... a business platform to propel continuous innovation and performance improvement extending to surveillance, medical, and automotive industries. This overview briefs the general camera module and the crucial technology elements of chip stacking architectures and advanced interconnect technologies. This study...

... is scalable and has the same guiding value for multichip stacks with different functions and constraints. A setup of four-chip stack is used to demonstrate the feasibility of this optimization and a large TSV area saving is achieved by this method. 1 Corresponding author. Contributed...

.... 27 09 2017 28 12 2017 3D packaging Chip stacking Harsh environment Thermal analysis The adequate selection of the temperature sensor locations within a microchip or a rack of microprocessors may allow a reduction in the number of sensors needed to characterize the thermal...

... – 7 ]. 3D packaging Bumping Chip stacking Copyright © 2018 by ASME 2018 1043-7398/2018/140(1)/010801/11/ $25.00 ...

... Microbumps Interconnect for 3D TSV Chip Stacking ,” IEEE 60th Electronic Components and Technology Conference ( ECTC ), Las Vegas, NV, June 1–4, pp. 858 – 863 . 10.1109/ECTC.2010.5490698 [11] Shimote , Y. , Iwasaki , T. , Watanabe , M. , Baba , S. , and Kimura , M. , 2014...

... of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 2, 2016; final manuscript received March 28, 2017; published online June 14, 2017. Assoc. Editor: Kaushik Mysore. 02 10 2016 28 03 2017 3D packaging Area array Chip stacking Failure...

... Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received December 16, 2016; final manuscript received March 27, 2017; published online June 12, 2017. Assoc. Editor: Justin A. Weibel. 16 12 2016 27 03 2017 3D packaging Chip stacking Thermal...

...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...

... thermal resistance of the thin bonded dielectric interface indicates that hybrid Cu/dielectric bonding is a promising technology to create 3D chip stacks with a low thermal die-to-die resistance. 1 Corresponding author. Contributed by the Electronic and Photonic Packaging Division of ASME...

... and silicon CMOS, so as to benefit from the afore described advantages offered by such an arrangement. Chip stacking Failure analysis Harsh environment Micro vias SOC Thermal analysis 14 06 2016 25 10 2016 Contributed by the Electronic and Photonic Packaging Division of ASME...

...Thomas Brunschwiler; Jonas Zürcher; Luca Del Carro; Gerd Schlottig; Brian Burg; Severin Zimmermann; Uwe Zschenderlein; Bernhard Wunderle; Florian Schindler-Saefkow; Rahel Stässle Heat dissipation from three-dimensional (3D) chip stacks can cause large thermal gradients due to the accumulation...

... . Manuscript received May 26, 2015; final manuscript received June 13, 2016; published online June 28, 2016. Assoc. Editor: Shi-Wei Ricky Lee. 26 05 2015 13 06 2016 3D packaging Chip stacking Failure analysis The three-dimensional integrated circuit (3D IC) is an emerging...

...Michael Fish; Patrick McCluskey; Avram Bar-Cohen As thermal management techniques for three-dimensional (3D) chip stacks and other high-power density electronic packages continue to evolve, interest in the thermal pathways across substrates containing a multitude of conductive vias has increased...

... , William Andrew , Norwich, NY , pp. 3 – 136 . [4] Johnson , R. W. , and Shen , Y. L. , 2015 , “ Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack ,” ASME J. Electron. Packag. , 137 ( 2 ), p. 021011 . 10.1115/1.4029345 [5...

... integration of two-phase cooling systems into next generation 3D chip stacks will require careful consideration of design parameters crossing multiple disciplines. The focus must not rest only on the global cooling problem, but must pay equal attention to addressing the localized variations in device power...

... of thermal expansion (CTE) were assessed for a chip stacking architecture. The microbumps for integrating four chips on a Si interposer were with a pitch size of 20  μ m and composed of 5  μ m Cu/3  μ m Ni/5  μ m Sn2.5Ag solder cap. A thermocompressive bonder was used to interconnect the microbumps at 280 °C...

... the interconnections ( 4 ). New regulations ban Pb in the solder for microelectronic, which leads to the introduction of new alloys for flip chip bonding that requires higher processing temperature compromising reliability of the packaged devices. flip chip bumping chip stacking chip on board manufacturing...