This paper presents, discusses, and compares results from experimental and computational studies of the plastic encapsulation process for a 144-lead TQFP package. The experimental results were obtained using an instrumented molding press, while the computational predictions were obtained using a newly-developed software for modeling transfer molding processes. Validation of the software is emphasized, and this was done mainly by comparing the computational results with the corresponding experimental measurements for pressure, temperature, and flow front advancement in the cavities and runners. The experimental and computational results were found to be in good agreement, especially for the flow-front shapes and locations. [S1043-7398(00)00502-8]

Issue Section:
Technical Papers
Keywords:
encapsulation, plastic packaging, moulding
Topics:
Cavities, Flow (Dynamics), Molding, Pressure, Simulation, Temperature, Transfer molding, Viscosity, Computer simulation, Computer software, Engineering simulation, Modeling
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Copyright © 2000
 by ASME
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