1-5 of 5
X-ray diffraction
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging

Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
https://doi.org/10.1115/1.4003990
Published Online: June 23, 2011
View Article titled, Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
Open the PDF for Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging in another window
Topics: Electronic packaging, Stainless steel, Surface finishing, Grain boundaries, Grain size, X-ray diffraction, X-ray analysis
Journal Articles

Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

H. A. Mustain, William D. Brown, Simon S. Ang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034502.
https://doi.org/10.1115/1.3153582
Published Online: July 14, 2009
View Article titled, Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices
Open the PDF for Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices in another window
Topics: Copper, Diffusion (Physics), Silicon, Silicon nitride ceramics, Tungsten, Annealing, High temperature, Metals, Temperature, Electron spectroscopy
Journal Articles

An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder

G. Y. Li, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 305–310.
https://doi.org/10.1115/1.1486012
Published Online: July 26, 2002
View Article titled, An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder
Open the PDF for An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder in another window
Topics: Electron diffraction, Intermetallic compounds, Solder joints, Solders, Tin, X-ray diffraction, Silver, X-rays, Transmission electron microscopy, Thick films
Journal Articles

Time-Dependent Ductility of Electro-Deposited Copper

Yoshiki Oshida, P. C. Chen, J. D. Reid, T. Nishihara
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 448–454.
https://doi.org/10.1115/1.2905479
Published Online: December 1, 1992
View Article titled, Time-Dependent Ductility of Electro-Deposited Copper
Open the PDF for Time-Dependent Ductility of Electro-Deposited Copper in another window
Topics: Copper, Ductility, Temperature, Annealing, Current density, Dislocation density, Electrodes, Electrons, Film thickness, Grain size
Journal Articles

High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure

Yoshiki Oshida, P. C. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 58–62.
https://doi.org/10.1115/1.2905367
Published Online: March 1, 1991
View Article titled, High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure
Open the PDF for High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure in another window
Topics: Cycles, Damage, Dislocation density, Dislocations, Fatigue, Fatigue failure, Fatigue life, Fracture (Materials), Low cycle fatigue, Metallic thin films