1-20 of 37
Review Article
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2024, 146(1): 010801.
Paper No: EP-23-1022
https://doi.org/10.1115/1.4062529
Published Online: June 23, 2023
View Article titled, Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging
Open the PDF for Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging in another window
Topics: Bonding, Bridges (Structures), Design, Packaging
Journal Articles

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Okafor Ekene Gabriel, David Ryan Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2023, 145(2): 020801.
Paper No: EP-22-1045
https://doi.org/10.1115/1.4055774
Published Online: October 22, 2022
View Article titled, Failure Mechanisms Driven Reliability Models for Power Electronics: A Review
Open the PDF for Failure Mechanisms Driven Reliability Models for Power Electronics: A Review in another window
Topics: Failure, Fatigue, Reliability, Stress, Temperature, Fatigue life, Electronics, Failure mechanisms, Corrosion, Modeling
Journal Articles

Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2022, 144(2): 020801.
Paper No: EP-21-1008
https://doi.org/10.1115/1.4052069
Published Online: September 24, 2021
View Article titled, Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors
Open the PDF for Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors in another window
Topics: Sensors, Bonding, Electronics
Journal Articles

A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2021, 143(3): 030801.
Paper No: EP-19-1124
https://doi.org/10.1115/1.4048861
Published Online: January 19, 2021
View Article titled, A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling
Open the PDF for A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling in another window
Topics: Heat sinks, Metal foams, Heat transfer
Journal Articles

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2020, 142(4): 040801.
Paper No: EP-19-1126
https://doi.org/10.1115/1.4047472
Published Online: June 29, 2020
View Article titled, Comparative Study on Power Module Architectures for Modularity and Scalability
Open the PDF for Comparative Study on Power Module Architectures for Modularity and Scalability in another window
Topics: Architecture, Cooling, Design, Electric vehicles, Electronics, Patents, Hybrid electric vehicles, Traction, Coolants, Metals
Journal Articles

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
https://doi.org/10.1115/1.4047414
Published Online: June 29, 2020
View Article titled, Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
Open the PDF for Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging in another window
Topics: Heat, Metamaterials, Thermal management, Cooling, Temperature, Thermal conductivity, Electronic packaging, Design, Packaging, Anisotropy
Journal Articles

Packaging for Laser-Based White Lighting: Status and Perspectives

Yupu Ma, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2020, 142(1): 010801.
Paper No: EP-18-1105
https://doi.org/10.1115/1.4044359
Published Online: September 19, 2019
View Article titled, Packaging for Laser-Based White Lighting: Status and Perspectives
Open the PDF for Packaging for Laser-Based White Lighting: Status and Perspectives in another window
Topics: Lasers, Packaging, Phosphors, Quenching (Metalworking), Temperature, Laser beams, Brightness (Photometry)
Journal Articles

Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

Yang Peng, Renli Liang, Yun Mou, Jiangnan Dai, Mingxiang Chen, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040804.
Paper No: EP-18-1089
https://doi.org/10.1115/1.4044624
Published Online: September 19, 2019
View Article titled, Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies
Open the PDF for Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies in another window
Topics: Light-emitting diodes, Packaging, Ultraviolet radiation
Journal Articles

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

A. Bar-Cohen, J. J. Maurer, D. H. Altman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040803.
Paper No: EP-18-1067
https://doi.org/10.1115/1.4043404
Published Online: July 30, 2019
View Article titled, Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
Open the PDF for Embedded Cooling for Wide Bandgap Power Amplifiers: A Review in another window
Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Transistors, Thermal conductivity, Temperature, Junctions, Heat, Thermal management
Journal Articles

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Sinan Su, Francy John Akkara, Ravinder Thaper, Atif Alkhazali, Mohammad Hamasha, Sa'd Hamasha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040802.
Paper No: EP-18-1117
https://doi.org/10.1115/1.4043405
Published Online: May 17, 2019
View Article titled, A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint
Open the PDF for A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint in another window
Topics: Creep, Cycles, Damage, Failure, Fatigue, Fatigue life, Solder joints, Stress, Fracture (Materials), Solders
Journal Articles

