Volume 123 Issue 3 | J. Electron. Packag.

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Technical Papers

Local Heat Transfer Distributions in Confined Multiple Air Jet Impingement

Suresh V. Garimella, Vincent P. Schroeder

J. Electron. Packag. September 2001, 123(3): 165–172. doi: https://doi.org/10.1115/1.1371923

Abstract

View articletitled, Local Heat Transfer Distributions in Confined Multiple Air Jet Impingement

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Topics: Air jets , Flow (Dynamics) , Heat , Heat transfer , Heat transfer coefficients , Jets , Reynolds number

Sizing of Heat Spreaders Above Dielectric Layers

Calvin Chen, Marc Hodes, Lou Manzione

J. Electron. Packag. September 2001, 123(3): 173–181. doi: https://doi.org/10.1115/1.1377271

Abstract

View articletitled, Sizing of Heat Spreaders Above Dielectric Layers

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Topics: Flat heat pipes , Thermal resistance , Finite element analysis , Heat

Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape

J. R. Culham, Associate Professor and Director, Mem. ASME, M. M. Yovanovich, Distinguished Professor Emeritus, Fellow ASME, P. Teertstra, Research Associate, C.-S. Wang, G. Refai-Ahmed, Mem. ASME, Ra-Min Tain

J. Electron. Packag. September 2001, 123(3): 182–188. doi: https://doi.org/10.1115/1.1347993

Abstract

View articletitled, Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape

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Topics: Boundary layers , Dimensions , Flat plates , Flow (Dynamics) , Forced convection , Reynolds number , Shapes , Computer simulation , Heat transfer , Computational fluid dynamics

Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader

Koichiro Take, Ralph L. Webb

J. Electron. Packag. September 2001, 123(3): 189–195. doi: https://doi.org/10.1115/1.1348010

Abstract

View articletitled, Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader

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Topics: Flat heat pipes , Heat , Heat pipes , Thermal resistance , Temperature , Laptop computers

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Yong Du, Jie-Hua Zhao, Paul Ho

J. Electron. Packag. September 2001, 123(3): 196–199. doi: https://doi.org/10.1115/1.1347987

Abstract

View articletitled, An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

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Topics: Electronic packages , Finite element analysis , Laser beams , Temperature , Flip-chip packages , Warping , Thermal expansion , Deformation , Lasers , Packaging

A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages

J. V. C. Vargas, G. Stanescu, R. Florea, M. C. Campos

J. Electron. Packag. September 2001, 123(3): 200–210. doi: https://doi.org/10.1115/1.1348337

Abstract

View articletitled, A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages

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Topics: Electronic packages , Heat transfer , Temperature , Computer simulation , Heat , Heat flux , Optimization

Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses

A. G. Evans, M. Y. He, J. W. Hutchinson, M. Shaw

J. Electron. Packag. September 2001, 123(3): 211–217. doi: https://doi.org/10.1115/1.1370376

Abstract

View articletitled, Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses

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Topics: Electronics , Melting , Steady state , Temperature , Transients (Dynamics) , Junctions , Design , Temperature distribution , Phase change materials

Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

Cemal Basaran, Assoc. Prof. and Director,, Ying Zhao, Senior Reliability Engineer,

J. Electron. Packag. September 2001, 123(3): 218–224. doi: https://doi.org/10.1115/1.1362674

Abstract

View articletitled, Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

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Topics: Adhesives , Damage , Elastic analysis , Finite element analysis , Stress , Stress concentration , Electronic packaging , Shear stress , Stress singularity

Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling

J. Y. Chang, C. W. Yu, R. L. Webb

J. Electron. Packag. September 2001, 123(3): 225–231. doi: https://doi.org/10.1115/1.1348012

Abstract

View articletitled, Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling

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Topics: Air flow , Computational fluid dynamics , Computers , Design , Heat sinks , Temperature , Ducts , Vents , Modeling , Computer simulation

A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package

Sarang Shidore, Tien Yu Tom Lee

J. Electron. Packag. September 2001, 123(3): 232–237. doi: https://doi.org/10.1115/1.1349423

Abstract

View articletitled, A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package

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Topics: Computational fluid dynamics , Forced convection , Junctions , Natural convection , Network models , Resistors , Temperature , Optimization , Ball-Grid-Array packaging , Modeling

Thermomechanical Behavior of 96Sn-4Ag and Castin Alloy

R. W. Neu, D. T. Scott, M. W. Woodmansee

J. Electron. Packag. September 2001, 123(3): 238–246. doi: https://doi.org/10.1115/1.1371232

Abstract

View articletitled, Thermomechanical Behavior of 96Sn-4Ag and Castin Alloy

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Topics: Alloys , Creep , Deformation , Solders , Temperature , Thermomechanics , Tin , Stress , Plasticity

Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys

G. Z. Wang, Z. N. Cheng, K. Becker, J. Wilde

J. Electron. Packag. September 2001, 123(3): 247–253. doi: https://doi.org/10.1115/1.1371781

Abstract

View articletitled, Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys

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Topics: Creep , Deformation , Solders , Steady state , Stress , Temperature , Constitutive equations , Finite element analysis , Alloys , Solder joints

Free Abrasive Machining in Slicing Brittle Materials With Wiresaw

Fuqian Yang, Research Assistant Professor, Imin Kao, Associate Professor

J. Electron. Packag. September 2001, 123(3): 254–259. doi: https://doi.org/10.1115/1.1348019

Abstract

View articletitled, Free Abrasive Machining in Slicing Brittle Materials With Wiresaw

