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Journal Articles

Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 188–191.
https://doi.org/10.1115/1.1477191
Published Online: July 26, 2002
View Article titled, Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance
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Topics: Boron, Contact resistance, Lithium, Particulate matter, Ions, Sodium, Silicones, Solders, Thermal conductivity, Water
Journal Articles

Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122 , No. 2, pp. 128–131]

Yunsheng Xu,, Xiangcheng Luo, and, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Announcements
J. Electron. Packag. June 2001, 123(2): 159.
https://doi.org/10.1115/1.1371771
Published Online: June 1, 2001
View Article titled, Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122 , No. 2, pp. 128–131]
Open the PDF for Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122 , No. 2, pp. 128–131] in another window
Topics: Electrons, Interface phenomena, Sodium, Sodium compounds, Thermal conductivity
Journal Articles

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Xiangcheng Luo,, Yunsheng Xu, and, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2001, 123(3): 309–311.
https://doi.org/10.1115/1.1371925
Published Online: June 26, 2000
View Article titled, Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement
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Topics: Contact resistance, Copper, Cycles, Disks, Electrical conductance, Heating, Silicones, Sodium, Thermal conductivity, Thermal stability
Journal Articles

Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 128–131.
https://doi.org/10.1115/1.483144
Published Online: December 28, 1999
View Article titled, Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance
Open the PDF for Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance in another window
Topics: Contact resistance, Particulate matter, Silicones, Sodium, Thermal conductivity, Boron, Water, Copper, Fillers (Materials), Solders
Journal Articles

Elasticity Analysis to Aid in Extracting Thin Film Elastic Moduli From Continuous Indentation Data

D. S. Stone
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 41–46.
https://doi.org/10.1115/1.2904339
Published Online: March 1, 1990
View Article titled, Elasticity Analysis to Aid in Extracting Thin Film Elastic Moduli From Continuous Indentation Data
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Topics: Elastic moduli, Elasticity, Thin films, Borosilicate glasses, Computers, Crystals, Engineering simulation, Glass, Heat resistant glass, Simulation