About the Journal
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems
Frequency: QuarterlyISSN: 1043-7398
Journal of Electronic Packaging (ISSN: 1043-7398), 1989 - Present
Impact Factor: 1.787
2019 Journal Citation Reports ®
(Clarivate Analytics, 2019)