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Journal Articles

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

Jinxin Liu, Zhiheng Huang, Paul P. Conway, Yang Liu

Publisher: ASME

J. Electron. Packag. March 2020, 142(1): 011009.

Paper No: EP-19-1058

https://doi.org/10.1115/1.4044648

Published Online: October 10, 2019

.... , Samajdar , I. , Haldar , A. , and Sain , A. , 2013 , “ Micromechanics of Emergent Patterns in Plastic Flows ,” Sci. Rep. , 3 ( 1 ), p. 2728 . 10.1038/srep02728 e-mail: hzh29@mail.sysu.edu.cn 19 05 2019 14 08 2019 10 10 2019 3D packaging micro...

View Article titled, Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

Topics: Grain size, Shear (Mechanics), Simulation, Deformation, Reliability, Atoms, Simulation results, Copper

Journal Articles

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Bo Wu, Shuanghai Zhang, Fuliang Wang, Zhuo Chen

Publisher: ASME

J. Electron. Packag. December 2018, 140(4): 044502.

Paper No: EP-18-1015

https://doi.org/10.1115/1.4040794

Published Online: August 6, 2018

... of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received February 28, 2018; final manuscript received July 4, 2018; published online August 6, 2018. Assoc. Editor: Jin Yang. 28 02 2018 04 07 2018 3D packaging Bumping Flip chip To meet...

View Article titled, Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Topics: Bonding, Columns (Structural), Flip-chip, Copper, Flip-chip devices

Journal Articles

Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

Weijun Zhu, Gang Dong, Yintang Yang

Publisher: ASME

J. Electron. Packag. December 2018, 140(4): 041002.

Paper No: EP-18-1007

https://doi.org/10.1115/1.4040670

Published Online: August 3, 2018

... Method of TSV Interposer for Thermal Analysis in 3D Packages ,” 16th International Conference on Electronic Packaging Technology ( ICEPT ), Wuhan, China, Aug. 16–19, pp. 820 – 823 . 10.1109/ICEPT.2016.7583256 [37] Liu , Z. , Swarup , S. , Tan , S. X.-D. , Chen , H. B. , and Wang...

View Article titled, Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

Topics: Density, Design, Heat, Modeling, Optimization, Silicon, Temperature, Simulation, Energy dissipation, Gates (Closures)

Journal Articles

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Raphael K. Mandel, Daniel G. Bae, Michael M. Ohadi

Publisher: ASME

J. Electron. Packag. September 2018, 140(3): 031003.

Paper No: EP-17-1081

https://doi.org/10.1115/1.4039264

Published Online: May 11, 2018

... 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis The rapid increase in heat dissipation of next-generation integrated circuits necessitates...

View Article titled, Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Topics: Coolers, Cooling, Electronics, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Manifolds, Microchannels

Journal Articles

Edge Trimming Induced Defects on Direct Bonded Wafers

Fumihiro Inoue, Anne Jourdain, Lan Peng, Alain Phommahaxay, Daisuke Kosemura, Ingrid De Wolf, Kenneth June Rebibis, Andy Miller, Erik Sleeckx, Eric Beyne

Publisher: ASME

J. Electron. Packag. September 2018, 140(3): 031004.

Paper No: EP-17-1127

https://doi.org/10.1115/1.4040002

Published Online: May 11, 2018

... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received December 11, 2017; final manuscript received February 14, 2018; published online May 11, 2018. Assoc. Editor: Yi-Shao Lai. 11 12 2017 14 02 2018 3D packaging Wafer level packaging Wafer scale three-dimensional...

View Article titled, Edge Trimming Induced Defects on Direct Bonded Wafers

Topics: Damage, Grinding, Semiconductor wafers, Stress, Bonding

Journal Articles

Special Section on InterPACK 2017—Part 2

Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani

Publisher: ASME

J. Electron. Packag. June 2018, 140(2): 020301.

Paper No: EP-18-1012

https://doi.org/10.1115/1.4039963

Published Online: May 9, 2018

... would also like to acknowledge InterPACK 2017 General Conference Chair Dr. Mehdi Asheghi and JEP Editor Professor Y. C. Lee for their support and cooperation. 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors...

