This paper illustrates the micromechanics approach to cyclic creep-fatigue damage of Pb-Sn, developed by the authors with the help of a simple case study. It is demonstrated that durability predictions can be made based solely on monotonic test data. Various parametric studies of practical interest are conducted to obtain mechanistic insights into various aspects of damage in solders e.g., effect of hydrostatic stresses, grain size, ramp rate, etc.
Issue Section:
Papers on Reliability
Topics:
Creep,
Cycles,
Damage,
Durability,
Failure,
Fatigue,
Grain size,
Hydrostatics,
Micromechanics (Engineering),
Solders,
Stress,
Optimization,
Temperature
1.
Sharma, P., and Dasgupta, A., 2002, “Micro-Mechanics Of Creep-Fatigue Damage In Pb-Sn Solder Due To Thermal Cycling: Part I (Formulation),” ASME J. Electron. Packag., published in this issue, pp.
2.
Sharma, P., 2000, Ph.D. dissertation, Dept. of Mechanical Engineering, University of Maryland, College Park.
3.
Sharma, P., and Dasgupta, A., submitted to the Journal of Applied Physics.
4.
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9.
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10.
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.Copyright © 2002
by ASME
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