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040801.
Paper No: EP-18-1088
https://doi.org/10.1115/1.4043341
Published Online: May 17, 2019
View Article titled, Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging
Open the PDF for Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging in another window
Topics: Packaging, Semiconductor wafers, Solders, Warping, Etching
Journal Articles

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Aastha Uppal, Jerrod Peterson, Je-Young Chang, Xi Guo, Frank Liang, Weihua Tang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2019, 141(1): 010803.
Paper No: EP-18-1053
https://doi.org/10.1115/1.4042801
Published Online: March 4, 2019
View Article titled, Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms
Open the PDF for Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms in another window
Topics: Design, Modeling, Thermomechanics, Stress, Heat pipes, Pressure
Journal Articles

Liquid Cooling of Compute System

Jessica Gullbrand, Mark J. Luckeroth, Mark E. Sprenger, Casey Winkel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2019, 141(1): 010802.
Paper No: EP-18-1054
https://doi.org/10.1115/1.4042802
Published Online: March 1, 2019
View Article titled, Liquid Cooling of Compute System
Open the PDF for Liquid Cooling of Compute System in another window
Topics: Cooling, Design, Fluids, Plates (structures), Flow (Dynamics), Manifolds, Temperature
Journal Articles

Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

Phil Geng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2019, 141(1): 010801.
Paper No: EP-18-1046
https://doi.org/10.1115/1.4042800
Published Online: February 25, 2019
View Article titled, Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention
Open the PDF for Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention in another window
Topics: Design, Shock (Mechanics), Solder joints, Stress, Structural design, Vibration, Failure, Creep
Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2019, 141(2): 020801.
Paper No: EP-18-1026
https://doi.org/10.1115/1.4041813
Published Online: February 25, 2019
View Article titled, Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
Open the PDF for Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications in another window
Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry
Journal Articles

Technological Advances to Maximize Solar Collector Energy Output: A Review

Swapnil S. Salvi, Vishal Bhalla, Robert A. Taylor, Vikrant Khullar, Todd P. Otanicar, Patrick E. Phelan, Himanshu Tyagi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2018, 140(4): 040802.
Paper No: EP-18-1036
https://doi.org/10.1115/1.4041219
Published Online: October 1, 2018
View Article titled, Technological Advances to Maximize Solar Collector Energy Output: A Review
Open the PDF for Technological Advances to Maximize Solar Collector Energy Output: A Review in another window
Topics: Coatings, Solar collectors, Solar energy
Journal Articles

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

Justin Broughton, Vanessa Smet, Rao R. Tummala, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2018, 140(4): 040801.
Paper No: EP-17-1128
https://doi.org/10.1115/1.4040828
Published Online: August 20, 2018
View Article titled, Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
Open the PDF for Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes in another window
Topics: Cooling, Electronics, Packaging, Temperature, Silicon, High temperature, Heat
Journal Articles

Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

Asisa Kumar Panigrahy, Kuan-Neng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2018, 140(1): 010801.
Paper No: EP-17-1076
https://doi.org/10.1115/1.4038392
Published Online: March 2, 2018
View Article titled, Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review
Open the PDF for Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review in another window
Topics: Bonding, Low temperature
Journal Articles

Overview of Human Thermal Responses to Warm Surfaces of Electronic Devices

Han Zhang, Alan Hedge
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2017, 139(3): 030802.
Paper No: EP-16-1100
https://doi.org/10.1115/1.4037146
Published Online: July 13, 2017
View Article titled, Overview of Human Thermal Responses to Warm Surfaces of Electronic Devices
Open the PDF for Overview of Human Thermal Responses to Warm Surfaces of Electronic Devices in another window
Topics: Heat, Skin, Temperature, Testing
Journal Articles

A Review on Laser Processing in Electronic and MEMS Packaging

Kaysar Rahim, Ahsan Mian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2017, 139(3): 030801.
Paper No: EP-16-1146
https://doi.org/10.1115/1.4036239
Published Online: June 14, 2017
View Article titled, A Review on Laser Processing in Electronic and MEMS Packaging
Open the PDF for A Review on Laser Processing in Electronic and MEMS Packaging in another window
Topics: Lasers, Packaging