You do not currently have access to this content.
Skip Nav Destination
Article navigation
December 2001
Special Section On Therminic
Foreword
Marta Rencz ,, Guest Editor,
Marta Rencz ,, Guest Editor
Micred Ltd., Budapest
Search for other works by this author on:
Clemens Lasance ,, Guest Editor
Clemens Lasance ,, Guest Editor
Philips Research Laboratories, Eindhoven, The Netherlands
Search for other works by this author on:
Marta Rencz ,, Guest Editor
Micred Ltd., Budapest
Clemens Lasance ,, Guest Editor
Philips Research Laboratories, Eindhoven, The Netherlands
J. Electron. Packag. Dec 2001, 123(4): 321-322 (2 pages)
Published Online: December 1, 2001
Citation
Rencz , , M., and Lasance , , C. (December 1, 2001). "Foreword." ASME. J. Electron. Packag. December 2001; 123(4): 321–322. https://doi.org/10.1115/1.1389845
Download citation file:
28
Views
Get Email Alerts
Cited By
Enhancing Image Segmentation Model in Computing Void Percentage with Mask RCNN
J. Electron. Packag
Optimization of Micropillars Electroplating Bonding Processes and Additives
J. Electron. Packag (June 2025)
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag (June 2025)
Related Articles
Special Issue on Poly’2000, London
J. Electron. Packag (December,2002)
Measurement of Thermal Deformation of Interconnect Layers Using SIEM
J. Electron. Packag (September,2002)
Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems
J. Electron. Packag (December,2003)
Special Section on InterPACK2021
J. Electron. Packag (March,2023)
Related Proceedings Papers
Related Chapters
Fatigue Fracture Micromechanisms in Engineering Plastics
Fatigue Mechanisms
Micromechanisms of Low-Cycle Fatigue in Nickel-Based Superalloys at Elevated Temperatures
Fatigue Mechanisms
Modeling and Applications of Silicon Epitaxy
Silicon Processing