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Proceedings Papers

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Ji Li, Imin Kao, Vish Prasad

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 439-446, November 16–21, 1997

Paper No: IMECE1997-1121

DOI: https://doi.org/10.1115/IMECE1997-1121

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Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries

Proceedings Papers

Machinability of Graphitic Silicon Carbide Aluminum Metal Matrix Composite GrA-Ni™

V. Songmene, T. F. Stephenson, A. E. M. Warner

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 193-200, November 16–21, 1997

Paper No: IMECE1997-1152

DOI: https://doi.org/10.1115/IMECE1997-1152

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Topics: Aluminum, Composite materials, Machinability, Silicon, Particulate matter, Graphite, Cutting, Metal matrix composites, Nickel, Cast iron

Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997

Paper No: IMECE1997-1118

DOI: https://doi.org/10.1115/IMECE1997-1118

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Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density

Proceedings Papers

150 Watt Portable Thermophotovoltaic Power Supply

Frederick E. Becker, Edward F. Doyle, Kailash C. Shukla

Proc. ASME. IMECE97, Advanced Energy Systems, 65-73, November 16–21, 1997

Paper No: IMECE1997-0975

DOI: https://doi.org/10.1115/IMECE1997-0975

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Topics: Ceramics, Defense industry, Design, Electricity (Physics), Energy conversion, Energy gap, Energy generation, Energy recovery, Engineering prototypes, Engines

Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-1221

DOI: https://doi.org/10.1115/IMECE1997-1221

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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards

Proceedings Papers

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 15-21, November 16–21, 1997

Paper No: IMECE1997-1222

DOI: https://doi.org/10.1115/IMECE1997-1222

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Topics: Silicon, Stress, Finite element analysis, Temperature, Constitutive equations, Electronic packaging, Engineering simulation, Packaging, Sensors, Shear stress

Proceedings Papers

Hydrostatic Response of Piezoresistive Stress Sensors

Y. Kang, A. K. M. Mian, J. C. Suhling, R. C. Jaeger

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 29-36, November 16–21, 1997

Paper No: IMECE1997-1224

DOI: https://doi.org/10.1115/IMECE1997-1224

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Topics: Hydrostatics, Sensors, Stress, Hydrostatic testing, Resistors, Calibration, Manufacturing, Pressure, Pressure vessels, Semiconductor wafers

Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997

Paper No: IMECE1997-1220

DOI: https://doi.org/10.1115/IMECE1997-1220

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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors

Proceedings Papers

Analytical Feasibility of Laser Induced Stress Wave Thermometry Applied to Silicon Wafers

G. Andrew Rabroker, C. Steve Suh, Christian P. Burger, Ravinder Chona

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 45-50, November 16–21, 1997

Paper No: IMECE1997-1226

DOI: https://doi.org/10.1115/IMECE1997-1226

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Topics: Lasers, Semiconductor wafers, Stress, Temperature measurement, Waves, Temperature, Anisotropy, Dispersion relations, Elastic constants, Rapid thermal processing

Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997

Paper No: IMECE1997-1228

DOI: https://doi.org/10.1115/IMECE1997-1228

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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature

Proceedings Papers

Characterisation of Open-Cell Aluminum Alloy Foams as Heat Sinks for High Power Electronic Devices

A.-F. Bastawros, A. G. Evans

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 1-6, November 16–21, 1997

Paper No: IMECE1997-1208

DOI: https://doi.org/10.1115/IMECE1997-1208

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Topics: Aluminum alloys, Foams (Chemistry), Heat sinks, Cross-flow, Cylinders, Dimensions, Fluid dynamics, Fluids, Heat transfer coefficients, Pressure drop

Proceedings Papers

The Recommended Geometry for Laminar Microchannel Heat Sinks

Jeffrey J. Lienau

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 47-54, November 16–21, 1997

