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Journal Articles

Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel

Jing He, Liping Liu, Anthony M. Jacobi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041001.
https://doi.org/10.1115/1.4005299
Published Online: November 17, 2011
View Article titled, Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel
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Topics: Convection, Emissivity, Heat, Radiation (Physics), Temperature, Thermal analysis, Thermal conductivity, Heat transfer, Heat conduction, Flow (Dynamics)
Journal Articles

A Preliminary Investigation of the Cooling of Electronic Components With Flat Plate Heat Sinks

I. Ahmed, R. J. Krane, J. R. Parsons
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 60–67.
https://doi.org/10.1115/1.2905495
Published Online: March 1, 1994
View Article titled, A Preliminary Investigation of the Cooling of Electronic Components With Flat Plate Heat Sinks
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Topics: Cooling, Electronic components, Flat plates, Heat sinks, Computer simulation, Natural convection, Temperature, Algorithms, Coatings, Emissivity
Journal Articles

Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process

M. Eftychiou, T. L. Bergman, G. Y. Masada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 48–54.
https://doi.org/10.1115/1.2905441
Published Online: March 1, 1992
View Article titled, Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process
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Topics: Reflow soldering, Temperature effects, Engineering simulation, Manufacturing, Ovens, Radiative heat transfer, Simulation, Circuits, Computer simulation, Transient heat transfer