Topics: Cooling , Diamonds , Gallium nitride , Microfluidics , Transistors , Thermal conductivity , Temperature , Junctions , Heat , Thermal management

Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

Yang Peng, Renli Liang, Yun Mou, Jiangnan Dai, Mingxiang Chen, Xiaobing Luo

J. Electron. Packag. December 2019, 141(4): 040804. doi: https://doi.org/10.1115/1.4044624

Abstract

View articletitled, Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

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Topics: Light-emitting diodes , Packaging , Ultraviolet radiation

Research Papers

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo, Sreekant Narumanchi, Paul Paret, Douglas DeVoto, Joshua Major, Samuel Graham

J. Electron. Packag. December 2019, 141(4): 041001. doi: https://doi.org/10.1115/1.4043406

Abstract

View articletitled, Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

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Topics: Cooling , Flow (Dynamics) , Heat , Heat sinks , Temperature , Geometry , Coolants , Fins , Silicon , Electronic packages

Investigation of the Mechanism of Temperature Rise in a Data Center With Cold Aisle Containment

Mingrui Zhang, Zhengwei Long, Qingsong An, Chao Sun, Hao Zhang, Xionglei Cheng, Xiaowei Li

J. Electron. Packag. December 2019, 141(4): 041002. doi: https://doi.org/10.1115/1.4043157

Abstract

View articletitled, Investigation of the Mechanism of Temperature Rise in a Data Center With Cold Aisle Containment

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Topics: Containment , Data centers , Pressure , Temperature , Air flow , Flow (Dynamics)

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Hao Cheng, Yang Peng, Yun Mou, Qinglei Sun, Mingxiang Chen

J. Electron. Packag. December 2019, 141(4): 041003. doi: https://doi.org/10.1115/1.4043645

Abstract

View articletitled, Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

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Topics: Cements (Adhesives) , Ceramics , Dams , Manufacturing , Reliability , Shear strength , Low temperature , Molding , Temperature , Viscosity

Thermal Control Strategies for Reliable and Energy-Efficient Data Centers

Rehan Khalid, Aaron P. Wemhoff

J. Electron. Packag. December 2019, 141(4): 041004. doi: https://doi.org/10.1115/1.4044129

Abstract

View articletitled, Thermal Control Strategies for Reliable and Energy-Efficient Data Centers

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Topics: Cooling systems , Data centers , Energy consumption , Flow (Dynamics) , Reliability , Temperature , Energy efficiency , Simulation , Control equipment

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Bharath Ramakrishnan, Yaser Hadad, Sami Alkharabsheh, Paul R. Chiarot, Bahgat Sammakia

J. Electron. Packag. December 2019, 141(4): 041005. doi: https://doi.org/10.1115/1.4044130

Abstract

View articletitled, Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

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Topics: Computer simulation , Coolants , Cooling , Flow (Dynamics) , Pressure drop , Temperature , Thermal resistance , Heat , Heat transfer coefficients , Heat transfer

Study on Reabsorption Properties of Quantum Dot Color Convertors for Light-Emitting Diode Packaging

Jia-Sheng Li, Yong Tang, Zong-Tao Li, Wen-Quan Kang, Xin-Rui Ding, Bin-Hai Yu

J. Electron. Packag. December 2019, 141(4): 041006. doi: https://doi.org/10.1115/1.4044475

Abstract

View articletitled, Study on Reabsorption Properties of Quantum Dot Color Convertors for Light-Emitting Diode Packaging

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Topics: Light-emitting diodes , Quantum dots , Packaging , Absorption , Light sources

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

M. Y. Tsai, H. J. Chen, J. H. Yeh

J. Electron. Packag. December 2019, 141(4): 041007. doi: https://doi.org/10.1115/1.4044961

Abstract

View articletitled, Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

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Topics: Bending strength , Boundary-value problems , Displacement , Glass , Stress , Failure mechanisms , Surface roughness

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Li Shan, Shuai Shuai, Binjian Ma, Zichen Du, Baris Dogruoz, Damena Agonafer

J. Electron. Packag. December 2019, 141(4): 041008. doi: https://doi.org/10.1115/1.4044962

Abstract

View articletitled, Numerical Investigation of Shape Effect on Microdroplet Evaporation

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Topics: Diffusion (Physics) , Drops , Evaporation , Vapors , Shapes , Simulation

Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation

Fei Chong Ng, Aizat Abas, M. Z. Abdullah

J. Electron. Packag. December 2019, 141(4): 041009. doi: https://doi.org/10.1115/1.4044817

Abstract

View articletitled, Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation

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Topics: Flip-chip , Flow (Dynamics) , Fluids , Pressure

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Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

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Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Investigation of the Mechanism of Temperature Rise in a Data Center With Cold Aisle Containment

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Thermal Control Strategies for Reliable and Energy-Efficient Data Centers

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Study on Reabsorption Properties of Quantum Dot Color Convertors for Light-Emitting Diode Packaging

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation

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