Polyethylene-glycol-based thermal interface paste containing trifluoroacetic acid lithium salt (1.5 wt. percent optimum) and boron nitride particles (∼18.0 vol. percent optimum), as well as water and N, N-dimethylformamide for helping the dissociation of the salt to release ions, gives thermal contact conductance that is almost as high as that given by Sn-Pb solder, similar to that given by boron nitride particle filled sodium silicate, and much higher than that given by boron nitride particle filled silicone.
Issue Section:
Technical Papers
Keywords:
filled polymers,
particle reinforced composites,
thermal resistance,
packaging,
cooling,
Polymer,
Polyethylene Glycol,
Lithium,
Boron Nitride,
Thermal Interface,
Thermal Contact,
Thermal Conductance,
Composite
Topics:
Boron,
Contact resistance,
Lithium,
Particulate matter,
Ions,
Sodium,
Silicones,
Solders,
Thermal conductivity,
Water
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.Copyright © 2002
by ASME
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