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Keywords: Boron Nitride
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021002.
Paper No: EP-20-1041
Published Online: August 27, 2020
... at the lead frame owing to the inverted bonding of LED chips. In this study, the scattering nanoparticles-induced reflection effect has been developed to enhance the optical efficiency of inverted QD-LEDs combined with the centrifugation technique. The strong back-scattered effect of boron nitride (BN...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 319–323.
Published Online: June 1, 2006
...Zongrong Liu; D. D. L. Chung Wax (predominantly tricosane paraffin wax, with a melting temperature of 48 ° C ) filled with hexagonal boron nitride (BN) particles ( 5 - 11 μ m ) was found to be an effective phase-change thermal interface material. The thermal contact conductance, as measured...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 188–191.
Published Online: July 26, 2002
...Yunsheng Xu; Xiangcheng Luo; D. D. L. Chung Polyethylene-glycol-based thermal interface paste containing trifluoroacetic acid lithium salt (1.5 wt. percent optimum) and boron nitride particles (∼18.0 vol. percent optimum), as well as water and N, N-dimethylformamide for helping the dissociation...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2001, 123(3): 309–311.
Published Online: June 26, 2000
... Interface Thermal Contact Thermal Conductance Composite Silicone Polyethylene Glycol Sodium Silicate Boron Nitride Thermal contacts are commonly encountered. An example is the thermal contact between a printed circuit board and a heat sink 1 2 . The quality of a thermal contact...
