1-20 of 21
Melting
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Transient Liquid Phase Bond Acceleration Using Copper Nanowires

Accepted Manuscript
John Harris, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1038
https://doi.org/10.1115/1.4066042
Published Online: July 20, 2024
View Article titled, Transient Liquid Phase Bond Acceleration Using Copper Nanowires
Open the PDF for Transient Liquid Phase Bond Acceleration Using Copper Nanowires in another window
Topics: Copper, Nanowires, Transients (Dynamics), Bonding, Solders, Intermetallic compounds, Temperature, Acoustic microscopy, Electroforming, Electronics
Journal Articles

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Michael Deckard, Darin J. Sharar, Michael Fish, Patrick J. Shamberger
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011201.
Paper No: EP-21-1153
https://doi.org/10.1115/1.4054651
Published Online: July 7, 2022
View Article titled, Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat
Open the PDF for Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat in another window
Topics: Heat, Phase change materials, Steady state, Temperature, Transients (Dynamics), Melting, Copper, Heat sinks, Tradeoffs, Simulation
Journal Articles

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021104.
Paper No: EP-20-1142
https://doi.org/10.1115/1.4052074
Published Online: September 24, 2021
View Article titled, Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model
Open the PDF for Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model in another window
Topics: Composite materials, Energy storage, Thermal conductivity, Electronics, Optimization, Temperature, Design, Heat sinks, Latent heat, Phase change materials
Journal Articles

Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Manny X. de Jesús-López, Pedro O. Quintero, Lauren M. Boteler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031110.
Paper No: EP-20-1013
https://doi.org/10.1115/1.4047063
Published Online: May 13, 2020
View Article titled, Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles
Open the PDF for Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles in another window
Topics: Cycles, Melting, Metals, Solidification, Temperature, Alloys, Stability
Journal Articles

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Wenbo Zhu, Xiaoting Wang, Mingyu Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021006.
Paper No: EP-19-1070
https://doi.org/10.1115/1.4046341
Published Online: March 9, 2020
View Article titled, Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures
Open the PDF for Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures in another window
Topics: Bonding, Temperature, Temperature profiles, Tin, Solders, Low temperature, Pressure, Shear strength, Heat, Melting
Journal Articles

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

Wen-Xiao Chu, Hao-Yu Lin, Chi-Chuan Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014502.
Paper No: EP-19-1039
https://doi.org/10.1115/1.4044774
Published Online: September 24, 2019
View Article titled, Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy
Open the PDF for Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy in another window
Topics: Contact resistance, Melting, Optical fiber, Temperature, Pressure, Alloys, Stress, Heating, Surface roughness, Heat sinks
Journal Articles

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
https://doi.org/10.1115/1.4039027
Published Online: March 2, 2018
View Article titled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics
Open the PDF for Lead-Free Alternatives for Interconnects in High-Temperature Electronics in another window
Topics: Alloys, Electronics, High temperature, Solders, Temperature, Testing, Thermal conductivity, Failure, Melting, Tensile testing
Journal Articles

Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers

Byung-Seung Yim, Young-Eui Shin, Jong-Min Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041007.
Paper No: EP-17-1007
https://doi.org/10.1115/1.4038028
Published Online: October 13, 2017
View Article titled, Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers
Open the PDF for Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers in another window
Topics: Ball-Grid-Array packaging, Composite materials, Fillers (Materials), Solders, Wetting, Polymers, Melting, Statistical process control, Flow (Dynamics)
Journal Articles

Effect of Indium Content on the Melting Point, Dross, and Oxidation Characteristics of Sn-2Ag-3Bi-xIn Solders

Ae-Jeong Jeon, Seong-Jun Kim, Sang-Hoon Lee, Chung-Yun Kang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021006.
Paper No: EP-12-1082
https://doi.org/10.1115/1.4023529
Published Online: March 28, 2013
View Article titled, Effect of Indium Content on the Melting Point, Dross, and Oxidation Characteristics of Sn-2Ag-3Bi-xIn Solders
Open the PDF for Effect of Indium Content on the Melting Point, Dross, and Oxidation Characteristics of Sn-2Ag-3Bi-xIn Solders in another window
Topics: Alloys, Oxidation, Solders, Tin, Temperature, Melting
Journal Articles

Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys

Jorge Mireles, Ho-Chan Kim, In Hwan Lee, David Espalin, Francisco Medina, Eric MacDonald, Ryan Wicker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011008.
Paper No: EP-12-1034
https://doi.org/10.1115/1.4007160
Published Online: February 26, 2013
View Article titled, Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys
Open the PDF for Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys in another window
Topics: Alloys, Extruding, Melting, Modeling, Solders, Temperature, Tin, Flow (Dynamics)
Journal Articles

Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

Mustapha Faraji, Hamid El Qarnia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021011.
https://doi.org/10.1115/1.3103953
Published Online: April 3, 2009
View Article titled, Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage
Open the PDF for Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage in another window
Topics: Cooling, Electronic components, Heat, Heat conduction, Heat transfer, Melting, Rayleigh number, Temperature, Phase change materials, Heat sinks
Journal Articles

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

K. Lafdi, O. Mesalhy, A. Elgafy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021004.
https://doi.org/10.1115/1.2912185
Published Online: April 25, 2008
View Article titled, Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications
Open the PDF for Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications in another window
Topics: Cooling, Design, Fins, Heat, Heat sinks, Phase change materials, Porosity, Shapes, Temperature, Thermal conductivity
Journal Articles

Effect of Reversing Heat Flux Direction During Reflow on Void Formation in High-Lead Solder Bumps

Daijiao Wang, Ronald L. Panton
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 440–445.
https://doi.org/10.1115/1.2070047
Published Online: January 4, 2005
View Article titled, Effect of Reversing Heat Flux Direction During Reflow on Void Formation in High-Lead Solder Bumps
Open the PDF for Effect of Reversing Heat Flux Direction During Reflow on Void Formation in High-Lead Solder Bumps in another window
Topics: Cooling, Heat flux, Heating, Solders, Solidification, Melting, Flow (Dynamics)
Journal Articles

Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?

Shankar Krishnan, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
https://doi.org/10.1115/1.1772411
Published Online: October 6, 2004
View Article titled, Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?
Open the PDF for Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks? in another window
Topics: Copper, Heat sinks, Junctions, Melting, Phase change materials, Temperature, Thermal conductivity, Transients (Dynamics), Thermal management, Energy storage
Journal Articles

Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

Daijiao Wang, Ronald L. Panton
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 120–126.
https://doi.org/10.1115/1.1876472
Published Online: May 18, 2004
View Article titled, Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies
Open the PDF for Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies in another window
Topics: Cooling, Flip-chip assemblies, Heating, Melting, Solder joints, Solders, Temperature, Bubbles, Flow (Dynamics), Reliability
Journal Articles

Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens

A. Tava´rez, J. E. Gonza´lez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 335–346.
https://doi.org/10.1115/1.1569955
Published Online: September 17, 2003
View Article titled, Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens
Open the PDF for Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens in another window
Topics: Ovens, Solders, Temperature, Weight (Mass), Modeling, Heat transfer, Heating, Cooling, Temperature profiles, Melting
Journal Articles

Simulation of Void Growth in Molten Solder Bumps

Ronald L. Panton, Fellow ASME, Jong W. Lee, Lakhi Goenka, Achyuta Achari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 329–334.
https://doi.org/10.1115/1.1569954
Published Online: September 17, 2003
View Article titled, Simulation of Void Growth in Molten Solder Bumps
Open the PDF for Simulation of Void Growth in Molten Solder Bumps in another window
Topics: Bubbles, Melting, Solders, Flow (Dynamics), Surface tension, Viscosity, Temperature
Journal Articles

Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging

Suman Chakraborty, Pradip Dutta, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 126–133.
https://doi.org/10.1115/1.1535445
Published Online: March 14, 2003
View Article titled, Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging
Open the PDF for Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging in another window
Topics: Freezing, Heat transfer, Melting, Packaging, Solidification, Temperature distribution, Phase change materials, Convection
Journal Articles

Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses

A. G. Evans, M. Y. He, J. W. Hutchinson, M. Shaw
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 211–217.
https://doi.org/10.1115/1.1370376
Published Online: October 1, 2000
View Article titled, Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses
Open the PDF for Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses in another window
Topics: Electronics, Melting, Steady state, Temperature, Transients (Dynamics), Junctions, Design, Temperature distribution, Phase change materials
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
View Article titled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
Open the PDF for Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors in another window
Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes