Thermal interface pastes based on silicone, lithium doped polyethylene glycol (PEG), and sodium silicate were evaluated in their performance before and after heating up to 120°C. The thermal contact conductance of any of the pastes between copper disks decreased after heating, such that the fractional decrease was less for the silicone-based paste than the PEG-based and sodium-silicate-based pastes. Nevertheless, the conductance was lower for the silicone-based paste than the other pastes both before and after heating up to 100 cycles.

Issue Section:
Technical Briefs
Keywords:
thermal stability, thermal conductivity, thermal management (packaging), Thermal Interface, Thermal Contact, Thermal Conductance, Composite, Silicone, Polyethylene Glycol, Sodium Silicate, Boron Nitride
Topics:
Contact resistance, Copper, Cycles, Disks, Electrical conductance, Heating, Silicones, Sodium, Thermal conductivity, Thermal stability, Boron, Lithium, Temperature
1.
Wolff
,
E. G.
, and
Schneider
,
D. A.
,
1998
, “
Prediction of Thermal Contact Resistance between Polished Surfaces
,”
Int. J. Heat Mass Transf.
41
, No.
22
, pp.
3469
–
3482
.
2.
Ouellette, T., and de Sorgo, M., 1985, “Thermal Performance of Heat Transfer Interface Materials,” Proceedings, The Power Electronics Design Conf., Power Sources Users Conf., Cerritos, CA, pp. 134–138.
3.
Wilson, S. W., Norris, A. W., Scott E. B., and Costello, M. R., 1996, “Thermally Conductive Adhesives for High Thermally Stressed Assembly,” National Electronic Packaging and Production Conference, Proc. Technical Program, Reed Exhibition Companies, Norwalk, CT, Vol. 2, pp. 788–796.
4.
Peterson, A. L., 1990, “Silicones with Improved Thermal Conductivity for Thermal Management in Electronic Packaging,” Proceedings, 40th Electronic Components and Technology Conf., IEEE, Piscataway, NJ, Vol. 1, pp. 613–619.
5.
Lu
,
X.
,
Xu
,
G.
,
Hofstra
,
P. G.
, and
Bajcar
,
R. C.
,
1998
, “
Moisture-Absorption, Dielectric Relaxation, and Thermal Conductivity Studies of Polymer Composites
,”
J. Polym. Sci., Part B: Polym. Phys.
36
, No.
13
, pp.
2259
–
2265
.
6.
Sasaski, T., Hisano, K., Sakamoto, T., Monma, S., Fijmori, Y., Iwasaki, H., and Ishizuka, M., 1995, “Development of Sheet Type Thermal Conductive Compound Using AIN,” Japan IEMT Symp. Proc., IEEE/CPMT Int. Electronic Manufacturing Technology (IEMT) Symp., IEEE, Piscataway, NJ, pp. 236–239.
7.
Xu, Y., Luo, X., and Chung, D. D. L., “Lithium doped polyethylene-glycol-based thermal interface pastes for high thermal contact conductance,” ASME J. Electron. Packag., in press.
8.
Xu
,
Y.
,
Luo
,
X.
, and
Chung
,
D. D. L.
,
2000
, “
Sodium Silicate Based Thermal Pastes for High Thermal Contact Conductance
,”
ASME J. Electron. Packag.
122
, No.
2
, pp.
128
–
131
.
Copyright © 2001
 by ASME
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