In recent years, light emitting diodes (LEDs) have become an attractive technology for general and automotive illumination systems replacing old-fashioned incandescent and halogen systems. LEDs are preferable for automobile lighting applications due to its numerous advantages such as low power consumption and precise optical control. Although these solid state lighting (SSL) products offer unique advantages, thermal management is one of the main issues due to severe ambient conditions and compact volume. Conventionally, tightly packaged double-sided FR4-based printed circuit boards (PCBs) are utilized for both driver electronic components and LEDs. In fact, this approach will be a leading trend for advanced internet of things applications embedded LED systems in the near future. Therefore, automotive lighting systems are already facing with tight-packaging issues. To evaluate thermal issues, a hybrid study of experimental and computational models is developed to determine the local temperature distribution on both sides of a three-purpose automotive light engine for three different PCB approaches having different materials but the same geometry. Both results showed that FR4 PCB has a temperature gradient (TMaxBoard to TAmbient) of over 63 °C. Moreover, a number of local hotspots occurred over FR4 PCB due to low thermal conductivity. Later, a metal core PCB is investigated to abate local hot spots. A further study has been performed with an advanced heat spreader board based on vapor chamber technology. Results showed that a thermal enhancement of 7.4% and 25.8% over Al metal core and FR4-based boards with the advanced vapor chamber substrate is observed. In addition to superior thermal performance, a significant amount of lumen extraction in excess of 15% is measured, and a higher reliability rate is expected.
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June 2017
Research-Article
Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies
Umut Zeynep Uras,
Umut Zeynep Uras
EVATEG Center,
Mechanical Engineering Department,
Ozyegin University,
Cekmekoy, Istanbul 34794, Turkey
e-mail: umut.uras@ozu.edu.tr
Mechanical Engineering Department,
Ozyegin University,
Cekmekoy, Istanbul 34794, Turkey
e-mail: umut.uras@ozu.edu.tr
Search for other works by this author on:
Mehmet Arık,
Mehmet Arık
Professor
Fellow ASME
EVATEG Center,
Mechanical Engineering Department,
Ozyegin University,
Cekmekoy, Istanbul 34794, Turkey
e-mail: mehmet.arik@ozyegin.edu.tr
Fellow ASME
EVATEG Center,
Mechanical Engineering Department,
Ozyegin University,
Cekmekoy, Istanbul 34794, Turkey
e-mail: mehmet.arik@ozyegin.edu.tr
Search for other works by this author on:
Enes Tamdoğan
Enes Tamdoğan
EVATEG Center,
Mechanical Engineering Department,
Ozyegin University,
Cekmekoy, Istanbul 34794, Turkey
e-mail: enestamdogan@gmail.com
Mechanical Engineering Department,
Ozyegin University,
Cekmekoy, Istanbul 34794, Turkey
e-mail: enestamdogan@gmail.com
Search for other works by this author on:
Umut Zeynep Uras
EVATEG Center,
Mechanical Engineering Department,
Ozyegin University,
Cekmekoy, Istanbul 34794, Turkey
e-mail: umut.uras@ozu.edu.tr
Mechanical Engineering Department,
Ozyegin University,
Cekmekoy, Istanbul 34794, Turkey
e-mail: umut.uras@ozu.edu.tr
Mehmet Arık
Professor
Fellow ASME
EVATEG Center,
Mechanical Engineering Department,
Ozyegin University,
Cekmekoy, Istanbul 34794, Turkey
e-mail: mehmet.arik@ozyegin.edu.tr
Fellow ASME
EVATEG Center,
Mechanical Engineering Department,
Ozyegin University,
Cekmekoy, Istanbul 34794, Turkey
e-mail: mehmet.arik@ozyegin.edu.tr
Enes Tamdoğan
EVATEG Center,
Mechanical Engineering Department,
Ozyegin University,
Cekmekoy, Istanbul 34794, Turkey
e-mail: enestamdogan@gmail.com
Mechanical Engineering Department,
Ozyegin University,
Cekmekoy, Istanbul 34794, Turkey
e-mail: enestamdogan@gmail.com
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 16, 2016; final manuscript received March 28, 2017; published online June 12, 2017. Assoc. Editor: Justin A. Weibel.
J. Electron. Packag. Jun 2017, 139(2): 020907 (8 pages)
Published Online: June 12, 2017
Article history
Received:
December 16, 2016
Revised:
March 28, 2017
Citation
Zeynep Uras, U., Arık, M., and Tamdoğan, E. (June 12, 2017). "Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies." ASME. J. Electron. Packag. June 2017; 139(2): 020907. https://doi.org/10.1115/1.4036403
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