1-20 of 114
Pressure
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041117.
Paper No: EP-24-1030
https://doi.org/10.1115/1.4065948
Published Online: August 17, 2024
View Article titled, Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
Open the PDF for Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers in another window
Topics: Cooling, Data centers, Flow (Dynamics), Manifolds, Pressure, Pressure drop, Temperature, Modeling, Coolants, Calibration
Journal Articles

Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning

Calvin Ling, Muhammad Taufik Azahari, Mohamad Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011001.
Paper No: EP-22-1076
https://doi.org/10.1115/1.4065077
Published Online: April 5, 2024
View Article titled, Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
Open the PDF for Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning in another window
Topics: Ball-Grid-Array packaging, Computer simulation, Machine learning, Pressure, Solders, Valves, Epoxy adhesives, Epoxy resins, Simulation, Temperature
Journal Articles

Characterization of a Rack-Level Thermosyphon-Based Cooling System

R. Khalid, S. G. Schon, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031007.
Paper No: EP-23-1068
https://doi.org/10.1115/1.4064524
Published Online: March 11, 2024
View Article titled, Characterization of a Rack-Level Thermosyphon-Based Cooling System
Open the PDF for Characterization of a Rack-Level Thermosyphon-Based Cooling System in another window
Topics: Condensers (steam plant), Cooling, Cooling systems, Data centers, Fluids, Heat, Heat recovery, Refrigerants, Stress, Temperature
Journal Articles

Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications

Amit Kumar, Ayan Majumder, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021008.
Paper No: EP-23-1043
https://doi.org/10.1115/1.4063917
Published Online: December 11, 2023
View Article titled, Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications
Open the PDF for Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications in another window
Topics: Acoustics, Blades, Experimental design, Flow (Dynamics), Noise (Sound), Pressure, Rotors, Optimization, Geometry
Includes: Supplementary data
Journal Articles

Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling

R. Khalid, E. Youssef, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021005.
Paper No: EP-23-1016
https://doi.org/10.1115/1.4063252
Published Online: November 10, 2023
View Article titled, Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling
Open the PDF for Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling in another window
Topics: Flow (Dynamics), Heat exchangers, Refrigerants, Temperature, Heat, Cooling, Fluids, Pressure
Journal Articles

Converging Jet Impingement for Enhanced Liquid Cooling

Reece Whitt, Rafael Estrella, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041103.
Paper No: EP-23-1032
https://doi.org/10.1115/1.4063484
Published Online: October 9, 2023
View Article titled, Converging Jet Impingement for Enhanced Liquid Cooling
Open the PDF for Converging Jet Impingement for Enhanced Liquid Cooling in another window
Topics: Additive manufacturing, Cooling, Electronics, Fluids, Heat transfer, Jets, Nozzles, Pressure, Reynolds number, Simulation
Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031008.
Paper No: EP-22-1082
https://doi.org/10.1115/1.4056992
Published Online: March 8, 2023
View Article titled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
Open the PDF for Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications in another window
Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure
Journal Articles

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021008.
Paper No: EP-22-1046
https://doi.org/10.1115/1.4055468
Published Online: September 28, 2022
View Article titled, Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
Open the PDF for Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers in another window
Topics: Flow (Dynamics), Manifolds, Microchannels, Silicon, Pressure, Temperature, Intake manifolds, Pressure drop
Journal Articles

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Tolga Emir, Hamza Ourabi, Mete Budakli, Mehmet Arik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2022, 144(4): 040801.
Paper No: EP-21-1129
https://doi.org/10.1115/1.4054184
Published Online: April 28, 2022
View Article titled, Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review
Open the PDF for Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review in another window
Topics: Boiling, Bubbles, Critical heat flux, Heat transfer, Pool boiling, Pressure, Nucleation (Physics), Fluids, Water, Heat
Journal Articles

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031015.
Paper No: EP-21-1151
https://doi.org/10.1115/1.4053890
Published Online: March 8, 2022
View Article titled, Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology
Open the PDF for Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology in another window
Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Pressure, Temperature, Tiles, Modeling
Journal Articles

