We propose an advanced thermal-moisture analogy scheme to cope with the inherent limitations of the existing schemes. The new scheme is based on the experimentally-observed unique hygroscopic behavior of polymeric materials used in microelectronics; i.e., the saturated concentration is only a function of relative humidity regardless of temperature. A new analogy formulation based on the modified solubility is presented and the scheme is implemented to investigate its accuracy and applicability. The results from a simple case study corroborate that the advanced scheme can be used effectively for package assemblies subjected to general anisothermal loading conditions.
- Electronic and Photonic Packaging Division
Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
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Jang, C, Han, B, Park, S, & Yoon, S. "Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 749-755. ASME. https://doi.org/10.1115/IPACK2007-33142
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