Paper No: IMECE1997-1213

DOI: https://doi.org/10.1115/IMECE1997-1213

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Topics: Geometry, Heat sinks, Microchannels, Design, Coolants, Cooling, Heat flux, Heat transfer, Integrated circuits, Optical instruments

Proceedings Papers

Nonlinear Lateral Vibration of a Vertical Fluid-Conveying Pipe With End Mass: Effect of Horizontal Excitation at the Upper End

Masatsugu Yoshizawa, Masanobu Watanabe, Kouji Hashimoto, Masaya Takayanagi

Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume I, 281-288, November 16–21, 1997

Paper No: IMECE1997-0069

DOI: https://doi.org/10.1115/IMECE1997-0069

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Topics: Excitation, Fluids, Pipes, Vibration, Axial flow, Flow-induced vibrations, Image processing, Internal flow, Rubber, Silicon

Proceedings Papers

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abé

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 169-174, November 16–21, 1997

Paper No: IMECE1997-0513

DOI: https://doi.org/10.1115/IMECE1997-0513

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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics

Proceedings Papers

Die Strength Evaluation in the Presence of Edge Cracks

Betty Leung, Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 125-131, November 16–21, 1997

Paper No: IMECE1997-0507

DOI: https://doi.org/10.1115/IMECE1997-0507

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Topics: Fracture (Materials), Reliability, Stress, Testing, Failure analysis, Finite element analysis, Manufacturing, Silicon

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

Proceedings Papers

Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical Analysis Data for Die Attachment Analysis

Duane A. Gilmour, James F. Reilly, Donald W. Calabrese

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 175-181, November 16–21, 1997

Paper No: IMECE1997-0514

DOI: https://doi.org/10.1115/IMECE1997-0514

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Topics: Acoustics, Microscopes, X-rays, Microscopy, Silicon, Adhesion, Energy dissipation, Testing, Delamination, Density

Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997

Paper No: IMECE1997-0497

DOI: https://doi.org/10.1115/IMECE1997-0497

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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics

Proceedings Papers

Failure Mechanism of Metallization Layer of a Multichip Module Substrate

Mansur Rastani

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 469-475, November 16–21, 1997

Paper No: IMECE1997-0703

DOI: https://doi.org/10.1115/IMECE1997-0703

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Topics: Failure mechanisms, Multi-chip modules, Silicon, Temperature, Aluminum, Failure, Fatigue, Fatigue life, Finite element analysis, Metals

Proceedings Papers

Microstructural Optimization of a Functionally Gradient Layer

Joseph C. Nadeau, Mauro Ferrari

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 3-10, November 16–21, 1997

Paper No: IMECE1997-0645

DOI: https://doi.org/10.1115/IMECE1997-0645

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Topics: Optimization, Composite materials, Aluminum, Coating processes, Coatings, Flamelet generated manifold, Functionally graded materials, Silicon, Temperature gradient

2 3 4 5

NARROW

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Machinability of Graphitic Silicon Carbide Aluminum Metal Matrix Composite GrA-Ni™

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

150 Watt Portable Thermophotovoltaic Power Supply

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Hydrostatic Response of Piezoresistive Stress Sensors

Advances in Stress Test Chips

Analytical Feasibility of Laser Induced Stress Wave Thermometry Applied to Silicon Wafers

Evaluation of Die Stress Using van der Pauw Sensors

Characterisation of Open-Cell Aluminum Alloy Foams as Heat Sinks for High Power Electronic Devices

The Recommended Geometry for Laminar Microchannel Heat Sinks

Nonlinear Lateral Vibration of a Vertical Fluid-Conveying Pipe With End Mass: Effect of Horizontal Excitation at the Upper End

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Die Strength Evaluation in the Presence of Edge Cracks

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical Analysis Data for Die Attachment Analysis

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

Failure Mechanism of Metallization Layer of a Multichip Module Substrate

Microstructural Optimization of a Functionally Gradient Layer

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