In many applications such as computers and telecommunications, the IC chip sizes are very big, the on-chip frequency and power dissipation are very high, and the number of chip I/Os is very large. The CCGA (ceramic column grid array) package developed by IBM is one of the best candidates for housing these kinds of chips. There are two parts in this study. One is to show that the two-parameter Weibull life distribution is adequate for modeling the thermal-fatigue life of lead-free solder joints. This is demonstrated by comparing the two-parameter and three-parameter Weibull distributions with life test data of an 1657-pin CCGA package with the 95.5 wt %Sn3.9 wt %Ag0.6 wt %Cu lead-free solder paste on lead-free printed circuit boards under thermal cycling conditions. The other part of this study is to determine the time-history creep strain energy density of the 1657-pin CCGA solder column with two different solder paste materials, namely, 95.5 wt %Sn3.9 wt %Ag0.6 wt %Cu and 63 wt %Sn37 wt %Pb and under three different thermal cycling profiles, namely, 25↔75°C, 0↔100°C, and −25↔125°C. The effects of these solder pastes and temperature conditions on the thermal-fatigue life of the high-lead (10 wt %Sn90 wt %Pb) solder columns of the CCGA package are provided and discussed.
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e-mail: john_lau@agilent.com
e-mail: walter_dauksher@agilent.com
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June 2005
Research Papers
Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)
John Lau, ASME Fellow,
e-mail: john_lau@agilent.com
John Lau, ASME Fellow
Agilent Technologies, Inc. 5301 Stevens Creek Blvd., Santa Clara, CA 95052
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Walter Dauksher
e-mail: walter_dauksher@agilent.com
Walter Dauksher
Agilent Technologies, Inc. 4380 Ziegler Rd., Fort Collins, CO 80525
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John Lau, ASME Fellow
Agilent Technologies, Inc. 5301 Stevens Creek Blvd., Santa Clara, CA 95052
e-mail: john_lau@agilent.com
Walter Dauksher
Agilent Technologies, Inc. 4380 Ziegler Rd., Fort Collins, CO 80525
e-mail: walter_dauksher@agilent.com
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received October 24, 2004; revision received May 17, 2004. Review conducted by: C. Basaran.
J. Electron. Packag. Jun 2005, 127(2): 96-105 (10 pages)
Published Online: June 3, 2005
Article history
Revised:
May 17, 2004
Received:
October 24, 2004
Online:
June 3, 2005
Citation
Lau, J., and Dauksher, W. (June 3, 2005). "Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards) ." ASME. J. Electron. Packag. June 2005; 127(2): 96–105. https://doi.org/10.1115/1.1846069
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