In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.

Issue Section:
Research Papers
Keywords:
thermal management (packaging), ball grid arrays, reliability, solders, integrated circuit packaging, integrated circuit interconnections, assembling, failure analysis, fault location, surface mount technology, Weibull distribution
Topics:
Rapid tooling, Reliability, Temperature, Failure, Ball-Grid-Array packaging, Solder joints, Manufacturing, Solders, Testing
1.
Lau
,
J.
, 1991,
Solder Joint Reliability: Theory and Applications
,
Van Nostrand Reinhold
, New York.
2.
JEDEC
(Joint Electronic Device Engineering Council) standard, 1989, Temperature cycling. JESD22-A104-A. USA: Electronic Industries Association.
3.
Lau
,
J.
, and
Pao
,
Y. H.
, 1997,
Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies
,
McGraw-Hill
, New York.
4.
Sealing
,
S.
, and
Dasgupta
,
A.
, 1999, “
Alternative Accelerated Testing Method for Localization of Solder Fatigue Failures on Electronic Circuit Cards
,”
ASME J. Electron. Packag.
1043-7398, Maui, HI, USA,
26
, No.
2
, pp.
1593
–
1598
.
5.
Sharma
,
P.
,
Natarajan
,
R.
, and
Dasgupta
,
A.
, 1999, “
Reducing Accelerated Test Time: Use of Vibration Loading to Accelerate Ageing Damage
.”
ASME J. Electron. Packag.
1043-7398,
26
, No.
2
, pp.
1801
–
1805
.
6.
Zubelewicz
,
A.
,
Tokarz
,
R. F.
,
Kuracina
,
R. P.
, and
McGinniss
,
J. L.
, 1995, “
Mechanical Deflection System: An Innovative Test Method for SMT Assemblies
,”
ASME J. Electron. Packag.
1043-7398,
10
, No.
2
, pp.
1167
–
1177
.
7.
Pang
,
H. L. J.
,
Ang
,
K. H.
,
Wang
,
Z. P.
, and
Shi
,
X. Q.
, 1999, “
Reliability Test Methodology Using Thermo-Mechanical Deflection
,”
ASME J. Electron. Packag.
1043-7398,
26
, No.
2
, pp.
2077
–
2082
.
8.
Shi
,
X. Q.
,
Pang
,
H. L. J.
,
Yang
,
Q. J.
,
Wang
,
Z. P.
, and
Nie
,
J. X.
, 2002, “
Quick Assessment Methodology for Reliability of Solder Joints in Ball Grid Array (BGA) Assembly-Part II: Reliability Experiment and Numerical Simulation
,”
Acta Mech. Sin.
0459-1879,
18
, No.
4
, pp.
356
–
367
.
9.
Towashiraporn
,
P.
,
Subbarayan
,
G.
,
McIlvanie
,
B.
,
Hunter
,
B. C.
,
Love
,
D.
, and
Sullivan
,
B.
, 2004, “
The Effect of Model Building on the Accuracy of Fatigue Life Predictions in Electronic Packages
,”
Microelectron. Reliab.
0026-2714,
44
, pp.
115
–
127
.
Crossref
Search ADS
 
10.
Qi
,
Q.
, 2001, “
Reliability Studies of Two Flip-Chip BGA Packages Using Power Cycling Test
,”
Microelectron. Reliab.
0026-2714,
41
, No.
4
, pp.
553
–
562
.
Crossref
Search ADS
 
11.
Clech
,
J. P. M.
,
Noctor
,
D. M.
,
Manock
,
J. C.
,
Lynott
,
G. W.
, and
Bader
,
F. E.
, 1994, “
Surface Mount Assembly Failure Statistics and Failure Free Time
,”
44th Electronic Components and Technology Conference
, Washington, D. C., pp.
487
–
497
.
12.
Kumar
,
U. D.
,
Crocker
,
J.
,
Knezevic
,
J.
, and
Ei-Haraam
,
M.
, 2000,
Reliability Maintenance and Logistic Support: A Life Cycle Approach
,
Kluwer Academic
, Dordrecht, Chap. 2, pp.
13
–
49
.
13.
Pecht
,
M.
, 1991,
Handbook of Electronic Package Design
,
Marcel Dekker
, New York.
14.
Darveaux
,
R.
, and
Banerji
,
K.
, 1992, “
Constitutive Relations for Tin-Based Solder Joints
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
0148-6411,
15
, No.
6
, pp.
1013
–
1024
.
Crossref
Search ADS
 
15.
Meyers
,
M. A.
, and
Chawla
,
K. K.
, 1984,
Mechanical Metallurgy: Principles and Applications
,
Prentice-Hall
, New Jersey.
16.
Shi
,
X. Q.
,
Pang
,
H. L. J.
,
Zhou
,
W.
, and
Wang
,
Z. P.
, 2000, “
Low Cycle Fatigue Analysis of Temperature and Frequency Effects in Eutectic Solder Alloy
,”
Int. J. Fatigue
0142-1123,
22
, pp.
217
–
228
.
Crossref
Search ADS
 
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