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Topics: Abrasive machining , Abrasives , Brittleness , Cutting , Deformation , Fracture (Materials) , Particulate matter , Stress , Wire , Modeling

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, Member ASME, E. Suhir, Fellow ASME, G. W. Kammlott

J. Electron. Packag. September 2001, 123(3): 260–267. doi: https://doi.org/10.1115/1.1349422

Abstract

View articletitled, Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

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Topics: Composite materials , Epoxy adhesives , Epoxy resins , Fillers (Materials) , Molding , Particulate matter , Thermal expansion , Elastic moduli , Thermal stresses , Shear modulus

Warpage of Plastic IC Packages as a Function of Processing Conditions

Dickson T. S. Yeung, Matthew M. F. Yuen

J. Electron. Packag. September 2001, 123(3): 268–272. doi: https://doi.org/10.1115/1.1349421

Abstract

View articletitled, Warpage of Plastic IC Packages as a Function of Processing Conditions

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Topics: Molding , Warping , Finite element analysis , Temperature , Shear modulus , Thermal expansion , Glass transition , Thermal characterization

Orientation Specific Thermal Properties of Polyimide Film

Robert J. Samuels, Nancy E. Mathis

J. Electron. Packag. September 2001, 123(3): 273–277. doi: https://doi.org/10.1115/1.1347986

Abstract

View articletitled, Orientation Specific Thermal Properties of Polyimide Film

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Topics: Heat , Thermal conductivity , Wire , Polymers , Optical microscopy , Thermal properties

Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen

J. Electron. Packag. September 2001, 123(3): 278–283. doi: https://doi.org/10.1115/1.1372319

Abstract

View articletitled, Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material

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Topics: Creep , Damage , Solders , Tin , Stress

Papers on Reliability

The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies

Y. P. Wu, P. L. Tu, Yan C. Chan

J. Electron. Packag. September 2001, 123(3): 284–289. doi: https://doi.org/10.1115/1.1371782

Abstract

View articletitled, The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies

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Topics: Fatigue life , Reliability , Solder joints , Solders , Thermal shock , Ball-Grid-Array packaging , Vibration , Ceramics , Nitrogen , Cycles

Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds

S. H. Fan, Y. C. Chan, J. K. L. Lai

J. Electron. Packag. September 2001, 123(3): 290–294. doi: https://doi.org/10.1115/1.1347997

Abstract

View articletitled, Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds

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Topics: Conveyor systems , Cooling , Cycles , Fatigue , Shear (Mechanics) , Solder joints , Solders , Ball-Grid-Array packaging , Heat transfer , Solidification

Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages

Yu Gu, Toshio Nakamura, Mem. ASME, William T. Chen, Brian Cotterell

J. Electron. Packag. September 2001, 123(3): 295–301. doi: https://doi.org/10.1115/1.1348338

Abstract

View articletitled, Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages

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Topics: Delamination , Fracture (Materials) , Solders , Stress , Fracture (Process) , Flip-chip packages , Finite element analysis

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

S. Shetty, V. Lehtinen, A. Dasgupta, V. Halkola, T. Reinikainen

J. Electron. Packag. September 2001, 123(3): 302–308. doi: https://doi.org/10.1115/1.1362673

Abstract

View articletitled, Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

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Topics: Cycles , Failure , Fatigue , Fatigue testing , Finite element analysis , Solder joints , Stress , Durability , Fatigue life

Technical Briefs

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Xiangcheng Luo,, Yunsheng Xu, and, D. D. L. Chung

J. Electron. Packag. September 2001, 123(3): 309–311. doi: https://doi.org/10.1115/1.1371925

Abstract

View articletitled, Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

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Topics: Contact resistance , Copper , Cycles , Disks , Electrical conductance , Heating , Silicones , Sodium , Thermal conductivity , Thermal stability

Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder

J. Zhao and, Y. Mutoh, T. Ogawa

J. Electron. Packag. September 2001, 123(3): 311–315. doi: https://doi.org/10.1115/1.1371780

Abstract

View articletitled, Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder

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Topics: Fatigue cracks , Fracture (Materials) , Solders , Stress , Fracture (Process)

Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks

Keiji Sasao, Mitsuru Honma, Atsuo Nishihara, Takayuki Atarashi

J. Electron. Packag. September 2001, 123(3): 315–318. doi: https://doi.org/10.1115/1.1371924

Abstract

View articletitled, Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks

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Topics: Air flow , Flow (Dynamics) , Heat sinks , Heat transfer , Numerical analysis , Fins , Pressure drop

Book Review

Industrial Electonics: Devices and Systems, Second Edition

Dale R. Patrick, Stephen W. Fardo, Anthony J. Rafanelli

J. Electron. Packag. September 2001, 123(3): 319. doi: https://doi.org/10.1115/1.1387243

Extract

View articletitled, <em>Industrial Electonics: Devices and Systems, Second Edition</em>

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Topics: Engineers , Transistors , Computers , Junctions , Electronics , Electronics engineers , Energy resources , Gates (Closures) , Generators , Mechanical engineering

Technical Papers

Local Heat Transfer Distributions in Confined Multiple Air Jet Impingement

Sizing of Heat Spreaders Above Dielectric Layers

Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape

Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages

Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses

Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling

A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package

Thermomechanical Behavior of 96Sn-4Ag and Castin Alloy

Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys

Free Abrasive Machining in Slicing Brittle Materials With Wiresaw

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

Warpage of Plastic IC Packages as a Function of Processing Conditions

Orientation Specific Thermal Properties of Polyimide Film

Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material

Papers on Reliability

The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies

Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds

Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

Technical Briefs

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder

Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks

Book Review

Industrial Electonics: Devices and Systems, Second Edition

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