View Article titled, Special Section on InterPACK 2017—Part 2

Topics: Batteries, Density, Electronic packaging, Microelectromechanical systems, Optoelectronic devices, Packaging, Semiconductor wafers, Sensors, Reliability

Journal Articles

Challenges in Three-Dimensional Printing of High-Conductivity Copper

Tahany I. El-Wardany, Ying She, Vijay N. Jagdale, Jacquelynn K. Garofano, Joe J. Liou, Wayde R. Schmidt

Publisher: ASME

J. Electron. Packag. June 2018, 140(2): 020907.

Paper No: EP-17-1104

https://doi.org/10.1115/1.4039974

Published Online: May 9, 2018

... by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 9, 2017; final manuscript received April 13, 2018; published online May 9, 2018. Assoc. Editor: Kaushik Mysore. 09 10 2017 13 04 2018 3D packaging...

View Article titled, Challenges in Three-Dimensional Printing of High-Conductivity Copper

Topics: Copper, Copper powders, Lasers, Porosity, Electrical conductivity, Additive manufacturing, Density, Modeling, Thermal conductivity

Journal Articles

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson

Publisher: ASME

J. Electron. Packag. June 2018, 140(2): 021001.

Paper No: EP-17-1126

https://doi.org/10.1115/1.4039475

Published Online: May 9, 2018

... and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received November 30, 2017; final manuscript received February 23, 2018; published online May 9, 2018. Assoc. Editor: Ankur Jain. 30 11 2017 23 02 2018 3D packaging Thermal...

View Article titled, Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Topics: Fins, Flow (Dynamics), Fluids, Friction, Heat transfer, Pressure drop, Reynolds number, Water, Heat, Temperature

Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua

Publisher: ASME

J. Electron. Packag. March 2018, 140(1): 010905.

Paper No: EP-17-1099

https://doi.org/10.1115/1.4039026

Published Online: March 2, 2018

.... 27 09 2017 28 12 2017 3D packaging Chip stacking Harsh environment Thermal analysis The adequate selection of the temperature sensor locations within a microchip or a rack of microprocessors may allow a reduction in the number of sensors needed to characterize the thermal...

View Article titled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms

Journal Articles

Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

Asisa Kumar Panigrahy, Kuan-Neng Chen

Publisher: ASME

J. Electron. Packag. March 2018, 140(1): 010801.

Paper No: EP-17-1076

https://doi.org/10.1115/1.4038392

Published Online: March 2, 2018

View Article titled, Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

Topics: Bonding, Low temperature

Journal Articles

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Yasuo Takahashi, Hiroki Fukuda, Yasuhiro Yoneshima, Hideki Kitamura, Masakatsu Maeda

Publisher: ASME

J. Electron. Packag. December 2017, 139(4): 041010.

Paper No: EP-17-1026

https://doi.org/10.1115/1.4038143

Published Online: October 25, 2017

... ACKAGING . Manuscript received March 9, 2017; final manuscript received September 21, 2017; published online October 25, 2017. Assoc. Editor: Kaushik Mysore. 09 03 2017 21 09 2017 3D packaging CSP Flip chip High density interconnects Power packaging Wirebond In general...

View Article titled, Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Topics: Bonding, Vibration, Flip-chip, Flip-chip devices

Journal Articles

Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages

Huang-Kuang Kung, Chi-Lung Hsieh

Publisher: ASME

J. Electron. Packag. December 2017, 139(4): 041002.

Paper No: EP-17-1042

https://doi.org/10.1115/1.4037276

Published Online: July 27, 2017

... and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received April 13, 2017; final manuscript received July 8, 2017; published online July 27, 2017. Assoc. Editor: Yi-Shao Lai. 13 04 2017 08 07 2017 3D packaging MCM SOC...

View Article titled, Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages

Topics: Wire, Deflection

Journal Articles

Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules

Zihan Wu, Junki Min, Vanessa Smet, Markondeya Raj Pulugurtha, Venky Sundaram, Rao R. Tummala

Publisher: ASME

J. Electron. Packag. December 2017, 139(4): 041001.

Paper No: EP-16-1151

https://doi.org/10.1115/1.4037221

Published Online: July 27, 2017

... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received December 31, 2016; final manuscript received March 28, 2017; published online July 27, 2017. Assoc. Editor: Eric Wong. 31 12 2016 28 03 2017 3D packaging BGA Embedded passives Flip chip Wireless...

View Article titled, Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules

Topics: Glass, Manufacturing, Filters

Journal Articles

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

C. Falsetti, M. Magnini, J. R. Thome

Publisher: ASME

J. Electron. Packag. September 2017, 139(3): 031008.

Paper No: EP-17-1023

https://doi.org/10.1115/1.4037152

Published Online: July 10, 2017

... received February 27, 2017; final manuscript received June 21, 2017; published online July 10, 2017. Assoc. Editor: Mehdi Asheghi. 27 02 2017 21 06 2017 3D packaging Electronic Thermal analysis The desire for high computational performances and improved power efficiency...

