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Volume 143, Issue 4

December 2021

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Guest Editorial
Special Papers
Announcement

Guest Editorial

Special Issue Dedicated to Professor Avram Bar-Cohen

Ronald J. Warzoha, Darin J. Sharar, Raffaele Luca Amalfi, Andrew Tay

J. Electron. Packag. December 2021, 143(4): 040301. doi: https://doi.org/10.1115/1.4052174

Extract

View articletitled, Special Issue Dedicated to Professor Avram Bar-Cohen

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Topics: Engineering teachers

Special Papers

Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Alec Nordlund, Matthew Harrison, Joshua Gess

J. Electron. Packag. December 2021, 143(4): 041101. doi: https://doi.org/10.1115/1.4051752

Abstract

View articletitled, Viability of Cryogenic Cooling to Reduce Processor Power Consumption

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Topics: Coolants , Cooling , Energy consumption , Flow (Dynamics) , Nitrogen , Temperature , Design , Leakage , Solenoids , Thermal stability

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Qi Jin, John T. Wen, Shankar Narayanan

J. Electron. Packag. December 2021, 143(4): 041102. doi: https://doi.org/10.1115/1.4051942

Abstract

View articletitled, Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

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Topics: Compressors , Design , Flow (Dynamics) , Heat , Oscillations , Pressure drop , Secondary cells , Stability , Stress , Valves

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre

J. Electron. Packag. December 2021, 143(4): 041103. doi: https://doi.org/10.1115/1.4051943

Abstract

View articletitled, Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

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Topics: Boiling , Cooling , Dielectric liquids , Heat , Temperature , Copper , Flat heat pipes , Pool boiling , Critical heat flux , Subcooling

Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads

Caleb Anderson, Joshua Richey, Michael Fish, Todd Bandhauer

J. Electron. Packag. December 2021, 143(4): 041104. doi: https://doi.org/10.1115/1.4052360

Abstract

View articletitled, Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads

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Topics: Boiling , Heat , Stress , Temperature , Transients (Dynamics) , Steady state , Heat flux , Vapors

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

Aniket Ajay Lad, Kai A. James, William P. King, Nenad Miljkovic

J. Electron. Packag. December 2021, 143(4): 041105. doi: https://doi.org/10.1115/1.4052400

Abstract

View articletitled, Reduced Order Design Optimization of Liquid Cooled Heat Sinks

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Topics: Design , Flow (Dynamics) , Optimization , Pressure drop , Heat sinks

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer

J. Electron. Packag. December 2021, 143(4): 041106. doi: https://doi.org/10.1115/1.4052465

Abstract

View articletitled, Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

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Topics: Design , Drops , Evaporation , Heat conduction , Heat transfer , Heat transfer coefficients , Optimization , Particle swarm optimization , Shapes , Vapors

The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling

Ankur Miglani, Anali Soto, Justin A. Weibel, Suresh V. Garimella

J. Electron. Packag. December 2021, 143(4): 041107. doi: https://doi.org/10.1115/1.4052532

Abstract

View articletitled, The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling

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Topics: Flow (Dynamics) , Heating , Microchannels , Boiling

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li

J. Electron. Packag. December 2021, 143(4): 041108. doi: https://doi.org/10.1115/1.4052711

Abstract

View articletitled, Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

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Topics: Boiling , Cooling , Electronic packages , Injection molding , Metals , Printing , Additive manufacturing , Flat heat pipes , Manufacturing

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur

J. Electron. Packag. December 2021, 143(4): 041109. doi: https://doi.org/10.1115/1.4052814

Abstract

View articletitled, Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Supplementary data

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Topics: Algorithms , Artificial neural networks , Bridges (Structures) , Cooling , Heat sinks , Junctions , Machine learning , Machinery , Simulation , Steady state

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

Filippo Cataldo, Yuri Carmelo Crea

J. Electron. Packag. December 2021, 143(4): 041110. doi: https://doi.org/10.1115/1.4052670

Abstract

View articletitled, Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

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Topics: Condensers (steam plant) , Heat , Stress , Flow (Dynamics) , Temperature , Fluids , Modeling

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Justin Hollis, Darin J. Sharar, Todd Bandhauer

J. Electron. Packag. December 2021, 143(4): 041111. doi: https://doi.org/10.1115/1.4052669

Abstract

View articletitled, Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

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Topics: Copper , Cycles , Junctions , Phase change materials , Temperature , Heat , Composite materials , Transients (Dynamics) , Thermal management , Cities

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Cheng-Hui Lin, Yoonjin Won

J. Electron. Packag. December 2021, 143(4): 041112. doi: https://doi.org/10.1115/1.4052790

Abstract

View articletitled, Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Supplementary data

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Topics: Boiling , Bubbles , Critical heat flux , Electrodeposition , Heat transfer , Copper , Dynamics (Mechanics) , Microscale devices , Fins , Flow (Dynamics)

Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces

Zhenyu She, Vijay K. Dhir

J. Electron. Packag. December 2021, 143(4): 041113. doi: https://doi.org/10.1115/1.4052716

Abstract

View articletitled, Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces

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Topics: Critical heat flux , Disks , Vapors , Vessels , Boiling , Wavelength , Pool boiling

Announcement

Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal

J. Electron. Packag. December 2021, 143(4): 048001. doi: https://doi.org/10.1115/1.4052403

Extract

View articletitled, Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal

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Topics: Electronics , Engineers , Leadership , Mentoring , Packaging , Photonics

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Guest Editorial

Special Issue Dedicated to Professor Avram Bar-Cohen

Special Papers

Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces

Announcement

Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal

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