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Journal Articles

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Peter Lukacs, Tibor Rovensky, Alexandr Otahal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
https://doi.org/10.1115/1.4062470
Published Online: May 18, 2023
View Article titled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
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Topics: Cross section (Physics), Lead-free solders, Printed circuit boards, Solder joints, Soldering, Solders, Surface mount devices, Capacitors, Dislocations, Reliability
Journal Articles

Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

Daijiao Wang, Ronald L. Panton
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 120–126.
https://doi.org/10.1115/1.1876472
Published Online: May 18, 2004
View Article titled, Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies
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Topics: Cooling, Flip-chip assemblies, Heating, Melting, Solder joints, Solders, Temperature, Bubbles, Flow (Dynamics), Reliability
Journal Articles

Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens

A. Tava´rez, J. E. Gonza´lez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 335–346.
https://doi.org/10.1115/1.1569955
Published Online: September 17, 2003
View Article titled, Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens
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Topics: Ovens, Solders, Temperature, Weight (Mass), Modeling, Heat transfer, Heating, Cooling, Temperature profiles, Melting
Journal Articles

Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications

Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal, Z. Fathi, I. Ahmad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 302–307.
https://doi.org/10.1115/1.1571077
Published Online: June 10, 2003
View Article titled, Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications
Open the PDF for Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications in another window
Topics: Convection, Delamination, Fillers (Materials), Flip-chip, Microwaves, Ovens, Particulate matter
Journal Articles

Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages

H. Fre´mont, J. Y. Dele´tage, A. Pintus, Y. Danto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 16–18.
https://doi.org/10.1115/1.1326436
Published Online: January 1, 2000
View Article titled, Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages
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Topics: Diffusion (Physics), Molding, Resins, Water, Polymers, Diffusion processes, Weight (Mass), Ceramics, Finite element analysis, Geometry
Journal Articles

Alternative Curing Methods for FCOB Underfill

M. M. Merton, C. P. Malhotra, N. Nikmanesh, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 249–254.
https://doi.org/10.1115/1.2793848
Published Online: December 1, 1999
View Article titled, Alternative Curing Methods for FCOB Underfill
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Topics: Hardening (Curing), Condensation, Failure mechanisms, Heat transfer, Vapors, Delamination, Failure, Fatigue failure, Flip-chip, Heating
Journal Articles

Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach

Scott Anson, C. Sahay, Linda Head, James Constable
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 94–100.
https://doi.org/10.1115/1.2792138
Published Online: June 1, 1996
View Article titled, Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach
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Topics: Experimental design, Solders, Probes, Printed circuit boards, Adhesion, Circuits, Drying, Electronics, Ovens, Pressure
Journal Articles

Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection

Y. S. Son, T. L. Bergman, M. T. Hyun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 317–322.
https://doi.org/10.1115/1.2792111
Published Online: December 1, 1995
View Article titled, Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection
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Topics: Heat transfer, Nitrogen, Ovens, Reflow soldering, Simulation, Buoyancy, Computer simulation, Cooling, Fluctuations (Physics), Heating
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 220–224.
https://doi.org/10.1115/1.2792095
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation
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Topics: Computer simulation, Hardening (Curing), Jets, Ovens, Pressure, Vapors, Design, Contamination, Flow visualization, Heat
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

K. J. Zwick, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 215–219.
https://doi.org/10.1115/1.2792094
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization
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Topics: Flow visualization, Hardening (Curing), Jets, Ovens, Vapors, Vortices, Condensation, Contamination, Flow (Dynamics), Bonding
Journal Articles

A Detailed Thermal Model of the Infrared Reflow Soldering Process

M. A. Eftychiou, T. L. Bergman, G. Y. Masada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 55–62.
https://doi.org/10.1115/1.2909302
Published Online: March 1, 1993
View Article titled, A Detailed Thermal Model of the Infrared Reflow Soldering Process
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Topics: Reflow soldering, Heat conduction, Heat transfer, Mixed convection, Convection, Manufacturing, Ovens, Radiation (Physics), Solders, Temperature effects
Journal Articles

Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process

M. Eftychiou, T. L. Bergman, G. Y. Masada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 48–54.
https://doi.org/10.1115/1.2905441
Published Online: March 1, 1992
View Article titled, Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process
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Topics: Reflow soldering, Temperature effects, Engineering simulation, Manufacturing, Ovens, Radiative heat transfer, Simulation, Circuits, Computer simulation, Transient heat transfer
Journal Articles

Thermal Effects During Infrared Solder Reflow—Part I: Heat Transfer Mechanisms

N. J. Fernandes, T. L. Bergman, G. Y. Masada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 41–47.
https://doi.org/10.1115/1.2905440
Published Online: March 1, 1992
View Article titled, Thermal Effects During Infrared Solder Reflow—Part I: Heat Transfer Mechanisms
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Topics: Heat transfer, Reflow soldering, Temperature effects, Ovens, Buoyancy, Computer simulation, Convection, Forced convection, Heating, Transients (Dynamics)
Journal Articles

A Transient Technique to Measure the Temperature Coefficient of Resistance for Thin Film Resistors

Bahgat Sammakia, Phillip Vadala, Thomas Homa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 143–148.
https://doi.org/10.1115/1.3226520
Published Online: June 1, 1989
View Article titled, A Transient Technique to Measure the Temperature Coefficient of Resistance for Thin Film Resistors
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Topics: Resistors, Temperature, Thin films, Transients (Dynamics), Electric current, Heating, Ovens, Steady state, Transient heat transfer