This research studies the motion of void bubbles within molten solder bumps. Surface tension variation on the outer surface of the bump drives a flow that is transmitted to the interior by viscosity. Bubbles inside the bump grow by collisions with other bubbles. A computer model of this process has been formulated. In cases with the melting process from top to bottom, a ring of bubbles collected at the top outer rim of the solder bump. When the melting direction was reversed, the typical result was a single large bubble near the center with a few smaller recirculating bubbles.
Issue Section:
Technical Papers
1.
Chan
, Y. C.
, Xie
, D. J.
, and Lai
, J. K. L.
, 1996
, “Experimental Studies of Pore Formation in Surface Mount Solder Joints
,” Mater. Sci. Eng., B
, 38
(1–2
), p. 53
53
.2.
Goenka, L. N., and Achari, A., 1995, “Void Formation in Flip-Chip Solder Bumps: Part I,” 18th IEEE/CHMT Symposium, Austin TX.
3.
Goenka, L. N., and Achari, A., 1996, “Void Formation in Flip-Chip Solder Bumps: Part II,” Nineteenth IEEE/CHMT Symposium, Austin TX.
4.
Vural, C., 1998, private communication.
5.
Davis
, A. M. J.
, 1989
, “Thermocapillary Convection in Liquid Bridges: Solution Structure and Eddy Motions
,” Phys. Fluids A
, 1
, p. 479
479
.6.
Lee, J., 1999, “Analytical Model of Void Formation in Solder Bumps,” M.S. thesis, University of Texas.
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by ASME
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