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Journal Articles

Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

Sara K. Lyons, Aditya Chandramohan, Justin A. Weibel, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041019.
Paper No: EP-21-1161
https://doi.org/10.1115/1.4054263
Published Online: April 22, 2022
View Article titled, Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation
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Topics: Resolution (Optics), Temperature, Thermography, Deformation, Temperature measurement, Emissivity
Journal Articles

Error Reduction in Infrared Thermography by Multiframe Super-Resolution

Aditya Chandramohan, Sara K. Lyons, Justin A. Weibel, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041008.
Paper No: EP-18-1028
https://doi.org/10.1115/1.4041360
Published Online: October 1, 2018
View Article titled, Error Reduction in Infrared Thermography by Multiframe Super-Resolution
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Topics: Emissivity, Errors, Resolution (Optics), Temperature, Thermography, Uncertainty
Journal Articles

Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel

Jing He, Liping Liu, Anthony M. Jacobi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041001.
https://doi.org/10.1115/1.4005299
Published Online: November 17, 2011
View Article titled, Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel
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Topics: Convection, Emissivity, Heat, Radiation (Physics), Temperature, Thermal analysis, Thermal conductivity, Heat transfer, Heat conduction, Flow (Dynamics)
Journal Articles

Meso Scale Pulsating Jets for Electronics Cooling

Jivtesh Garg, Mehmet Arik, Stanton Weaver, Todd Wetzel, Seyed Saddoughi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 503–511.
https://doi.org/10.1115/1.2065727
Published Online: April 20, 2005
View Article titled, Meso Scale Pulsating Jets for Electronics Cooling
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Topics: Heat, Heat flux, Heat transfer, Heat transfer coefficients, Jets, Natural convection, Temperature, Temperature measurement, Thermal management, Cooling
Journal Articles

Prediction of Thermal Performance of Wire-Bonded Plastic Ball Grid Array Package for Underhood Automotive Applications

K. Ramakrishna, Fellow ASME, J. R. Trent
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 447–455.
https://doi.org/10.1115/1.1602710
Published Online: September 17, 2003
View Article titled, Prediction of Thermal Performance of Wire-Bonded Plastic Ball Grid Array Package for Underhood Automotive Applications
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Topics: Junctions, Molding, Printed circuit boards, Temperature, Thermal conductivity, Natural convection, Wire, Automotive industry, Emissivity
Journal Articles

Natural Convection Cooling of Vertical Rectangular Channels in Air Considering Radiation and Wall Conduction

D. A. Hall, G. C. Vliet, T. L. Bergman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 75–84.
https://doi.org/10.1115/1.2792671
Published Online: June 1, 1999
View Article titled, Natural Convection Cooling of Vertical Rectangular Channels in Air Considering Radiation and Wall Conduction
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Topics: Cooling, Heat conduction, Natural convection, Radiation (Physics), Temperature, Wall temperature, Emissivity, Plates (structures), Separation (Technology), Temperature distribution
Journal Articles

A Preliminary Investigation of the Cooling of Electronic Components With Flat Plate Heat Sinks

I. Ahmed, R. J. Krane, J. R. Parsons
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 60–67.
https://doi.org/10.1115/1.2905495
Published Online: March 1, 1994
View Article titled, A Preliminary Investigation of the Cooling of Electronic Components With Flat Plate Heat Sinks
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Topics: Cooling, Electronic components, Flat plates, Heat sinks, Computer simulation, Natural convection, Temperature, Algorithms, Coatings, Emissivity
Journal Articles

Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces

S. Heng, W. Z. Black
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 286–293.
https://doi.org/10.1115/1.2905408
Published Online: September 1, 1991
View Article titled, Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces
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Topics: Temperature, Emissivity, Image processing, Temperature measurement, Computer software, Computers, Hardware, Heat flux, Infrared imaging, Overlays (Materials engineering)