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Journal Articles

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Arman Nokhosteen, M. Soltani, Banafsheh Barabadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011002.
Paper No: EP-18-1029
https://doi.org/10.1115/1.4041666
Published Online: February 25, 2019
View Article titled, Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects
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Topics: Boundary-value problems, Heat, Integrated circuits, Microelectronic devices, Modeling, Principal component analysis, Simulation, Temperature, Temperature distribution, Temperature profiles
Journal Articles

Intermittent Failures in Hardware and Software

Roozbeh Bakhshi, Surya Kunche, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011014.
Paper No: EP-13-1111
https://doi.org/10.1115/1.4026639
Published Online: February 18, 2014
View Article titled, Intermittent Failures in Hardware and Software
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Topics: Computer software, Failure, Hardware
Journal Articles

Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System

Huy N. Phan, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031003.
https://doi.org/10.1115/1.4004847
Published Online: September 14, 2011
View Article titled, Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System
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Topics: Cooling, Currents, Design, Heat, Heat sinks, Temperature, Thermoelectric coolers, Thermoelectric cooling, Cooling systems, Computer software
Journal Articles

Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)

M. Herna´ndez-Mora, J. E. Gonza´lez, M. Ve´lez-Reyes, J. M. Ortiz-Rodrı´guez, Y. Pang, E. Scott
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 477–490.
https://doi.org/10.1115/1.1827264
Published Online: January 24, 2005
View Article titled, Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)
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Topics: Capacitance, Electronics, Heat transfer, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Computer software, Heat, Design
Journal Articles

Highlights from the European Thermal Project PROFIT

Clemens J. M. Lasance
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2004, 126(4): 565–570.
https://doi.org/10.1115/1.1827258
Published Online: January 24, 2005
View Article titled, Highlights from the European Thermal Project PROFIT
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Topics: Modeling, Reliability, Safety, Steady state, Temperature, Computer software, Electronic products, Temperature gradient
Journal Articles

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

Peter J. Rodgers, Vale´rie C. Eveloy, Mark R. Davies
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 76–83.
https://doi.org/10.1115/1.1533060
Published Online: March 14, 2003
View Article titled, An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion
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Topics: Computer software, Flow (Dynamics), Forced convection, Heat transfer, Junctions, Modeling, Temperature, Thermal conductivity, Errors, Computational fluid dynamics
Journal Articles

Determination of Packaging Material Properties Utilizing Image Correlation Techniques

D. Vogel, R. Ku¨hnert, M. Dost, B. Michel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 345–351.
https://doi.org/10.1115/1.1506698
Published Online: December 12, 2002
View Article titled, Determination of Packaging Material Properties Utilizing Image Correlation Techniques
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Topics: Atomic force microscopy, Deformation, Displacement, Displacement measurement, Flip-chip devices, Fracture (Materials), Materials properties, Packaging, Reliability, Stress
Journal Articles

Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

Dagmar Beyerlein, Lee E. Hornberger
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 366–371.
https://doi.org/10.1115/1.1388562
Published Online: February 6, 2001
View Article titled, Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept
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Topics: Cavities, Design, Flow (Dynamics), Molding, Resins, Simulation, Wire, Deformation, Computer software, Gates (Closures)
Journal Articles

Software “Reliability”?

Robert S. Hanmer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 357–360.
https://doi.org/10.1115/1.1289630
Published Online: January 26, 2000
View Article titled, Software “Reliability”?
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Topics: Computer software, Errors, Hardware, Reliability, Failure
Journal Articles

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

L. Nguyen, C. Quentin, W. Lee, S. Bayyuk, S. A. Bidstrup-Allen, S.-T. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 138–146.
https://doi.org/10.1115/1.483146
Published Online: September 21, 1999
View Article titled, Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding
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Topics: Cavities, Flow (Dynamics), Molding, Pressure, Simulation, Temperature, Transfer molding, Viscosity, Computer simulation, Computer software
Journal Articles

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

X. Wu, X. Dou, C.-P. Yeh, K. Waytt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 141–144.
https://doi.org/10.1115/1.2792601
Published Online: June 1, 1998
View Article titled, Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow
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Topics: Simulation, Solder joints, Solders, Geometry, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation
Journal Articles

