topics: Electrohydrodynamics, Pumps, Actuators, Displacement, Piezoelectric actuators, Pressure, Dielectric liquids, Flow (Dynamics), Fluids, Membranes

Proceedings Papers

Analysis and Control of Mesoscale Actuator Systems

Edward Kiely, Gregory Washington, Jun-Kyung Song

Proc. ASME. IMECE98, Adaptive Structures and Material Systems, 95-102, November 15–20, 1998

Paper No: IMECE1998-0943

DOI: https://doi.org/10.1115/IMECE1998-0943

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Topics: Actuators, Deflection, Design, Microscale devices, Piezoelectric materials, Control modeling, Creep, Displacement, Energy consumption, Hardware

Proceedings Papers

Heat Transfer Enhancement by Fins in the Microscale Regime

Fu-Chu Chou, Jennifer R. Lukes, Chang-Lin Tien

Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 165-172, November 15–20, 1998

Paper No: IMECE1998-0702

DOI: https://doi.org/10.1115/IMECE1998-0702

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Topics: Fins, Heat transfer, Microscale devices, Size effect, Thermal conductivity, Microchannels, Design, Flow (Dynamics), Heat, Heat exchangers

Proceedings Papers

Experimental and 2-D Numerical Studies on Micro-Scale Bending of Stainless Steel With Pulsed Laser

Guofei Chen, Xianfan Xu, Chie C. Poon, Andrew C. Tam

Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 49-57, November 15–20, 1998

Paper No: IMECE1998-0689

DOI: https://doi.org/10.1115/IMECE1998-0689

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Topics: Lasers, Microscale devices, Stainless steel, Materials properties, High temperature, Deformation, Dimensions, Energy resources, Finite element analysis, Laser beams

Proceedings Papers

Molecular Dynamics Study of Solid Thin-Film Thermal Conductivity

Jennifer R. Lukes, Xin-Gang Liang, Chang-Lin Tien

Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 229-240, November 15–20, 1998

Paper No: IMECE1998-0709

DOI: https://doi.org/10.1115/IMECE1998-0709

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Topics: Molecular dynamics, Thermal conductivity, Thin films, Film thickness, Microscale devices, Phonons, Temperature, Wave interference, Waves

Proceedings Papers

Holistic Approach for Problems in Heterogeneous Media

Jacob Fish

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 177-182, November 15–20, 1998

Paper No: IMECE1998-1163

DOI: https://doi.org/10.1115/IMECE1998-1163

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Topics: Composite materials, Constitutive equations, Fibers, Laminates, Micromechanics (Engineering), Microscale devices, Shells, Stiffness, Structural elements (Construction)

Proceedings Papers

Correlation of Fracture Initiation for Microscale Structures: Free-Standing Silicon and Silicon/Glass Interfaces

Martin L. Dunn, Wan Suwito, Paul E. W. Labossiere, Shawn J. Cunningham

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 157, November 15–20, 1998

Paper No: IMECE1998-1154

DOI: https://doi.org/10.1115/IMECE1998-1154

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Topics: Fracture (Materials), Fracture (Process), Glass, Microscale devices, Silicon, Stress, Etching, Semiconductor wafers, Anisotropy, Bending (Stress)

Proceedings Papers

Fracture Tracing and Analysis in Silicon and Glass Wafers

Lawrence D. Dyer

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 159-160, November 15–20, 1998

Paper No: IMECE1998-1155

DOI: https://doi.org/10.1115/IMECE1998-1155

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Topics: Fracture (Materials), Fracture (Process), Glass, Semiconductor wafers, Silicon, Stress, Microscale devices, Rivers, Shear waves, Brittle fracture

Proceedings Papers

Cracking of Plates With Randomly Distributed Holes by a Maximum Entropy Method

M. Ostoja-Starzewski, Ahmed Al-Ostaz, I. Jasiuk

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 287-288, November 15–20, 1998

Paper No: IMECE1998-1208

DOI: https://doi.org/10.1115/IMECE1998-1208

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Topics: Entropy, Fracture (Process), Plates (structures), Fracture (Materials), Aluminum, Brittleness, Damage, Electromagnetic scattering, Epoxy adhesives, Epoxy resins

Proceedings Papers

A Study of Damping in a Fluid Loaded Micro-Sensor

Jeffrey L. Dohner

Proc. ASME. IMECE98, Dynamics, Acoustics and Simulations, 55-62, November 15–20, 1998

Paper No: IMECE1998-0548

DOI: https://doi.org/10.1115/IMECE1998-0548

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Topics: Damping, Fluids, Microsensors, Relaxation (Physics), Energy dissipation, Acoustics, Excitation, Microscale devices, Radiation (Physics), Radiation effects

Proceedings Papers

Numerical Study of Deformation of Viscoelastic Drop Migrating Through Microchannel With Sudden Constriction

Niraj Kr Prasad, Siddhartha Sankar Ghosh, Amaresh Dalal

Proc. ASME. IMECE2021, Volume 10: Fluids Engineering, V010T10A032, November 1–5, 2021

Paper No: IMECE2021-71401

DOI: https://doi.org/10.1115/IMECE2021-71401

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Topics: Deformation, Flow (Dynamics), Fluids, Microchannels, Viscosity, Viscoelastic fluids, Shear flow, Viscoelasticity, Hydrogels, Microchannel flow

2 3 4 5

NARROW

Microstructural Effects on the Machining Performance of Dental Ceramics

Characterization of Thin-Film Impact Microactuators

Microscopic Study on Heat Transfer and Thermophysical Properties of Composite Material

Development of an Electromagnetically Actuated Mercury Microvalve

Tribology on the Macro- to Nanoscales of MEMS Materials: A Review

Microactuation by Continuous Electrowetting Phenomenon and Silicon Deep RIE Process

Design, Testing, and Simulation of Microscale Gas Chromatography Columns

Artificial Micropatterns of Cells on Biocompatible Surfaces

Numerical Simulation of Radiant Thermal Processing of Bilayer Microcantilevers

Electro-Hydrodynamic Pumped Hydraulic Actuation

Analysis and Control of Mesoscale Actuator Systems

Heat Transfer Enhancement by Fins in the Microscale Regime

Experimental and 2-D Numerical Studies on Micro-Scale Bending of Stainless Steel With Pulsed Laser

Molecular Dynamics Study of Solid Thin-Film Thermal Conductivity

Holistic Approach for Problems in Heterogeneous Media

Correlation of Fracture Initiation for Microscale Structures: Free-Standing Silicon and Silicon/Glass Interfaces

Fracture Tracing and Analysis in Silicon and Glass Wafers

Cracking of Plates With Randomly Distributed Holes by a Maximum Entropy Method

A Study of Damping in a Fluid Loaded Micro-Sensor

Numerical Study of Deformation of Viscoelastic Drop Migrating Through Microchannel With Sudden Constriction

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