View Article titled, Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

Topics: Boiling, Flow (Dynamics), Heat flux, Heat transfer, Heat transfer coefficients, Pressure drop, Temperature, Vapors, Fins, Heat

Journal Articles

A Review on Laser Processing in Electronic and MEMS Packaging

Kaysar Rahim, Ahsan Mian

Publisher: ASME

J. Electron. Packag. September 2017, 139(3): 030801.

Paper No: EP-16-1146

https://doi.org/10.1115/1.4036239

Published Online: June 14, 2017

... OF E LECTRONIC P ACKAGING . Manuscript received December 25, 2016; final manuscript received February 28, 2017; published online June 14, 2017. Assoc. Editor: Satish Chaparala. 25 12 2016 28 02 2017 3D packaging CSP Electronic Flexible circuits MEMS Micro vias PWB...

View Article titled, A Review on Laser Processing in Electronic and MEMS Packaging

Topics: Lasers, Packaging

Journal Articles

Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch Assemblies

Krishna Tunga, Thomas Wassick, Maryse Cournoyer

Publisher: ASME

J. Electron. Packag. September 2017, 139(3): 031004.

Paper No: EP-16-1110

https://doi.org/10.1115/1.4036368

Published Online: June 14, 2017

... of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 2, 2016; final manuscript received March 28, 2017; published online June 14, 2017. Assoc. Editor: Kaushik Mysore. 02 10 2016 28 03 2017 3D packaging Area array Chip stacking Failure...

View Article titled, Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch Assemblies

Topics: Aluminum, Stress, Solder joints, Design

Journal Articles

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Leila Choobineh, Jared Jones, Ankur Jain

Publisher: ASME

J. Electron. Packag. June 2017, 139(2): 020908.

Paper No: EP-16-1140

https://doi.org/10.1115/1.4036404

Published Online: June 12, 2017

... Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received December 16, 2016; final manuscript received March 27, 2017; published online June 12, 2017. Assoc. Editor: Justin A. Weibel. 16 12 2016 27 03 2017 3D packaging Chip stacking Thermal...

View Article titled, Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Topics: Integrated circuits, Sensors, Temperature, Thermal resistance, Thermal analysis

Journal Articles

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Takeru Kato, Ken Suzuki, Hideo Miura

Publisher: ASME

J. Electron. Packag. June 2017, 139(2): 020911.

Paper No: EP-16-1144

https://doi.org/10.1115/1.4036442

Published Online: June 12, 2017

... 12 2016 07 04 2017 3D packaging Reliability Thermal analysis In order to improve the performance and to reduce the power consumption of electronic products such as mobile phones and wearable devices, the size of semiconductor devices has been miniaturized continuously...

View Article titled, Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Topics: Atoms, Copper, Current density, Diffusion (Physics), Electrodiffusion, Grain boundaries, Reliability, Temperature, Thin films, Heating

Journal Articles

Special Section on IMECE 2016

Justin A. Weibel, S. Ravi Annapragada

Publisher: ASME

J. Electron. Packag. June 2017, 139(2): 020301.

Paper No: EP-17-1032

https://doi.org/10.1115/1.4036627

Published Online: June 12, 2017

...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...

View Article titled, Special Section on IMECE 2016

Topics: Failure analysis, Flexible electronics, Packaging, Reliability, Semiconductor wafers, Solders, Thermal analysis, Electronic packaging

Journal Articles

Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction

Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, Henrik Hovsepyan, Mark Nakamoto, Wei Zhao, Riko Radojcic, Uwe Muehle, Ehrenfried Zschech

Publisher: ASME

J. Electron. Packag. June 2017, 139(2): 020906.

Paper No: EP-16-1138

https://doi.org/10.1115/1.4036402

Published Online: June 12, 2017

... online June 12, 2017. Assoc. Editor: S. Ravi Annapragada. 14 12 2016 30 03 2017 3D packaging Electrical design Physics of failure Reliability Managing the effects of mechanical stress in silicon chips is a growing challenge—both in order to optimize the device performance...

View Article titled, Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction

Topics: Simulation, Stress, Transistors, Flow (Dynamics), Design, Silicon

Journal citation

NARROW

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Edge Trimming Induced Defects on Direct Bonded Wafers

Special Section on InterPACK 2017—Part 2

Challenges in Three-Dimensional Printing of High-Conductivity Copper

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages

Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

A Review on Laser Processing in Electronic and MEMS Packaging

Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch Assemblies

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Special Section on IMECE 2016

Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction

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