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Journal Articles

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian, Kyle Yazzie, Tsgereda Alazar, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar

Publisher: ASME

J. Electron. Packag. June 2017, 139(2): 020912.

Paper No: EP-17-1010

https://doi.org/10.1115/1.4036661

Published Online: June 12, 2017

View Article titled, Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Topics: Failure, Fracture (Materials), Fracture toughness, Solder masks, Stress, Thin films, Membranes, Fracture (Process), Electronic packaging, Testing

Journal Articles

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy, Pramod Malatkar

Publisher: ASME

J. Electron. Packag. June 2017, 139(2): 020902.

Paper No: EP-16-1149

https://doi.org/10.1115/1.4036356

Published Online: April 24, 2017

View Article titled, High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Topics: Adhesion, Cantilever beams, Silicon, Solder masks, Temperature, Testing, High temperature, Adhesives

Journal Articles

Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB

Dezhi Li, Changqing Liu, Paul P. Conway

Publisher: ASME

J. Electron. Packag. March 2008, 130(1): 011005.

https://doi.org/10.1115/1.2837522

Published Online: January 31, 2008

View Article titled, Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB

Topics: Flip-chip, Flip-chip devices, Reliability, Solder joints, Solders, Tin, Solder masks, Failure, Fracture (Materials), Cycles

Journal Articles

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

Timothy Ferguson, Member ASME, Jianmin Qu, Fellow ASME

Publisher: ASME

J. Electron. Packag. June 2002, 124(2): 106–110.

https://doi.org/10.1115/1.1414133

Published Online: May 2, 2002

View Article titled, Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

Topics: Absorption, Adhesion, Fracture (Materials), Fracture toughness, Solder masks, Delamination, Stress, Flow (Dynamics), Fracture (Process)

Journal Articles

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

John H. Lau, ASME Fellow, S.-W. Ricky Lee, ASME Member

Publisher: ASME

J. Electron. Packag. December 2000, 122(4): 306–310.

https://doi.org/10.1115/1.1289998

Published Online: June 20, 2000

View Article titled, Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

Topics: Corners (Structural elements), Delamination, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture mechanics, Solder joints, Solder masks, Solders, Stress

Journal Articles

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

B. Han, Mem. ASME, P. Kunthong

Publisher: ASME

J. Electron. Packag. December 2000, 122(4): 294–300.

https://doi.org/10.1115/1.1290000

Published Online: May 15, 2000

View Article titled, Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

Topics: Circuits, Deformation, Displacement, Flip-chip devices, Flip-chip packages, Interferometry, Flip-chip assemblies, Metals, Shear deformation, Reliability

Journal Articles

Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method

John H. Lau, Fellow ASME, S. W. Ricky Lee, Mem. ASME

Publisher: ASME

J. Electron. Packag. March 2000, 122(1): 34–41.

https://doi.org/10.1115/1.483129

Published Online: August 31, 1999

View Article titled, Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method

Topics: Fracture (Materials), Fracture mechanics, Temperature, Stress, Copper, Solder masks

Journal Articles

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

X. Yan, R. K. Agarwal

Publisher: ASME

J. Electron. Packag. June 1998, 120(2): 150–155.

https://doi.org/10.1115/1.2792607

Published Online: June 1, 1998

View Article titled, Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

Topics: Flip-chip assemblies, Fracture toughness, Printed circuit boards, Stress, Fracture (Materials), Silicon chips, Solder masks

Journal Articles

Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

K.-N. Chiang, W.-L. Chen

Publisher: ASME

J. Electron. Packag. June 1998, 120(2): 175–178.

https://doi.org/10.1115/1.2792616

Published Online: June 1, 1998

View Article titled, Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

Topics: Ball-Grid-Array packaging, Electronic packaging, Shapes, Solder masks, Solder joints, Density, Energy conservation, Failure, Fatigue, Gravity (Force)

Journal Articles

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

W. Jung, J. H. Lau, Y.-H. Pao

Publisher: ASME

J. Electron. Packag. September 1997, 119(3): 163–170.

https://doi.org/10.1115/1.2792229

Published Online: September 1, 1997

View Article titled, Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

Topics: Ball-Grid-Array packaging, Solder joints, Reliability, Deformation, Finite element analysis, Manufacturing, Ball-Grid-Array packages, Ceramics, Computation, Constitutive equations

Journal citation

NARROW

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

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