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Journal Articles

Free Abrasive Machining in Slicing Brittle Materials With Wiresaw

Fuqian Yang, Research Assistant Professor, Imin Kao, Associate Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 254–259.
https://doi.org/10.1115/1.1348019
Published Online: August 30, 2000
View Article titled, Free Abrasive Machining in Slicing Brittle Materials With Wiresaw
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Topics: Abrasive machining, Abrasives, Brittleness, Cutting, Deformation, Fracture (Materials), Particulate matter, Stress, Wire, Modeling
Journal Articles

Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw

F. Yang, I. Kao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 191–195.
https://doi.org/10.1115/1.2792683
Published Online: September 1, 1999
View Article titled, Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw
Open the PDF for Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw in another window
Topics: Abrasive machining, Semiconductor wafers, Stress, Abrasives, Manufacturing, Pressure, Shear stress, Slurries, Wire, Cutting