Topics: Computers , Cooling , Copper , Corrosion , Nickel plating , Plates (structures) , Pressure drop , Temperature , Thermal resistance , Flow (Dynamics)

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Mahsa Montazeri, Whit M. Vinson, David R. Huitink

J. Electron. Packag. June 2023, 145(2): 021002. doi: https://doi.org/10.1115/1.4055024

Abstract

View articletitled, Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

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Topics: Electrodiffusion , Failure , Solder joints , Solders , Stress , Temperature , Tension , Testing , Current density , Tin

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen

J. Electron. Packag. June 2023, 145(2): 021003. doi: https://doi.org/10.1115/1.4055125

Abstract

View articletitled, An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

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Topics: Boundary element methods , Finite element methods , Finite element model , Stiffness , Electronic packaging , Finite element analysis , Displacement , Traction

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Shuv Dey, Luis Diego Monge Jimenez, J. Michael Brown, Yogendra Joshi

J. Electron. Packag. June 2023, 145(2): 021004. doi: https://doi.org/10.1115/1.4055094

Abstract

View articletitled, Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

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Topics: Climate , Design , Solar energy , Temperature , Thermal management , Transients (Dynamics) , Solar radiation , Smart cities , Computer simulation , Cycles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu

J. Electron. Packag. June 2023, 145(2): 021005. doi: https://doi.org/10.1115/1.4055591

Abstract

View articletitled, Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

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Topics: Capacitance , Circuits , Computational fluid dynamics , Energy dissipation , Heat conduction , Junctions , Modeling , MOSFET transistors , Network models , Power conversion systems

Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density

Haibin Zhang, Quan Sun, Zhidan Sun, Yebo Lu

J. Electron. Packag. June 2023, 145(2): 021006. doi: https://doi.org/10.1115/1.4055469

Abstract

View articletitled, Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density

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Topics: Current density , Silver , Wire , Temperature gradient , Electrodiffusion

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib

J. Electron. Packag. June 2023, 145(2): 021007. doi: https://doi.org/10.1115/1.4055318

Abstract

View articletitled, Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

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Topics: Alloys , Fatigue , Shear (Mechanics) , Shear strength , Solders , Tin , Stress , Solder joints , Fatigue testing , Fatigue life

Numerical Study of Large Footprint (24 × 24 mm²) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2023, 145(2): 021008. doi: https://doi.org/10.1115/1.4055468

Abstract

View articletitled, Numerical Study of Large Footprint (24 × 24 mm<sup>2</sup>) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

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Topics: Flow (Dynamics) , Manifolds , Microchannels , Silicon , Pressure , Temperature , Intake manifolds , Pressure drop

A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers

Soumya Bandyopadhyay, Justin A. Weibel

J. Electron. Packag. June 2023, 145(2): 021009. doi: https://doi.org/10.1115/1.4055987

Abstract

View articletitled, A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers

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Topics: Heat , Transients (Dynamics) , Temperature , Anisotropy

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen

J. Electron. Packag. June 2023, 145(2): 021010. doi: https://doi.org/10.1115/1.4056113

Abstract

View articletitled, Effective Constitutive Relations for Sintered Nano Copper Joints

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Topics: Constitutive equations , Copper , Creep , Deformation , Diffusion (Physics) , Oxidation , Stress , Temperature , Transients (Dynamics) , Sintering

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Pradeep Lall, Kartik Goyal, Curtis Hill

J. Electron. Packag. June 2023, 145(2): 021011. doi: https://doi.org/10.1115/1.4055986

Abstract

View articletitled, Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

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Topics: Copper , Sintering , Surface mount devices , Electrical resistivity , Printing , Drops , Electronics

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Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Numerical Study of Large Footprint (24 × 24 mm²) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers

Effective Constitutive Relations for Sintered Nano Copper Joints

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

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