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Keywords: Composite
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 188–191.
Published Online: July 26, 2002
... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD May 3, 2001. Associate Editor: Z. Suo. 03 May 2001 26 07 2002 filled polymers particle reinforced composites thermal resistance packaging cooling Polymer...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2001, 123(3): 309–311.
Published Online: June 26, 2000
... Interface Thermal Contact Thermal Conductance Composite Silicone Polyethylene Glycol Sodium Silicate Boron Nitride Thermal contacts are commonly encountered. An example is the thermal contact between a printed circuit board and a heat sink 1 2 . The quality of a thermal contact...
