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Journal Articles

Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011004.
Paper No: EP-24-1055
https://doi.org/10.1115/1.4065667
Published Online: June 20, 2024
View Article titled, Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
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Topics: Bridges (Structures), Glass, Integrated circuits, Optics, Switches
Journal Articles

Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2024, 146(1): 010801.
Paper No: EP-23-1022
https://doi.org/10.1115/1.4062529
Published Online: June 23, 2023
View Article titled, Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging
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Topics: Bonding, Bridges (Structures), Design, Packaging
Journal Articles

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041109.
Paper No: EP-21-1087
https://doi.org/10.1115/1.4052814
Published Online: November 5, 2021
View Article titled, Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging
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Topics: Algorithms, Artificial neural networks, Bridges (Structures), Cooling, Heat sinks, Junctions, Machine learning, Machinery, Simulation, Steady state
Includes: Supplementary data
Journal Articles

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041107.
Paper No: EP-19-1131
https://doi.org/10.1115/1.4047409
Published Online: June 26, 2020
View Article titled, Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules
Open the PDF for Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules in another window
Topics: Design, Energy gap, Heat, Junctions, Metals, MOSFET transistors, Steady state, Temperature, Thermal analysis, Transients (Dynamics)
Journal Articles

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2018, 140(1): 017001.
Paper No: EP-17-1111
https://doi.org/10.1115/1.4038735
Published Online: March 2, 2018
View Article titled, Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]
Open the PDF for Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ] in another window
Topics: Bridges (Structures), Electrons, Sensors, Silicon, Stress, Wire
Journal Articles

Thermo-Electric Modeling of Nanotube-Based Environmental Sensors

Michael James Martin, Harish Manohara
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011001.
Paper No: EP-13-1066
https://doi.org/10.1115/1.4028185
Published Online: October 6, 2014
View Article titled, Thermo-Electric Modeling of Nanotube-Based Environmental Sensors
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Topics: Bridges (Structures), Nanotubes, Pressure, Sensors, Temperature, Heating, Modeling
Journal Articles

Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041014.
Paper No: EP-14-1027
https://doi.org/10.1115/1.4028333
Published Online: September 19, 2014
View Article titled, Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors
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Topics: Sensors, Silicon, Stress, Bridges (Structures), Shear stress
Journal Articles

Thermally Actuated Microswitches: Computation of Power Requirements for Alternate Heating Configurations

Elham Maghsoudi, Michael James Martin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021011.
Paper No: EP-12-1075
https://doi.org/10.1115/1.4024012
Published Online: April 12, 2013
View Article titled, Thermally Actuated Microswitches: Computation of Power Requirements for Alternate Heating Configurations
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Topics: Heat, Heating, Switches, Displacement, Simulation, Steady state, Bridges (Structures), Boundary-value problems
Journal Articles

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

Michael R. Maughan, Robert R. Stephens, Donald M. Blackketter, Karl K. Rink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011009.
https://doi.org/10.1115/1.3068318
Published Online: February 13, 2009
View Article titled, Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators
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Topics: Finite element analysis, Glass, Press fits, Shear stress, Stress, Thermal stresses, Welding, Wire, Bridges (Structures), Laser welding
Journal Articles

Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

Luke M. Thompson, Michael R. Maughan, Karl K. Rink, Donald M. Blackketter, Robert R. Stephens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 300–306.
https://doi.org/10.1115/1.2753920
Published Online: November 29, 2006
View Article titled, Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals
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Topics: Finite element analysis, Glass, Stress, Wire, Manufacturing, Bridges (Structures), Cooling, Temperature
Journal Articles

Computer Simulation of Solder Bridging Phenomena

T. J. Singler, Xu Zhang, K. A. Brakke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 122–126.
https://doi.org/10.1115/1.2792141
Published Online: September 1, 1996
View Article titled, Computer Simulation of Solder Bridging Phenomena
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Topics: Computer simulation, Solders, Bridges (Structures), Liquid metals, Stability, Equilibrium (Physics)
Journal Articles

Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling

Yi-Hsin Pao, Scott Badgley, Ratan Govila, Linda Baumgartner, Richard Allor, Ron Cooper
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 135–144.
https://doi.org/10.1115/1.2906410
Published Online: June 1, 1992
View Article titled, Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling
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Topics: Mechanical behavior, Solder joints, Fracture (Process), Solders, Stress, Creep, Fatigue, Shear stress, Adhesives, Alloys