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

Zhigang Gao, Tianhu Wang, Yuxin Yang, Xiaolong Shang, Junhua Bai, Peng Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041014.
Paper No: EP-21-1134
https://doi.org/10.1115/1.4053433
Published Online: February 7, 2022
View Article titled, Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator
Open the PDF for Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator in another window
Topics: Flow (Dynamics), Heat sinks, Heat transfer, Methane, Microchannels, Pressure, Electromechanical actuators
Journal Articles

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041013.
Paper No: EP-21-1109
https://doi.org/10.1115/1.4053432
Published Online: February 1, 2022
View Article titled, Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
Open the PDF for Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes in another window
Topics: Epoxy resins, Pressure, Silver, Sintering, Temperature, Reliability, Shear strength, Epoxy adhesives, Shear (Mechanics)
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
Open the PDF for Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers in another window
Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

Influence of Laser Soldering Temperatures on Through-Hole Component

Saifulmajdy A. Zahiri, Aizat Abas, M. F. M. Sharif, Fakhrozi Che Ani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041006.
Paper No: EP-21-1075
https://doi.org/10.1115/1.4052175
Published Online: November 22, 2021
View Article titled, Influence of Laser Soldering Temperatures on Through-Hole Component
Open the PDF for Influence of Laser Soldering Temperatures on Through-Hole Component in another window
Topics: Flow (Dynamics), Lasers, Soldering, Solders, Temperature, Lead-free solders, Finite volume methods, Pressure
Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
https://doi.org/10.1115/1.4052246
Published Online: November 22, 2021
View Article titled, Design and Fabrication of Leadless Package Structure for Pressure Sensors
Open the PDF for Design and Fabrication of Leadless Package Structure for Pressure Sensors in another window
Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature
Journal Articles

Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties

Karl F. Schoch, Jr., Philip A. Panackal, M. Garrett Bimstefer, Amanda N. Brocki, Daniel N. Urban
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031008.
Paper No: EP-21-1040
https://doi.org/10.1115/1.4052076
Published Online: September 15, 2021
View Article titled, Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties
Open the PDF for Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties in another window
Topics: Putties, Shapes, Stress, Stiffness, Compression, Pressure
Journal Articles

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Qi Jin, John T. Wen, Shankar Narayanan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041102.
Paper No: EP-21-1081
https://doi.org/10.1115/1.4051942
Published Online: August 20, 2021
View Article titled, Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control
Open the PDF for Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control in another window
Topics: Compressors, Design, Flow (Dynamics), Heat, Oscillations, Pressure drop, Secondary cells, Stability, Stress, Valves
Journal Articles

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Rajesh Kasukurthy, Amruthavalli Rachakonda, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031001.
Paper No: EP-20-1016
https://doi.org/10.1115/1.4049018
Published Online: January 19, 2021
View Article titled, Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling
Open the PDF for Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling in another window
Topics: Computational fluid dynamics, Coolants, Cooling, Flow (Dynamics), Flow control, Matlab, Optimization, Plates (structures), Temperature, Testing
Journal Articles

Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods

Muhammad Naqib Nashrudin, Aizat Abas, M. Z. Abdullah, M. Yusuf Tura Ali, Z. Samsudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031005.
Paper No: EP-20-1106
https://doi.org/10.1115/1.4049175
Published Online: January 19, 2021
View Article titled, Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods
Open the PDF for Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods in another window
Topics: Flow (Dynamics), Pressure, Ball-Grid-Array packaging
Journal Articles

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads

Sadegh Khalili, Srikanth Rangarajan, Vadim Gektin, Husam Alissa, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041002.
Paper No: EP-19-1138
https://doi.org/10.1115/1.4048180
Published Online: September 4, 2020
View Article titled, An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads
Open the PDF for An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads in another window
Topics: Coolants, Cooling, Cooling systems, Flow (Dynamics), Fluids, Heat, Manifolds, Pressure, Stress, Temperature