As two dissimilar materials are bonded or cocured at elevated temperatures, residual stresses result upon cooling the layered material system to room temperature. It is well known that the free edges of composite laminates experience interlaminar stresses during applied mechanical or thermal loading. These stresses are significant and must be understood. Current experimental methods are not capable of determining the residual stresses along free edges where failure is likely to initiate. This paper describes the initial findings of a novel experimental technique that uses moire´ interferometry and material removal to determine the residual stress distribution resulting from elevated temperature processing at the free edges of layered materials.
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December 2002
Technical Papers
Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry
Keith B. Bowman,
e-mail: keith.bowman@wpafb.af.mil
Keith B. Bowman
Air Force Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson Air Force Base, OH 45433-7750
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David H. Mollenhauer
David H. Mollenhauer
Air Force Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson Air Force Base, OH 45433-7750
Search for other works by this author on:
Keith B. Bowman
Air Force Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson Air Force Base, OH 45433-7750
e-mail: keith.bowman@wpafb.af.mil
David H. Mollenhauer
Air Force Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson Air Force Base, OH 45433-7750
Contributed by the Electronic and Photonic Packaging Division and presented at Poly 2000, London, United Kingdom, December 4-5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel.
J. Electron. Packag. Dec 2002, 124(4): 340-344 (5 pages)
Published Online: December 12, 2002
Article history
Received:
May 1, 2002
Online:
December 12, 2002
Citation
Bowman, K. B., and Mollenhauer, D. H. (December 12, 2002). "Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry ." ASME. J. Electron. Packag. December 2002; 124(4): 340–344. https://doi.org/10.1115/1.1497627
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