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Issues
June 2017
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Guest Editorial
Special Section on IMECE 2016
J. Electron. Packag. June 2017, 139(2): 020301.
doi: https://doi.org/10.1115/1.4036627
Review Article
Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration
J. Electron. Packag. June 2017, 139(2): 020801.
doi: https://doi.org/10.1115/1.4036238
Topics:
Electronics
,
Manufacturing
,
Printing
,
Biology
Special Section Papers
Transient Analysis of Nonuniform Heat Input Propagation Through a Heat Sink Base
J. Electron. Packag. June 2017, 139(2): 020901.
doi: https://doi.org/10.1115/1.4036065
Topics:
Heat
,
Temperature
,
Transients (Dynamics)
,
Coolants
,
Heat sinks
High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy, Pramod Malatkar
J. Electron. Packag. June 2017, 139(2): 020902.
doi: https://doi.org/10.1115/1.4036356
Topics:
Adhesion
,
Cantilever beams
,
Silicon
,
Solder masks
,
Temperature
,
Testing
,
High temperature
,
Adhesives
Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope
Jimil M. Shah, Oluwaseun Awe, Betsegaw Gebrehiwot, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler
J. Electron. Packag. June 2017, 139(2): 020903.
doi: https://doi.org/10.1115/1.4036363
Topics:
Contamination
,
Corrosion
,
Data centers
,
Particulate matter
,
Temperature
,
Cooling
,
Reliability
,
Damage
,
Failure
Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications
Vana Snigdha Tummala, Ahsan Mian, Nowrin H. Chamok, Dhruva Poduval, Mohammod Ali, Jallisa Clifford, Prasun Majumdar
J. Electron. Packag. June 2017, 139(2): 020904.
doi: https://doi.org/10.1115/1.4036384
Topics:
Additive manufacturing
,
Density
,
Dimensions
,
X-rays
,
Resonance
,
Microscopy
,
Manufacturing
,
Porosity
,
Design
Mechanical Testing for Stretchable Electronics
J. Electron. Packag. June 2017, 139(2): 020905.
doi: https://doi.org/10.1115/1.4036389
Topics:
Electronics
,
Failure
,
Mechanical testing
,
Testing
,
Tension
,
Membranes
,
Reliability
,
Cycles
Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction
Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, Henrik Hovsepyan, Mark Nakamoto, Wei Zhao, Riko Radojcic, Uwe Muehle, Ehrenfried Zschech
J. Electron. Packag. June 2017, 139(2): 020906.
doi: https://doi.org/10.1115/1.4036402
Topics:
Simulation
,
Stress
,
Transistors
,
Flow (Dynamics)
,
Design
,
Silicon
Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies
J. Electron. Packag. June 2017, 139(2): 020907.
doi: https://doi.org/10.1115/1.4036403
Topics:
Engines
,
Light-emitting diodes
,
Temperature
,
Lumber
,
Flat heat pipes
,
Electronics
,
Thermal conductivity
,
Temperature distribution
,
Vapors
Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits
J. Electron. Packag. June 2017, 139(2): 020908.
doi: https://doi.org/10.1115/1.4036404
Topics:
Integrated circuits
,
Sensors
,
Temperature
,
Thermal resistance
,
Thermal analysis
Heat Transfer in Liquid–Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall Temperature
J. Electron. Packag. June 2017, 139(2): 020909.
doi: https://doi.org/10.1115/1.4036405
Topics:
Flow (Dynamics)
,
Heat transfer
,
Tubing
,
Water
,
Wall temperature
Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat Applications
J. Electron. Packag. June 2017, 139(2): 020910.
doi: https://doi.org/10.1115/1.4036406
Topics:
Heat
,
Optimization
,
Temperature
Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections
J. Electron. Packag. June 2017, 139(2): 020911.
doi: https://doi.org/10.1115/1.4036442
Topics:
Atoms
,
Copper
,
Current density
,
Diffusion (Physics)
,
Electrodiffusion
,
Grain boundaries
,
Reliability
,
Temperature
,
Thin films
,
Heating
Characterization of Bulk and Thin Film Fracture in Electronic Packaging
Vijay Subramanian, Kyle Yazzie, Tsgereda Alazar, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar
J. Electron. Packag. June 2017, 139(2): 020912.
doi: https://doi.org/10.1115/1.4036661
Topics:
Failure
,
Fracture (Materials)
,
Fracture toughness
,
Solder masks
,
Stress
,
Thin films
,
Membranes
,
Fracture (Process)
,
Electronic packaging
,
Testing
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