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Journal Articles

High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band

El Amjed Hajlaoui, Ziyad M. Almohaimeed, Abdullah Almohaimeed, Wazie Abdulkawi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011002.
Paper No: EP-23-1079
https://doi.org/10.1115/1.4065145
Published Online: April 12, 2024
View Article titled, High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band
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Topics: Biomedicine, Energy gap, Radiation (Physics), Design, Reflectance, Surface waves (Fluid)
Journal Articles

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
https://doi.org/10.1115/1.4049293
Published Online: February 22, 2021
View Article titled, Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
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Topics: Electronics, Gallium nitride, Heat, Nanoscale phenomena, Phonons, Temperature, Thermal conductivity, Electromagnetic scattering, Energy gap, Diamonds
Journal Articles

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041107.
Paper No: EP-19-1131
https://doi.org/10.1115/1.4047409
Published Online: June 26, 2020
View Article titled, Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules
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Topics: Design, Energy gap, Heat, Junctions, Metals, MOSFET transistors, Steady state, Temperature, Thermal analysis, Transients (Dynamics)
Journal Articles

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

James Spencer Lundh, Yiwen Song, Bikramjit Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Brianna A. Klein, Dustin Kendig, Hyungtak Kim, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031113.
Paper No: EP-20-1012
https://doi.org/10.1115/1.4047100
Published Online: May 21, 2020
View Article titled, Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics
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Topics: Dynamics (Mechanics), Electronics, Energy gap, Gallium nitride, Heating, Imaging, Steady state, Temperature, Temperature measurement, Thermal characterization
Journal Articles

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

A. Bar-Cohen, J. J. Maurer, D. H. Altman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040803.
Paper No: EP-18-1067
https://doi.org/10.1115/1.4043404
Published Online: July 30, 2019
View Article titled, Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Transistors, Thermal conductivity, Temperature, Junctions, Heat, Thermal management
Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2019, 141(2): 020801.
Paper No: EP-18-1026
https://doi.org/10.1115/1.4041813
Published Online: February 25, 2019
View Article titled, Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
Open the PDF for Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications in another window
Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry