Volume 125 Issue 2 | J. Electron. Packag.

Foreword

In Honor of Dr. M. M. Yovanovich

J. Electron. Packag. June 2003, 125(2): 165–168. doi: https://doi.org/10.1115/1.1568123

View articletitled, In Honor of Dr. M. M. Yovanovich

Topics: Contact resistance , Convection , Engineering teachers , Graduate students , Heat conduction , Heat transfer , Packaging , Students , Thermal resistance , Modeling

Technical Papers

Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling

M. M. Yovanovich, Distinguished Professor Emeritus, Principal Scientific Advisor,

J. Electron. Packag. June 2003, 125(2): 169–177. doi: https://doi.org/10.1115/1.1568124

Abstract

View articletitled, Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling

Open the PDF for in another window

Topics: Circular cylinders , Cooling , Cylinders , Disks , Heat flux , Temperature , Boundary-value problems , Thermal resistance , Approximation

Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels

Y. S. Muzychka, Assistant Professor,, J. R. Culham, Associate Professor, Mem. ASME, M. M. Yovanovich, Distinguished Professor Emeritus, Fellow ASME

J. Electron. Packag. June 2003, 125(2): 178–185. doi: https://doi.org/10.1115/1.1568125

Abstract

View articletitled, Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels

Open the PDF for in another window

Topics: Heat , Temperature

Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Zhe Zhang, Graduate Research Assistant,, E. E. Marotta, Senior Engineer/Scientist/Adjunct Professor—Thermal Development,, J. M. Ochterbeck, Associate Professor,

J. Electron. Packag. June 2003, 125(2): 186–191. doi: https://doi.org/10.1115/1.1568126

Abstract

View articletitled, Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Open the PDF for in another window

Topics: Boundary-value problems , Contact resistance , Cylinders , Stress , Temperature , Thermal conductivity , Model development , Mechanical properties , Dimensions , Contact mechanics

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Wataru Nakayama, Arthur E. Bergles

J. Electron. Packag. June 2003, 125(2): 192–199. doi: https://doi.org/10.1115/1.1568127

Abstract

View articletitled, Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Open the PDF for in another window

Topics: Contact resistance , Cooling , Electrical conductance , Electronic equipment , Flat heat pipes , Flow (Dynamics) , Heat , Heat conduction , Heat sinks , Heat transfer

Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural Convection

Adrian Bejan, Fellow ASME, J. A. Jones Professor of Mechanical Engineering,

J. Electron. Packag. June 2003, 125(2): 200–207. doi: https://doi.org/10.1115/1.1566970

Abstract

View articletitled, Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural Convection

Open the PDF for in another window

Topics: Boundary layers , Cooling , Flow (Dynamics) , Forced convection , Heat , Natural convection , Temperature , Fluids , Design , Plates (structures)

Design of Optimum Plate-Fin Natural Convective Heat Sinks

Avram Bar-Cohen, Madhusudan Iyengar, Allan D. Kraus

J. Electron. Packag. June 2003, 125(2): 208–216. doi: https://doi.org/10.1115/1.1568361

Abstract

View articletitled, Design of Optimum Plate-Fin Natural Convective Heat Sinks

Open the PDF for in another window

Topics: Design , Heat sinks , Heat transfer coefficients , Optimization , Heat transfer , Heat , Energy dissipation , Specific heat , Natural convection

The Case for the Elliptical Spine

Gerald L. McIntyre, Allan D. Kraus

J. Electron. Packag. June 2003, 125(2): 217–220. doi: https://doi.org/10.1115/1.1569261

Abstract

View articletitled, The Case for the Elliptical Spine

Open the PDF for in another window

Topics: Mechanical admittance , Heat , Temperature

Fundamental Performance Limits of Heatsinks

David Watabe Copeland

J. Electron. Packag. June 2003, 125(2): 221–225. doi: https://doi.org/10.1115/1.1569262

Abstract

View articletitled, Fundamental Performance Limits of Heatsinks

Open the PDF for in another window

Topics: Flow (Dynamics) , Thermal conductivity , Pressure drop , Dimensions , Fins , Cooling

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

Alfonso Ortega, Shankar Ramanathan

J. Electron. Packag. June 2003, 125(2): 226–234. doi: https://doi.org/10.1115/1.1569506

Abstract

View articletitled, On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

Open the PDF for in another window

Topics: Cooling , Flow (Dynamics) , Heat , Strips , Temperature , Wakes , Electronic components , Turbulence

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

Alfonso Ortega, Shankar Ramanathan

J. Electron. Packag. June 2003, 125(2): 235–243. doi: https://doi.org/10.1115/1.1569507

Abstract

View articletitled, On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

Open the PDF for in another window

Topics: Cooling , Electrical conductivity , Electronic components , Flow (Dynamics) , Forced convection , Heat , Heat conduction , Heat transfer , Temperature , Thermal conductivity

