Volume 133 Issue 4 | J. Electron. Packag.

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Volume 133, Issue 4

December 2011

ISSN 1043-7398

EISSN 1528-9044

Research Papers

Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel

Jing He, Liping Liu, Anthony M. Jacobi

J. Electron. Packag. December 2011, 133(4): 041001. doi: https://doi.org/10.1115/1.4005299

Abstract

View articletitled, Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel

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Topics: Convection , Emissivity , Heat , Radiation (Physics) , Temperature , Thermal analysis , Thermal conductivity , Heat transfer , Heat conduction , Flow (Dynamics)

Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations

Issam Mudawar

J. Electron. Packag. December 2011, 133(4): 041002. doi: https://doi.org/10.1115/1.4005300

Abstract

View articletitled, Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations

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Topics: Boiling , Cooling , Flow (Dynamics) , Heat sinks , Microchannels , Critical heat flux , Microchannel flow , Pressure drop

The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions

N. H. Chao, J. A. Cordes, D. Carlucci, M. E. DeAngelis, Jyeching Lee

J. Electron. Packag. December 2011, 133(4): 041003. doi: https://doi.org/10.1115/1.4005375

Abstract

View articletitled, The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions

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Topics: Munitions , Simulation , Temperature , Thermal stresses , Transients (Dynamics) , Electronic packaging , Microelectromechanical systems

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Ping Nicole An, Paul A. Kohl

J. Electron. Packag. December 2011, 133(4): 041004. doi: https://doi.org/10.1115/1.4005289

Abstract

View articletitled, Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

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Topics: Boundary-value problems , Columns (Structural) , Copper , Deformation , Density , Displacement , Errors , Finite element analysis , Finite element model , Modeling

Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement

Ashish Sinha, Yogendra K Joshi

J. Electron. Packag. December 2011, 133(4): 041005. doi: https://doi.org/10.1115/1.4005290

Abstract

View articletitled, Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement

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Topics: Copper , Heat , Heat exchangers , Temperature , Thermal management , Thermoelectric devices , Water , Manufacturing , Fluids , Cooling

Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent Properties

Chih-Sung Chen

J. Electron. Packag. December 2011, 133(4): 041006. doi: https://doi.org/10.1115/1.4005293

Abstract

View articletitled, Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent Properties

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Topics: Stress , Temperature , Warping , Thermomechanics

Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

Chu-Hsuan Sha, Pin J. Wang, Wen P. Lin, Chin C. Lee

J. Electron. Packag. December 2011, 133(4): 041007. doi: https://doi.org/10.1115/1.4005295

Abstract

View articletitled, Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

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Topics: Bonding , Diffusion bonding (Metals) , Pressure , Silver , Shear (Mechanics) , Shear strength , Solders , Atoms , Temperature

Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium

G. Lorenzini, C. Biserni, L. A. Isoldi, E. D. dos Santos, L. A. O. Rocha

J. Electron. Packag. December 2011, 133(4): 041008. doi: https://doi.org/10.1115/1.4005296

Abstract

View articletitled, Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium

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Topics: Cavities , Design , Geometry , Optimization , Shapes , Thermal resistance , Degrees of freedom

Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal

Peipei Li, Jing Liu

J. Electron. Packag. December 2011, 133(4): 041009. doi: https://doi.org/10.1115/1.4005297

Abstract

View articletitled, Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal

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Topics: Convection , Cooling , Heat , Liquid metals , Temperature , Thermal resistance , Water , Stress , Coolants , Computer cooling

Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta

J. Electron. Packag. December 2011, 133(4): 041010. doi: https://doi.org/10.1115/1.4005090

Abstract

View articletitled, Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results

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Topics: Printed circuit boards , Shock (Mechanics) , Manufacturing

A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

Vikram Venkatadri, Bahgat Sammakia, Krishnaswami Srihari, Daryl Santos

J. Electron. Packag. December 2011, 133(4): 041011. doi: https://doi.org/10.1115/1.4005298

Abstract

View articletitled, A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

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Topics: Thermal management , Cooling , Silicon , Circuits , Integrated circuits , Heat

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta

J. Electron. Packag. December 2011, 133(4): 041012. doi: https://doi.org/10.1115/1.4005091

Abstract

View articletitled, Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

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Topics: Damping , Finite element analysis , Modeling , Printed circuit boards , Shock (Mechanics) , Manufacturing , Simulation , Simulation results , Cycles , Materials properties

Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

Etienne L. Bonnaud

J. Electron. Packag. December 2011, 133(4): 041013. doi: https://doi.org/10.1115/1.4005451

Abstract

View articletitled, Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

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Topics: Engineering simulation , Failure , Hardening , Lead-free solders , Simulation , Solder joints , Solders , Stress , Finite element analysis

Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change

D. Sujan, Dereje E. Woldemichael, M. V. V. Murthy, K. N. Seetharamu

J. Electron. Packag. December 2011, 133(4): 041014. doi: https://doi.org/10.1115/1.4005294

Abstract

View articletitled, Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change

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Topics: Manufacturing , Plates (structures) , Shear (Mechanics) , Shear stress , Solders , Stress , Temperature , Die cutting , Shearing (Deformation) , Copper

Thermal Modeling Technique for Multiple Transistors Within Silicon Chip

Tohru Suwa, Hamid Hadim

J. Electron. Packag. December 2011, 133(4): 041015. doi: https://doi.org/10.1115/1.4005291

Abstract

View articletitled, Thermal Modeling Technique for Multiple Transistors Within Silicon Chip

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Topics: Finite element analysis , Heat , Modeling , Silicon chips , Temperature , Temperature distribution , Transistors

Technical Briefs

A Creep Model for Solder Alloys

Yongchang Lee, Cemal Basaran

J. Electron. Packag. December 2011, 133(4): 044501. doi: https://doi.org/10.1115/1.4005288

Abstract

View articletitled, A Creep Model for Solder Alloys

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Topics: Alloys , Creep , Solders

Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model

Wei Han, Marc Rensing, Peter O’Brien, Frank H. Peters

J. Electron. Packag. December 2011, 133(4): 044502. doi: https://doi.org/10.1115/1.4005292

Abstract

View articletitled, Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model

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Topics: Lasers , Manufacturing , Microwaves , Optimization , Packaging , Reflection , Resonance , Strip transmission lines , Simulation results , Simulation

Discussions

Discussion: “Yield Function for Solder Elastoviscoplastic Modeling” (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147–156)

Chandra S. Desai

J. Electron. Packag. December 2011, 133(4): 045501. doi: https://doi.org/10.1115/1.4000901

Extract

View articletitled, Discussion: “Yield Function for Solder Elastoviscoplastic Modeling” (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147–156)

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Topics: Electrons , Modeling , Solders

Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag., 127, pp. 147–156)

M. Dube, T. Kundu

J. Electron. Packag. December 2011, 133(4): 045502. doi: https://doi.org/10.1115/1.4000902

Extract

View articletitled, Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag.<em>,</em> 127, pp. 147–156)

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Topics: Electrons , Solders , Hardening

Research Papers

Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel

Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations

The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement

Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent Properties

Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium

Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal

Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results

A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change

Thermal Modeling Technique for Multiple Transistors Within Silicon Chip

Technical Briefs

A Creep Model for Solder Alloys

Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model

Discussions

Discussion: “Yield Function for Solder Elastoviscoplastic Modeling” (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147–156)

Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag., 127, pp. 147–156)

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