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Keywords: Current Stressing
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
Published Online: September 15, 2004
... migration, both electro and thermo), it is important to analyze the void nucleation modes in solder joints during current stressing and their relationship with the failure of these test modules. Besides the modules that experienced type 3 failure, there were other modules which also underwent void...