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Masoud Darbandi, Assistant Professor,, Gerry E. Schneider, Professor,

J. Electron. Packag. June 2003, 125(2): 244–250. doi: https://doi.org/10.1115/1.1569508

Abstract

View articletitled, Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Open the PDF for in another window

Topics: Approximation , Buoyancy , Cavities , Electronic packaging , Flow (Dynamics) , Fluid dynamics , Heat transfer , Modeling , Natural convection , Rayleigh number

Numerical Investigation of the Steady-State Operation of a Cylindrical Capillary Pumped Loop Evaporator

Y. H. Yan, J. M. Ochterbeck

J. Electron. Packag. June 2003, 125(2): 251–260. doi: https://doi.org/10.1115/1.1569509

Abstract

View articletitled, Numerical Investigation of the Steady-State Operation of a Cylindrical Capillary Pumped Loop Evaporator

Open the PDF for in another window

Topics: Boundary-value problems , Flow (Dynamics) , Fluids , Heat , Heat flux , Porous materials , Pressure , Steady state , Subcooling , Temperature

Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review

E. Suhir, Fellow ASME,

J. Electron. Packag. June 2003, 125(2): 261–267. doi: https://doi.org/10.1115/1.1569510

Abstract

View articletitled, Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review

Open the PDF for in another window

Topics: Modeling , Stress , Thermal stresses , Finite element analysis , Photonics , Thermal expansion , Design , Microelectronic devices , Optical fiber , Manufacturing

Additional Technical Papers

Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

Hung-Lung Lee, Shyang-Jye Chang, Sheng-Jye Hwang, Associate Professor,, Francis Su, S. K. Chen

J. Electron. Packag. June 2003, 125(2): 268–275. doi: https://doi.org/10.1115/1.1569957

Abstract

View articletitled, Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

Open the PDF for in another window

Topics: Computer-aided design , Design , Design methodology , Flow (Dynamics) , Taguchi methods , Noise factors , Molding , Packaging , Simulation , Manufacturing

Choosing Working Fluid for Two-Phase Thermosyphon Systems for Cooling of Electronics

Bjo¨rn Palm, Mem. ASME, Rahmatollah Khodabandeh

J. Electron. Packag. June 2003, 125(2): 276–281. doi: https://doi.org/10.1115/1.1571570

Abstract

View articletitled, Choosing Working Fluid for Two-Phase Thermosyphon Systems for Cooling of Electronics

Open the PDF for in another window

Topics: Boiling , Cooling , Fluids , Pressure drop , Heat transfer , Temperature , Heat , Condensation

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

Suk-Jin Ham, Soon-Bok Lee, Mem. ASME

J. Electron. Packag. June 2003, 125(2): 282–288. doi: https://doi.org/10.1115/1.1571571

Abstract

View articletitled, Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

Open the PDF for in another window

Topics: Creep , Deformation , Finite element analysis , Interferometry , Manufacturing , Relaxation (Physics) , Semiconductor wafers , Shear (Mechanics) , Solders , Temperature

Calibrate Piezoresistive Stress Sensors Through the Assembled Structure

Ben-Je Lwo, Mem. ASME, Shen-Yu Wu

J. Electron. Packag. June 2003, 125(2): 289–293. doi: https://doi.org/10.1115/1.1572904

Abstract

View articletitled, Calibrate Piezoresistive Stress Sensors Through the Assembled Structure

Open the PDF for in another window

Topics: Calibration , Sensors , Stress , Temperature

Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal

J. Electron. Packag. June 2003, 125(2): 294–301. doi: https://doi.org/10.1115/1.1571076

Abstract

View articletitled, Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

Open the PDF for in another window

Topics: Failure , Failure analysis , Microwaves , Proton exchange membranes , Radiation (Physics) , Stress , Delamination , Heating , Leakage , Electronic packaging

Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications

Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal, Z. Fathi, I. Ahmad

J. Electron. Packag. June 2003, 125(2): 302–307. doi: https://doi.org/10.1115/1.1571077

Abstract

View articletitled, Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications

Open the PDF for in another window

Topics: Convection , Delamination , Fillers (Materials) , Flip-chip , Microwaves , Ovens , Particulate matter

Foreword

In Honor of Dr. M. M. Yovanovich

Technical Papers

Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling

Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels

Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural Convection

Design of Optimum Plate-Fin Natural Convective Heat Sinks

The Case for the Elliptical Spine

Fundamental Performance Limits of Heatsinks

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Numerical Investigation of the Steady-State Operation of a Cylindrical Capillary Pumped Loop Evaporator

Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review

Additional Technical Papers

Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

Choosing Working Fluid for Two-Phase Thermosyphon Systems for Cooling of Electronics

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

Calibrate Piezoresistive Stress Sensors Through the Assembled Structure

Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Issues

Foreword

Technical Papers

Additional Technical Papers

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only