Dynamic Aspects of Wetting Balance Tests

K. W. Moon, W. J. Boettinger, M. E. Williams, D. Josell, B. T. Murray, W. C. Carter, C. A. Handwerker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 174–183.
https://doi.org/10.1115/1.2792149
Published Online: September 1, 1996
View Article titled, Dynamic Aspects of Wetting Balance Tests
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Topics: Wetting, Plates (structures), Fluids, Glass, Shapes, Solders, Computer software, Equilibrium (Physics), Flow (Dynamics), Shear stress
Journal Articles

Comparison of LCC Solder Joint Life Predictions With Experimental Data

Liang-chi Wen, Ronald G. Ross, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 109–115.
https://doi.org/10.1115/1.2792076
Published Online: June 1, 1995
View Article titled, Comparison of LCC Solder Joint Life Predictions With Experimental Data
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Topics: Solder joints, Algorithms, Pins (Engineering), Stress, Temperature, Failure, Electronic packaging, Fatigue, Ceramics, Computer software
Journal Articles

Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices

Pardeep K. Bhatti, Klaus Gschwend, Abel Y. Kwang, Ahmer R. Syed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 20–25.
https://doi.org/10.1115/1.2792063
Published Online: March 1, 1995
View Article titled, Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices
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Topics: Creep, Solder joints, Surface mount devices, Finite element analysis, Computer software, Degrees of freedom, Materials properties, Surface mount components
Journal Articles

Methodology for Automated Design of Microelectronic Packages

S. D. Rajan, V. Sarihan, M. Mahalingam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 274–281.
https://doi.org/10.1115/1.2905698
Published Online: December 1, 1994
View Article titled, Methodology for Automated Design of Microelectronic Packages
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Topics: Design, Nonlinear programming, Computer software, Design methodology, Finite element analysis, Packaging, Design sensitivity analysis, Electronic packages, Electronic packaging, Equipment performance
Journal Articles

Crack Propagation in Solder Joints During Thermal-Mechanical Cycling

Ronald G. Ross, Jr., Liang-chi Wen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 69–75.
https://doi.org/10.1115/1.2905507
Published Online: June 1, 1994
View Article titled, Crack Propagation in Solder Joints During Thermal-Mechanical Cycling
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Topics: Crack propagation, Solder joints, Failure, Creep, Cycles, Finite element analysis, Fracture (Materials), Solders, Computer software, Cracking (Materials)
Journal Articles

Effect of Chip and Pad Geometry on Solder Joint Formation in SMT

S. M. Heinrich, P. E. Liedtke, N. J. Nigro, A. F. Elkouh, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 433–439.
https://doi.org/10.1115/1.2909353
Published Online: December 1, 1993
View Article titled, Effect of Chip and Pad Geometry on Solder Joint Formation in SMT
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Topics: Geometry, Solder joints, Solders, Density, Gravity (Force), Printed circuit boards, Computer software, Computers, Design, Engineers
Journal Articles

Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules

A. Hadim, N. J. Nagurny
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 300–304.
https://doi.org/10.1115/1.2905454
Published Online: September 1, 1992
View Article titled, Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules
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Topics: Design, Cavities, Computer software, Heat conduction, Heat transfer, Network models, Solders, Thermal analysis
Journal Articles

Solder Creep-Fatigue Interactions With Flexible Leaded Parts

R. G. Ross, Jr., L. C. Wen, G. R. Mon, E. Jetter
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 185–192.
https://doi.org/10.1115/1.2906416
Published Online: June 1, 1992
View Article titled, Solder Creep-Fatigue Interactions With Flexible Leaded Parts
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Topics: Creep, Fatigue, Solders, Computer software, Cycles, Stress, Temperature, Accounting, Algorithms, Deflection
Journal Articles

Structural Analyses of Spacecraft Electronic Packages

S. Kannappan, V. Kunukkassril
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1992, 114(1): 96–99.
https://doi.org/10.1115/1.2905449
Published Online: March 1, 1992
View Article titled, Structural Analyses of Spacecraft Electronic Packages
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Topics: Electronic packages, Space vehicles, Structural analysis, Finite element methods, Stress, Computer software, Design, Electronics, Manufacturing, Modal analysis