Volume 144 Issue 2 | J. Electron. Packag.

Guest Editorial

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar

J. Electron. Packag. June 2022, 144(2): 020301. doi: https://doi.org/10.1115/1.4053122

View articletitled, Special Issue on InterPACK2020

Topics: Additive manufacturing , Cloud computing , Computers , Data centers , Electric vehicles , Electronic packaging , Electronics , Engineering teachers , Microelectronic packaging , Modeling

Review Article

Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

Mei-Chien Lu

J. Electron. Packag. June 2022, 144(2): 020801. doi: https://doi.org/10.1115/1.4052069

Abstract

View articletitled, Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

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Topics: Sensors , Bonding , Electronics

Special Papers

Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate

Chang-Chun Lee, Kuo-Shu Kao, Chi-Wei Wang, Tai-Jyun Yu, Tai-Kuang Lee, Po-Kai Chiu

J. Electron. Packag. June 2022, 144(2): 021101. doi: https://doi.org/10.1115/1.4052072

Abstract

View articletitled, Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate

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Topics: Manufacturing , Metals , Molding materials , Reliability , Silicones , Solders , Epoxy resins , Finite element analysis , Mechanical behavior

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

J. Electron. Packag. June 2022, 144(2): 021102. doi: https://doi.org/10.1115/1.4052231

Abstract

View articletitled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

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Topics: Creep , Current density , Electrodiffusion , Solder joints , Temperature , Anodes , Plasticity , Stress

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Raj Sahu, Emre Gurpinar, Burak Ozpineci

J. Electron. Packag. June 2022, 144(2): 021103. doi: https://doi.org/10.1115/1.4052068

Abstract

View articletitled, Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

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Topics: Design , Heat sinks , Optimization , Temperature

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia

J. Electron. Packag. June 2022, 144(2): 021104. doi: https://doi.org/10.1115/1.4052074

Abstract

View articletitled, Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

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Topics: Composite materials , Energy storage , Thermal conductivity , Electronics , Optimization , Temperature , Design , Heat sinks , Latent heat , Phase change materials

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock

J. Electron. Packag. June 2022, 144(2): 021105. doi: https://doi.org/10.1115/1.4052071

Abstract

View articletitled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

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Topics: Additive manufacturing , Bubbles , Ceramics , Cooling , Critical heat flux , Design , Electronics , Flow (Dynamics) , Fluids , Heat

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka

J. Electron. Packag. June 2022, 144(2): 021106. doi: https://doi.org/10.1115/1.4052070

Abstract

View articletitled, Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

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Topics: Failure , Fatigue , Printed circuit boards , Resistors , Simulation , Solder joints , Solders , Stress , Thermomechanics , Warping

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao

J. Electron. Packag. June 2022, 144(2): 021107. doi: https://doi.org/10.1115/1.4052408

Abstract

View articletitled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile

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Topics: Capacitance , Coolants , Gates (Closures) , MOSFET transistors , Reliability , Temperature , Traction , Roads , Thermal resistance

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

J. Electron. Packag. June 2022, 144(2): 021108. doi: https://doi.org/10.1115/1.4052073

Abstract

View articletitled, High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

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Topics: Elastic moduli , Mechanical properties , Solders , Stress , Stress-strain curves , Temperature , Tensile strength , Testing , Operating temperature , High temperature

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer

J. Electron. Packag. June 2022, 144(2): 021109. doi: https://doi.org/10.1115/1.4052536

Abstract

View articletitled, Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

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Topics: Cables , Cooling , Cycles , Fluids , Mineral oil , Printed circuit boards , Reliability , Temperature , Capacitance , Optical cables

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. June 2022, 144(2): 021110. doi: https://doi.org/10.1115/1.4052767

Abstract

View articletitled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

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Topics: Condensers (steam plant) , Cooling , Flow (Dynamics) , Heat , Heat exchangers , Refrigerants , Stress , Temperature , Pressure drop , Test facilities

Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads

Pradeep Lall, Tony Thomas, Ken Blecker

J. Electron. Packag. June 2022, 144(2): 021111. doi: https://doi.org/10.1115/1.4052630

Abstract

View articletitled, Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads

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Topics: Failure , Service life (Equipment) , Signals , Temperature , Vibration , Principal component analysis

Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures

Pradeep Lall, Ved Soni, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021112. doi: https://doi.org/10.1115/1.4052750

Abstract

View articletitled, Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures

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Topics: Batteries , Cycles , Lithium-ion batteries , Temperature , Regression models , Operating temperature , Reliability

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis

J. Electron. Packag. June 2022, 144(2): 021113. doi: https://doi.org/10.1115/1.4052715

Abstract

View articletitled, Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

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Topics: Flip-chip , Glass transition , High temperature , Mechanical properties , Oxidation , Solders , Storage , Temperature , Viscoelasticity , Optical microscopes

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi

J. Electron. Packag. June 2022, 144(2): 021114. doi: https://doi.org/10.1115/1.4053121

Abstract

View articletitled, Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

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Topics: Engines , Finite element analysis , Lamination , Motors , Stators , Temperature , Thermal conductivity , Winding (process) , Sensitivity analysis , Contact resistance

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Alexis Krone, Josh Kasitz, David Huitink, Hannah Alpert, Debbie G. Senesky, Satish Shetty, Gregory Salamo

J. Electron. Packag. June 2022, 144(2): 021115. doi: https://doi.org/10.1115/1.4053765

Abstract

View articletitled, High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

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Topics: Gallium , Gallium nitride , Hall effect , High temperature , Sensors , Temperature , Alloys , Reliability

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

J. Electron. Packag. June 2022, 144(2): 021116. doi: https://doi.org/10.1115/1.4053764

Abstract

View articletitled, Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

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Topics: Solders , Stress-strain curves , Temperature , Alloys , Operating temperature , Tensile strength , Materials properties

Process-Recipe Development for Printing of Multilayer Circuitry With Z-Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021117. doi: https://doi.org/10.1115/1.4053766

Abstract

View articletitled, Process-Recipe Development for Printing of Multilayer Circuitry With <em>Z</em>-Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

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Topics: Aerosols , Failure , Inks , Printing , Shear (Mechanics) , Sintering , Stress , Vehicles , Temperature , Silver

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Shiva Farzinazar, Zongqing Ren, Jungyun Lim, Jae Choon Kim, Jaeho Lee

J. Electron. Packag. June 2022, 144(2): 021118. doi: https://doi.org/10.1115/1.4053948

Abstract

View articletitled, Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

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Topics: Heat , Optimization , Thermomechanics , Topology , Design , Electronic packaging , Heat sinks

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021119. doi: https://doi.org/10.1115/1.4054131

Abstract

View articletitled, Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

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Topics: Aerosols , Sintering , Metals , Inks , Stress , Shear (Mechanics) , Failure , Design , Temperature

Technical Briefs

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Satyam Saini, Pardeep Shahi, Pratik Bansode, Jimil M. Shah, Dereje Agonafer

J. Electron. Packag. June 2022, 144(2): 024501. doi: https://doi.org/10.1115/1.4053363

Abstract

View articletitled, Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

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Topics: Computational fluid dynamics , Data centers , Heat sinks , Particulate matter , Simulation , Contamination , Flow (Dynamics) , Particle flow

Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

Hayden Carlton, Ange Iradukunda, Asif Imran, Sarah Myane, Noah Akey, Fang Luo, David Huitink

J. Electron. Packag. June 2022, 144(2): 024502. doi: https://doi.org/10.1115/1.4053642

Abstract

View articletitled, Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

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Topics: Electromagnetic interference , Electronics , Nanocomposites , Silicones , Nanoparticles , Iron

Guest Editorial

Special Issue on InterPACK2020

Review Article

Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

Special Papers

Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads

Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Process-Recipe Development for Printing of Multilayer Circuitry With Z-Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Technical Briefs

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

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