Power device packages with solder-bump (SB) and direct-solder (DS) interconnections were fabricated and some of their thermomechanical reliability issues were discussed based on both thermal cycling experiment and finite element analysis (FEA). The SB interconnection shows superior reliability over the DS interconnection in the thermal cycling experiment because the mismatched coefficient of thermal expansion leads to smaller stresses at the SB interconnection under the same temperature changes. On the other hand, FEA results show that the DS package has significantly lower operating temperatures under the same double-sided cooling condition. After considering the operating temperature difference, the DS package was shown to be superior over the SB package in the power cycling analysis.

Issue Section:
Research Papers
Keywords:
semiconductor device packaging, finite element method, soldering, cooling, semiconductor device packaging, power semiconductor devices, cooling, solders, semiconductor device reliability, finite element analysis, thermal expansion, thermal management (packaging)
Topics:
Cooling, Finite element analysis, Reliability, Solders, Temperature, Stress, Thermomechanics, Thermal expansion
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