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Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2015, 137(1): 010801.
Paper No: EP-14-1069
https://doi.org/10.1115/1.4028890
Published Online: November 14, 2014
View Article titled, Two-Phase Thermal Ground Planes: Technology Development and Parametric Results
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Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity
Journal Articles

Taguchi on Robust Technology Development: Bringing Quality Engineering Upstream

Genichi Taguchi, Author, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1994, 116(2): 161.
https://doi.org/10.1115/1.2905506
Published Online: June 1, 1994
View Article titled, Taguchi on Robust Technology Development: Bringing Quality Engineering Upstream
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Topics: Technology development