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Issues
September 2005
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel
J. Electron. Packag. September 2005, 127(3): 193–199.
doi: https://doi.org/10.1115/1.1997155
Topics:
Flow (Dynamics)
,
Forced convection
,
Heat
,
Heat transfer
,
Laminar flow
,
Pumps
,
Temperature
,
Transient heat transfer
,
Transients (Dynamics)
,
Water
Dynamics Of Board-Level Drop Impact
J. Electron. Packag. September 2005, 127(3): 200–207.
doi: https://doi.org/10.1115/1.1938987
A Damage-Mechanics-Based Constitutive Model for Solder Joints
J. Electron. Packag. September 2005, 127(3): 208–214.
doi: https://doi.org/10.1115/1.1939822
Topics:
Constitutive equations
,
Creep
,
Damage
,
Flow (Dynamics)
,
Hardening
,
Kinematics
,
Solder joints
,
Solders
,
Stress
,
Temperature
Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel
J. Electron. Packag. September 2005, 127(3): 215–222.
doi: https://doi.org/10.1115/1.1938207
Topics:
Computer simulation
,
Convection
,
Flow (Dynamics)
,
Forced convection
,
Heat
,
Water
,
Heat flux
,
Fluids
,
Laminar flow
,
Reynolds number
A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks
J. Electron. Packag. September 2005, 127(3): 223–234.
doi: https://doi.org/10.1115/1.1997159
Topics:
Aluminum
,
Fluids
,
Heat sinks
,
Heat transfer
,
Liquid crystals
,
Metal foams
,
Porosity
,
Reynolds number
,
Steady state
,
Temperature
Effect of Stress on the Dielectric Constant of Alumina
J. Electron. Packag. September 2005, 127(3): 235–236.
doi: https://doi.org/10.1115/1.1939029
Topics:
Stress
,
Compressive stress
Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions
J. Electron. Packag. September 2005, 127(3): 237–244.
doi: https://doi.org/10.1115/1.1871192
Topics:
Ball-Grid-Array packaging
,
Displacement
,
Fatigue life
,
Fatigue testing
,
Low cycle fatigue
,
Solder joints
,
Solders
,
Stress
,
Testing
,
Tin
Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted Plastic Quad Flat Back Components in Free Convection
J. Electron. Packag. September 2005, 127(3): 245–254.
doi: https://doi.org/10.1115/1.1938988
Topics:
Computer simulation
,
Heat transfer
,
Junctions
,
Modeling
,
Natural convection
,
Temperature
,
Computational fluid dynamics
,
Dimensions
,
Vehicles
Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization
J. Electron. Packag. September 2005, 127(3): 255–261.
doi: https://doi.org/10.1115/1.1939007
Topics:
Continuum mechanics
,
Deformation
,
Dislocations
,
Lumber
,
Microelectronic devices
,
Plasticity
,
Strain gradient
,
Boundary-value problems
,
Metals
,
Stress
A Micromechanics-Based Vapor Pressure Model in Electronic Packages
J. Electron. Packag. September 2005, 127(3): 262–267.
doi: https://doi.org/10.1115/1.1939027
Topics:
Vapor pressure
,
Temperature
,
Micromechanics (Engineering)
,
Vapors
Modeling of Interfacial Delamination in Plastic IC Packages Under Hygrothermal Loading
J. Electron. Packag. September 2005, 127(3): 268–275.
doi: https://doi.org/10.1115/1.1938209
Topics:
Delamination
,
Fracture (Materials)
Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling
J. Electron. Packag. September 2005, 127(3): 276–285.
doi: https://doi.org/10.1115/1.1938990
Topics:
Creep
,
Finite element analysis
,
Modeling
,
Nanoindentation
,
Stress
,
Viscoelasticity
,
Manganese (Metal)
,
Silicon
,
Relaxation (Physics)
,
Displacement
Design of Micro-Temperature Sensor Array With Thin Film Thermocouples
J. Electron. Packag. September 2005, 127(3): 286–289.
doi: https://doi.org/10.1115/1.1997157
Topics:
Heat conduction
,
Sensors
,
Temperature
,
Thermocouples
,
Thin films
,
Copper
,
Steady state
,
Heat
,
Flow (Dynamics)
,
Finite element analysis
Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model
J. Electron. Packag. September 2005, 127(3): 290–298.
doi: https://doi.org/10.1115/1.1938985
Topics:
Shapes
,
Solder joints
,
Solders
,
Surface tension
,
Warping
,
Finite element analysis
,
Ball-Grid-Array packaging
Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing
J. Electron. Packag. September 2005, 127(3): 299–305.
doi: https://doi.org/10.1115/1.1938206
Topics:
Fibers
,
Lasers
,
Simulation
,
Transients (Dynamics)
,
Temperature
,
Manufacturing
,
Thermomechanics
,
Geometry
,
Displacement
,
Materials properties
A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks
J. Electron. Packag. September 2005, 127(3): 306–313.
doi: https://doi.org/10.1115/1.1997161
Interfacial Thermal Stresses in Trilayer Assemblies
J. Electron. Packag. September 2005, 127(3): 314–323.
doi: https://doi.org/10.1115/1.1938205
Topics:
Shear (Mechanics)
,
Shear stress
,
Stress
,
Manufacturing
,
Plane strain
,
Thermal stresses
,
Finite element analysis
Three-Dimensional Paddle Shift Modeling for IC Packaging
J. Electron. Packag. September 2005, 127(3): 324–334.
doi: https://doi.org/10.1115/1.1938986
Topics:
Computation
,
Deflection
,
Flow (Dynamics)
,
Fluid dynamics
,
Geometry
,
Integrated circuit packaging
,
Integrated circuits
,
Mesh generation
,
Modeling
,
Molding
Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect
J. Electron. Packag. September 2005, 127(3): 335–339.
doi: https://doi.org/10.1115/1.1939028
Topics:
Density
,
Wire
,
Flow (Dynamics)
Characterization of the Solder Paste Release From Small Stencil Apertures in the Stencil Printing Process
J. Electron. Packag. September 2005, 127(3): 340–352.
doi: https://doi.org/10.1115/1.1938208
Technical Briefs
In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates
J. Electron. Packag. September 2005, 127(3): 353–356.
doi: https://doi.org/10.1115/1.1997162
Topics:
Diamonds
,
Laminates
,
Thermal conductivity
,
Porosity
Effects of Two-Dimensional Roughness in Flow in Microchannels
J. Electron. Packag. September 2005, 127(3): 357–361.
doi: https://doi.org/10.1115/1.1997164
Topics:
Poiseuille flow
,
Surface roughness
,
Friction
,
Flow (Dynamics)
,
Microchannels
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