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Journal Articles

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020903.
Paper No: EP-17-1100
https://doi.org/10.1115/1.4039265
Published Online: May 9, 2018
View Article titled, Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation
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Journal Articles

Challenges in Three-Dimensional Printing of High-Conductivity Copper

Tahany I. El-Wardany, Ying She, Vijay N. Jagdale, Jacquelynn K. Garofano, Joe J. Liou, Wayde R. Schmidt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020907.
Paper No: EP-17-1104
https://doi.org/10.1115/1.4039974
Published Online: May 9, 2018
View Article titled, Challenges in Three-Dimensional Printing of High-Conductivity Copper
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Topics: Copper, Copper powders, Lasers, Porosity, Electrical conductivity, Additive manufacturing, Density, Modeling, Thermal conductivity
Journal Articles

Peel-and-Stick Sensors Powered by Directed Radio-Frequency Energy

David Eric Schwartz, Clinton J. Smith, Joseph Lee, Shakthi Priya Gowri, George Daniel, Christopher Lalau-Keraly, Quentin Baudenon, J. R. M. Saavedra
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020904.
Paper No: EP-17-1108
https://doi.org/10.1115/1.4039138
Published Online: May 9, 2018
View Article titled, Peel-and-Stick Sensors Powered by Directed Radio-Frequency Energy
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Topics: Sensors
Journal Articles

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Daeyoung Kong, Chi Zhang, Michael T. Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020906.
Paper No: EP-18-1003
https://doi.org/10.1115/1.4040088
Published Online: May 9, 2018
View Article titled, Enhanced Heat Transfer Using Microporous Copper Inverse Opals
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Topics: Copper, Critical heat flux, Heat transfer, Pool boiling, Boiling, Heat transfer coefficients, Bubbles
Journal Articles

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020901.
Paper No: EP-17-1092
https://doi.org/10.1115/1.4039136
Published Online: May 9, 2018
View Article titled, Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model
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Topics: Elastic moduli, Network models, Particulate matter, Stiffness, Fillers (Materials), Particle size, Mechanical properties
Journal Articles

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020905.
Paper No: EP-17-1083
https://doi.org/10.1115/1.4039301
Published Online: May 9, 2018
View Article titled, Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective
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Topics: Damage, Electronics, Engineering standards, Failure, Failure mechanisms, Reliability, Solder joints, Vibration, Transportation systems, Fatigue
Journal Articles

Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020902.
Paper No: EP-17-1094
https://doi.org/10.1115/1.4039137
Published Online: May 9, 2018
View Article titled, Failure Analysis of Direct Liquid Cooling System in Data Centers
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Topics: Cooling systems, Data centers, Failure, Temperature, Cooling, Flow (Dynamics), Coolants
Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
https://doi.org/10.1115/1.4039026
Published Online: March 2, 2018
View Article titled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
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Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms
Journal Articles

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
https://doi.org/10.1115/1.4039027
Published Online: March 2, 2018
View Article titled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics
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Topics: Alloys, Electronics, High temperature, Solders, Temperature, Testing, Thermal conductivity, Failure, Melting, Tensile testing
Journal Articles

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Todd Salamon, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
https://doi.org/10.1115/1.4039091
Published Online: March 2, 2018
View Article titled, Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis
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Topics: Condensers (steam plant), Flow (Dynamics), Heat, Secondary cells, Stress, Temperature, Subcooling, Cooling systems, Refrigerants, Electronics
Journal Articles

Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010907.
Paper No: EP-17-1109
https://doi.org/10.1115/1.4039028
Published Online: March 2, 2018
View Article titled, Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles
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Topics: Air flow, Design, Leakage, Tiles, Temperature, Computational fluid dynamics, Simulation, Flow (Dynamics), Pressure
Journal Articles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
https://doi.org/10.1115/1.4039333
Published Online: March 2, 2018
View Article titled, Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
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Topics: Electronics, Failure, Reliability, Stress, Temperature, Failure mechanisms, Cycles, Safety, Failure analysis, Simulation
Journal Articles

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010904.
Paper No: EP-17-1093
https://doi.org/10.1115/1.4039020
Published Online: March 2, 2018
View Article titled, Thermal Metamaterials for Heat Flow Control in Electronics
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Topics: Composite materials, Design, Electronics, Flow control, Heat, Heat flux, Metamaterials, Printed circuit boards, Temperature, Anisotropy
Journal Articles

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Jayati Athavale, Yogendra Joshi, Minami Yoda
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010902.
Paper No: EP-17-1087
https://doi.org/10.1115/1.4039025
Published Online: March 2, 2018
View Article titled, Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles
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Topics: Tiles, Data centers, Flow (Dynamics), Temperature
Journal Articles

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Leila Choobineh, Jared Jones, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020908.
Paper No: EP-16-1140
https://doi.org/10.1115/1.4036404
Published Online: June 12, 2017
View Article titled, Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits
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Topics: Integrated circuits, Sensors, Temperature, Thermal resistance, Thermal analysis
Journal Articles

Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications

Vana Snigdha Tummala, Ahsan Mian, Nowrin H. Chamok, Dhruva Poduval, Mohammod Ali, Jallisa Clifford, Prasun Majumdar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020904.
Paper No: EP-16-1137
https://doi.org/10.1115/1.4036384
Published Online: June 12, 2017
View Article titled, Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications
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Topics: Additive manufacturing, Density, Dimensions, X-rays, Resonance, Microscopy, Manufacturing, Porosity, Design
Journal Articles

Heat Transfer in Liquid–Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall Temperature

Wesam Adrugi, Yuri Muzychka, Kevin Pope
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020909.
Paper No: EP-16-1141
https://doi.org/10.1115/1.4036405
Published Online: June 12, 2017
View Article titled, Heat Transfer in Liquid–Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall Temperature
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Topics: Flow (Dynamics), Heat transfer, Tubing, Water, Wall temperature
Journal Articles

Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies

Umut Zeynep Uras, Mehmet Arık, Enes Tamdoğan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020907.
Paper No: EP-16-1139
https://doi.org/10.1115/1.4036403
Published Online: June 12, 2017
View Article titled, Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies
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Topics: Engines, Light-emitting diodes, Temperature, Lumber, Flat heat pipes, Electronics, Thermal conductivity, Temperature distribution, Vapors
Journal Articles

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian, Kyle Yazzie, Tsgereda Alazar, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020912.
Paper No: EP-17-1010
https://doi.org/10.1115/1.4036661
Published Online: June 12, 2017
View Article titled, Characterization of Bulk and Thin Film Fracture in Electronic Packaging
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Topics: Failure, Fracture (Materials), Fracture toughness, Solder masks, Stress, Thin films, Membranes, Fracture (Process), Electronic packaging, Testing
Journal Articles

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Takeru Kato, Ken Suzuki, Hideo Miura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020911.
Paper No: EP-16-1144
https://doi.org/10.1115/1.4036442
Published Online: June 12, 2017
View Article titled, Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections
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Topics: Atoms, Copper, Current density, Diffusion (Physics), Electrodiffusion, Grain boundaries, Reliability, Temperature, Thin films, Heating