Topics: Finite element methods , Heat conduction , Metals , Modeling , Simulation , Temperature , Chain , Finite element analysis , Thermal conductivity , Clocks

An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads

Fadi Alsaleem, Mohammad I. Younis, Ronald Miles

J. Electron. Packag. September 2008, 130(3): 031002. doi: https://doi.org/10.1115/1.2957319

Abstract

View articletitled, An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads

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Topics: Microelectromechanical systems , Shock (Mechanics) , Stress , Manufacturing , Diaphragms (Mechanical devices) , Diaphragms (Structural)

Thermal Design Methodology for an Embedded Power Electronic Module Using Double-Sided Microchannel Cooling

Manu Mital, Elaine P. Scott

J. Electron. Packag. September 2008, 130(3): 031003. doi: https://doi.org/10.1115/1.2957320

Abstract

View articletitled, Thermal Design Methodology for an Embedded Power Electronic Module Using Double-Sided Microchannel Cooling

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Topics: Cooling , Design , Microchannels , Pressure drop , Heat sinks , Heat , Flow (Dynamics) , Copper , Coolants

Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys

Min Pei, Jianmin Qu

J. Electron. Packag. September 2008, 130(3): 031004. doi: https://doi.org/10.1115/1.2957321

Abstract

View articletitled, Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys

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Topics: Alloys , Creep , Solders , Tin

A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels

David A. Dillard, Alok Mallick, Donatus C. Ohanehi, Jang-Horng Yu, Didier R. Lefebvre

J. Electron. Packag. September 2008, 130(3): 031006. doi: https://doi.org/10.1115/1.2957326

Abstract

View articletitled, A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels

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Topics: Cylinders , Elastomers , High pressure (Physics) , Poisson ratio , Pressure , Casting , Pressure sensors , Deformation , Stress

Analysis of Solderless Press-Fit Interconnections During the Assembly Process

Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano

J. Electron. Packag. September 2008, 130(3): 031007. doi: https://doi.org/10.1115/1.2957330

Abstract

View articletitled, Analysis of Solderless Press-Fit Interconnections During the Assembly Process

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Topics: Finite element analysis , Manufacturing , Pins (Engineering) , Press fits , Stress , Friction

Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints

Hao Lu, Chun Yu, Peilin Li, Junmei Chen

J. Electron. Packag. September 2008, 130(3): 031008. doi: https://doi.org/10.1115/1.2957322

Abstract

View articletitled, Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints

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Topics: Current density , Electrodiffusion , Finite element analysis , Lead-free solders , Solder joints , Solders , Tin

Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

Jin Yang, I. Charles Ume

J. Electron. Packag. September 2008, 130(3): 031009. doi: https://doi.org/10.1115/1.2957328

Abstract

View articletitled, Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

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Topics: Flip-chip , Flip-chip devices , Inspection , Lasers , Modal analysis , Solders , Ultrasound , Mode shapes

Optimization of Pin-Fin Heat Sinks in Bypass Flow Using Entropy Generation Minimization Method

W. A. Khan, J. R. Culham, M. M. Yovanovich

J. Electron. Packag. September 2008, 130(3): 031010. doi: https://doi.org/10.1115/1.2965209

Abstract

View articletitled, Optimization of Pin-Fin Heat Sinks in Bypass Flow Using Entropy Generation Minimization Method

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Topics: Entropy , Flow (Dynamics) , Heat sinks , Optimization , Pressure drop , Heat transfer , Clearances (Engineering)

Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels

E. Elsaadawy, H. Mortazavi, M. S. Hamed

J. Electron. Packag. September 2008, 130(3): 031011. doi: https://doi.org/10.1115/1.2912182

Abstract

View articletitled, Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels

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Topics: Turbulence , Forced convection , Shear stress

Research Papers

Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

Cheng-fu Chen, Pramod C. Karulkar

J. Electron. Packag. September 2008, 130(3): 031005. doi: https://doi.org/10.1115/1.2957324

Abstract

View articletitled, Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

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Topics: Fillers (Materials) , Stress , Particulate matter , Flip-chip packages , Flip-chip devices

A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing

Matthew Sweetland, John H. Lienhard, V, Alexander H. Slocum

J. Electron. Packag. September 2008, 130(3): 031012. doi: https://doi.org/10.1115/1.2966437

Abstract

View articletitled, A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing

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Topics: Convection , Cooling , Lasers , Nozzles , Radiation (Physics) , Temperature , Temperature control , Testing , Manifolds , Pressure

Technology Reviews

Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

Hamid Hadim, Tohru Suwa

J. Electron. Packag. September 2008, 130(3): 034001. doi: https://doi.org/10.1115/1.2957459

Abstract

View articletitled, Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

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Topics: Design , Electronic packaging , Optimization , Optimization algorithms

Technical Briefs

A Numerical Study of a Heat Sink Fin Under a Laminar Impinging Jet

Z. Q. Lou, C. Yap, A. S. Mujumdar

J. Electron. Packag. September 2008, 130(3): 034501. doi: https://doi.org/10.1115/1.2809447

Abstract

View articletitled, A Numerical Study of a Heat Sink Fin Under a Laminar Impinging Jet

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Topics: Heat sinks , Heat transfer , Pressure drop , Reynolds number , Thermal resistance , Fluids , Fins

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A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method

An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads

Thermal Design Methodology for an Embedded Power Electronic Module Using Double-Sided Microchannel Cooling

Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys

A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels

Analysis of Solderless Press-Fit Interconnections During the Assembly Process

Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints

Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

Optimization of Pin-Fin Heat Sinks in Bypass Flow Using Entropy Generation Minimization Method

Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels

Research Papers

Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing

Technology Reviews

Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

Technical Briefs

A Numerical Study of a Heat Sink Fin Under a Laminar Impinging Jet

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