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Keywords: gold
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. May 2006, 3(2): 131–136.
Published Online: November 30, 2005
... of 1.625 cm 2 demonstrated a maximum power density of 50 mW ∕ cm 2 at 60 ° C . Since the silicon wafer is too fragile to compress for sealing, and a thicker layer of gold has to be coated on the silicon wafer to reduce contact resistance, further development of micro DMFCs for high power application...
