Field reliability extrapolations from accelerated tests necessitate simulation of a variety of material behaviors under general loading conditions. The Hierarchical Incremental Single Surface (HiSS) yield function (Desai, C. S., 2001, Mechanics of Materials and Interfaces: The Disturbed State Concept, CRC Press, Boca Raton, FL.) has been applied extensively to a wide range of materials, from solders and silicon to ceramics and geotechnical materials, for simulating continuous-yield elastoplastic and elastoviscoplastic behavior. This work presents a continuous-yield function that avoids problems with HiSS for thermal and tensile loading. Validations are presented for eutectic data of Wang et al. (Wang, Z., Desai, C.S., and Kundu, T., 2001, “Disturbed State Constitutive Modeling and Testing of Joining Materials in Electronic Packaging,” report to NSF for Materials Processing and Manufacturing Division Grant 9812686, University of Arizona, Tucson, AZ). Limitations on the range of validity of the elastoplastic and the Perzyna elastoviscoplastic formulations are discussed.
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June 2005
Research Papers
Yield Function for Solder Elastoviscoplastic Modeling
M. Dube,
M. Dube
Department of Civil Engineering and Engineering Mechanics, University of Arizona
, Tucson, AZ 85721, USA
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T. Kundu
T. Kundu
Department of Civil Engineering and Engineering Mechanics, University of Arizona
, Tucson, AZ 85721, USA
Search for other works by this author on:
M. Dube
Department of Civil Engineering and Engineering Mechanics, University of Arizona
, Tucson, AZ 85721, USA
T. Kundu
Department of Civil Engineering and Engineering Mechanics, University of Arizona
, Tucson, AZ 85721, USAJ. Electron. Packag. Jun 2005, 127(2): 147-156 (10 pages)
Published Online: September 14, 2004
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Received:
October 13, 2003
Revised:
September 14, 2004
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Dube, M., and Kundu, T. (September 14, 2004). "Yield Function for Solder Elastoviscoplastic Modeling." ASME. J. Electron. Packag. June 2005; 127(2): 147–156. https://doi.org/10.1115/1.1869514
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